A system and method for dissipating heat from a package and reducing interference between signaling pins is disclosed. The system includes a circuit substrate that includes a dielectric layer and at least one metal layer having an external surface. A plurality of metal posts is disposed on the external surface that function to a least one of dissipate heat from the circuit substrate, shield interfering signals between the signaling pins, and interact with mounting substrates on corresponding componentry. One or more metal posts are merged, increasing the interference shielding and heat dissipation functions of the metal posts.

The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu.sub.3P).

Embodiments of the present disclosure provide a bonding circuit board, one end of which is connected to a display panel, and the other end of which is connected to a host side; the bonding circuit board includes a first sub-section and a second sub-section, which may be bonded and connected to each other, the first sub-section includes at least three first printed circuit layers, which are stacked on one another, and an insulation layer is arranged between any two adjacent first printed circuit layers of the at least three first printed circuit layers; and the second sub-section includes one second printed circuit layer or two second printed circuit layers which are stacked on each other, and the insulation layer is arranged between the two second printed circuit layers.

The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu.sub.3P).

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more.

Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more.

A circuit board includes a plurality of insulators provided horizontally side by side and at least one first electric conductor. A first accommodating space is formed between two adjacent ones of the insulators, and each of the two adjacent ones of the insulators is provided with at least one fixing portion in the first accommodating space. The first electric conductor is accommodated in the first accommodating space, and is retained in the fixing portions of the two adjacent ones of the insulators only at two sides thereof. The first electric conductor in the circuit board is used to transmit signals and surrounded with air, and compared with the conventional circuit board in which signals are transmitted through a dielectric layer, a signal transmission effect with ultra-low signal attenuation can be achieved.

Embodiments of the present disclosure provide a bonding circuit board, one end of which is connected to a display panel, and the other end of which is connected to a host side; the bonding circuit board includes a first sub-section and a second sub-section, which may be bonded and connected to each other, the first sub-section includes at least three first printed circuit layers, which are stacked on one another, and an insulation layer is arranged between any two adjacent first printed circuit layers of the at least three first printed circuit layers; and the second sub-section includes one second printed circuit layer or two second printed circuit layers which are stacked on each other, and the insulation layer is arranged between the two second printed circuit layers.

A circuit board includes a plurality of insulators provided horizontally side by side and at least one first electric conductor. A first accommodating space is formed between two adjacent ones of the insulators, and each of the two adjacent ones of the insulators is provided with at least one fixing portion in the first accommodating space. The first electric conductor is accommodated in the first accommodating space, and is retained in the fixing portions of the two adjacent ones of the insulators only at two sides thereof. The first electric conductor in the circuit board is used to transmit signals and surrounded with air, and compared with the conventional circuit board in which signals are transmitted through a dielectric layer, a signal transmission effect with ultra-low signal attenuation can be achieved.