An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.

Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.

This disclosure relates generally to a reusable actuating device utilizing multiple integrated planar shape memory alloy elements integrated with independent driver circuits and at least one return spring integrated onto a single multi-layer PCB with a novel layout to create an electrically and mechanically redundant integrated actuator solution uniquely suited for use in low-profile devices that can be utilized by themselves or as an initiator in a staged device to release higher loads. The apparatus of the invention is particularly useful for spacecraft and other vehicular actuation devices.

A medical device that includes a flexible body having a proximal end and a distal end, and an electrode positioned on the body proximate the distal end. The electrode is configured to provide an electrical charge for stimulating tissue. The medical device includes an electrical connection positioned on the body proximate the proximal end. The electrical connection is configured to electrically couple the electrode to a power source. The medical device includes an electrical lead connecting the electrode to the electrical connection. The lead is on or in the flexible body. The body is configured to have a first configuration prior to being secured to an exterior of a tube and a second configuration having a shape that conforms to a profile of the tube with the electrode secured to an exterior of the tube.

An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.

A self-transforming flexible film, according to an embodiment of the present invention, comprises: a substrate having flexible properties and a flexible electronic device attached thereon; shape memory alloys provided on one lateral side of the substrate; and photosensitizers for fixing the shape memory alloys to the substrate, wherein the shape memory alloys are arranged on the substrate in the form of a plurality of lines, the photosensitizers are disposed in plurality along the extension direction of each shape memory alloy, and the shape memory alloys can be fixed inside the photosensitizers and at a predetermined distance away from the substrate.

An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.