Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.

The present invention provides an electronic device including a replaceable module and a sliding fastener. The replaceable module is provided with a first sliding track on one side thereof. The sliding fastener includes a body, which is provided with a second sliding track connected to the first sliding track. The body is provided with a latch, a handle is extended from the body, and a groove is traversely disposed at a joint between the body and the handle. The sliding fastener is elastically bendable along the groove, such that the handle is enabled to turn along the groove relative to the body so as to be adhered to or erected on a surface of the replaceable module.

A baffle assembly includes a frame, a protruding piece and a baffle structure. The frame is configured to accommodate some expansion cards. The frame includes a first surface and a second surface adjacent to the first surface. The first surface has an opening configured to allow the expansion cards to enter into the frame. The protruding piece protrudes from the first surface. The baffle structure includes a first blocking plate and a second blocking plate. The first blocking plate is configured to abut against the first surface and at least partially cover the opening. The first blocking plate has a through hole. The through hole extends along a first direction. The protruding piece at least partially penetrates through the through hole. The second blocking plate is connected with the first blocking plate along the first direction and is configured to abut against the second surface.

A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a transition slot. The connecting member is connected to the liquid cooling system. The connecting member is used for connecting an external device, such that the liquid cooling system performs liquid cooling function for dissipating heat of the external device. The power supply unit is electrically connected to the transition circuit board and the liquid cooling system. The power supply unit includes an electric connector. The electric connector is used for connecting the external device, such that the power supply unit supplies power to the external device.

An electronic device with a seal member is provided. The electronic device includes a tray configured to slide in and out of the electronic device, an opening, (e.g., a hole) formed at one side of the tray, for communicating outside of the electronic device, a socket disposed in the electronic device, the tray slides into or from the socket, and a seal member, disposed between the opening and the socket, for performing a waterproof and dustproof function. Various types of the seal member may be implemented.

An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.