The present invention provides a locking mechanism in a mobile terminal and a method of manufacturing the same. The locking mechanism comprises a slider, latch, button, and spring. The slider and latch include openings and may translate between a locked position and an unlocked position. The latch may include a protrusion that limits the translation of the slider and the latch when in the locked position. The button is located within the opening of the slider and the opening of the latch, and the spring member is fixed adjacent the latch. In an instance in which an external force is applied to the button, the external force deforms the spring member such that contact between a vertical edge of the protrusion and the spring is precluded allowing translation of the slider and the latch between the locked position and the unlocked position.

A modularly expandable enclosure including a top end plate, a bottom end plate, and one or more elongated tray modules. The top end plate, the bottom end plate and the tray modules define an interior space of the enclosure. Opposite vertical ends of each tray module define an upper end connecting portion and a lower end connecting portion. The upper end connecting portion is configured for engagement with the top end plate and further configured for engagement with a lower end connecting portion of a vertically upwardly adjacent module tray. The lower end connecting portion is configured for engagement with the bottom end plate and further configured for engagement with an upper end connecting portion of a vertically downwardly adjacent tray module.

A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

Display modules have a plurality of light emitting elements arranged in a predetermined pattern and providing a highly uniform visual effect. Methods are provided to support a plurality of flexible display modules in an adjustable curved arrangement. Alignment and complementary alignment features enable the alignment of adjacent display modules and the creation of large displays from a plurality of aligned display modules. Features to couple to and retain a support frame are provided. Flexible and durable weather resistance features are provided. A system of modular support frames works cooperatively with the display modules, adapting to different mounting environments, and thereby providing large modular displays with desirable properties.

A housing device having a pull-type locking and release structure includes a housing (110) and a locking and release member (150). The housing (110) includes two lateral walls (130), a breach (132) formed on each of the lateral walls (130), and an elongated groove (134) formed along each of the lateral walls (130), a pivot hole (136) formed on each of the lateral walls (130). The locking and release member (150) includes two arms (152) disposed in the two elongated grooves (134), a rod (156) connected to the two arms (152), a resilient element (160) disposed at each of the arms (152), a connection element (170) connected to each of the arms (152), a fastening element (180) connected to each of the connection elements (170), and a pivot (182) protruding from each of the fastening elements (180). The pivot (182) is pivotally connected to the pivot hole (136).

Systems and methods of controlling operation of a connection device associated with a modular computing system are disclosed. For instance, data indicative of a connection between a first connection device and a second connection device can be obtained. The first connection device can be associated with a modular computing device, and the second connection device can be associated with a modular component to be implemented within the modular computing device. Each connection device can include a plurality of connector elements. Data indicative of one or more configuration parameters of the second connection device can be obtained. An operating configuration of the first connection device can be determined based at least in part on the data indicative of the one or more configuration parameters. Operation of the first connection device can be controlled based at least in part on the operating configuration.

An electrical module contains at least one electrical component which is accommodated in a module housing. The module housing has at least two housing parts which lie one on the other and, on their own or together with one or more further housing parts of the module housing, delimit the interior of the module housing. There is at least one adhesive layer between the two housing parts, the adhesive layer adhesively bonding the two housing parts to one another.

An electronic equipment item for an electronic system, comprising a housing, a backplane board, at least one daughterboard and at least one lightning protection board housed in the housing. A connector is fixed to the backplane board and configured to be connected to the rest of the electronic system. For each daughterboard there is provided one lightning protection board. For each lightning protection board, a first port is arranged to connect the lightning protection board to the backplane board, and a second port is arranged to connect the daughterboard to the lightning protection board.

Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.

A subrack including a frame defining a subrack space and adapted to receive a device module to an operative position, the frame comprising four side walls and an end wall. The subrack comprises a coupling system adapted for coupling the subrack to four other subracks in order to form a subrack matrix, the coupling system comprising at least one wall recess on an inner surface of each of the side walls, and at least one primary screw hole in each of the side walls such that the at least one primary screw hole is located in the at least one wall recess.