There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.

Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.