The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

A solder alloy contains 0.5 mass % or more and 1.25 mass % or less of Sb, In which satisfies 5.5≦[In]≦5.50+1.06[Sb] in a case of 0.5≦[Sb]≦1.0; and 5.5≦[In]≦6.35+0.212[Sb] in a case of 1.0<[Sb]≦1.25 (in the expression, [Sb] indicates the Sb content percentage (mass %) and [In] indicates the In content percentage (mass %)), 0.5 mass % or more and 1.2 mass % or less of Cu, 0.1 mass % or more and 3.0 mass % or less of Bi, and 1.0 mass % or more and 4.0 mass % or less of Ag. The remainder is formed from Sn.

In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2′) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film on the conductive layer, Affixing at least one electronic component on the Anisotropic Conductive Film, Embedding the electronic component in at least one insulating layer of prepreg material to obtain a semi-finished product, Laminating the semi-finished product to process the prepreg material and the Anisotropic Conductive Film.

A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.

A wiring substrate includes an insulating layer, a stack including wiring layers and photosensitive-resin insulating layers on a first surface of the insulating layer, a wiring layer on a second surface of the insulating layer, having a lower wiring density than the wiring layers, a metal core plate buried in the insulating layer and positioned on the stack side with respect to the center of the insulating layer in its thickness direction, and a via wiring buried in the insulating layer to have a first end face exposed at the first surface and joined to the lowermost one of the wiring layers, and a second end face joined to the metal core plate. The first surface and the first end face are substantially flush with each other. The wiring layers include a signal line, and a ground line concentrically formed around the signal line, with a predetermined interval therebetween.

A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order. When a cross section that is parallel to the thickness direction of the laminate is processed by means of ion milling and the cross sections of the metal layer 1 and the metal layer 2 were observed with EBSD, each of the metal layer 1 and the metal layer 2 has one or plural crystal grain(s) at the processed cross section, and an area ratio of the total area of crystal grains of which a difference in angle of the <100> crystal direction from a perpendicular of the processed cross section is 15° or less from among the one or plural crystal grains to the total area of the plural crystal grains was 15% or higher but less than 97% in the metal layer 1 and the metal layer 2.

A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.