An electroplating method of a circuit board includes: providing a multi-layer board having a conductive layer embedded therein; penetratingly forming a thru-hole and at least one penetrating hole in the multi-layer board, and forming a conductive portion on an inner wall defining the thru-hole and connected to the conductive layer, wherein the at least one penetrating hole is located at one side of the thru-hole, and an annular portion of the conductive layer exposed from the at least one penetrating hole is defined as an electroplated region; and electroplating the electroplated region to be formed with a metal post by applying a current to the conductive portion, wherein the metal post is filled in the at least one penetrating hole and is connected to the electroplated region.

A printed circuit board including at least one blind metal-plated hole, for receiving a pin of the printed circuit board being covered by a first layer of a protective film on which there extends a second layer of electrically insulating flexible material, the first layer and second layer are for piercing by the pins when they are engaged in the metal-plated holes, the first and second layers being for claming between a support of the pins and the printed circuit board. An electronic unit including such a device. A method of fabricating a printed circuit card for such a device.

The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.

A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.

Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

A printed circuit board includes a base layer, a first conductive pattern, and a first surface treatment patterned layer formed on a portion of a surface of the first conductive pattern. The first conductive pattern includes a first copper foil layer on one side of the base layer and a first conductive layer on a portion of a surface of the first copper foil layer. The first conductive pattern which is covered by the first surface treatment patterned layer has sidewalls obliquely tilted with respect to the base layer. The first conductive pattern covered with the first surface treatment patterned layer has a cross section that is trapezoidal shaped, and a width which gradually decreases from the base layer to the first conductive layer.

A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L.sub.0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume V.sub.h of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L.sub.1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L.sub.0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume V.sub.h of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L.sub.1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.