A modular data centre unit is provided comprising: at least one module, each module defining an interior space, intended to house computing equipment mounted on racks or cabinets; and at least one cooling module configured to cool the inner space of the at least one module, wherein the at least one module is configured to enable horizontal and/or vertical arrangement in which a plurality of modules are arranged adjacent to one another.

A floor system in a server room includes a main panel and a sub-panel. The main panel includes main panel inlaid cables and main panel connectors where the main panel inlaid cables connect a first set of the main panel connectors to a second set of the main panel connectors. The sub-panel includes sub-panel inlaid cables and sub-panel connectors where the sub-panel inlaid cables connect the sub-panel connectors to one another. The floor system provides an operating floor via the main panel and the sub-panel where the operating floor is raised relative to a sub-floor and the main panel is a removable floor panel to access a space between the operating floor and the sub-floor. The main panel inlaid cables and the sub-panel inlaid cables establish a current pathway from a power source.

A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

A modular enclosure for housing various computing devices is provided. The modular enclosure includes a platform and a housing module mounted on the base module. The housing module has lateral sides, a front side, a rear side and a roof defining an interior volume for receiving the various computing devices and fan cassettes. Each fan cassette is provided with its own controller which is configured to adjust the rotational speed of the fan based on the power consumption of the one or more computing devices. When connected in a cluster, the fan cassettes provide a N+1 redundancy, wherein each cassette as an adjacent fan cassette configured as an active backup. The fan cassettes of a cluster communicate via a communication bus. The fan cassettes may include dampers to redirect air drawn from the computing devices back toward them in cold whether conditions, or toward the outdoors, in hot weather conditions.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

The invention is directed to a portable container system comprising a container which comprises a floor, four upwardly-extending sidewalls, wherein at least one of the sidewalls is hinged to allow the at least one sidewall to open outwardly, and a top wall. The system also comprises a plurality of skids contained within the container. Each skid comprises a base and one or more upwardly extending members; and one or more cabinets mounted on the base or one or more upwardly extending members, wherein the one or more cabinets comprise: control power distribution panel cabinets, human-machine interface cabinets, programmable logic controller-redundancy cabinets, network cabinets, or remote I/O cabinets.

Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

Systems include one or more critical datacenter connected to behind-the-meter flexible datacenters. The critical datacenter is powered by grid power and not necessarily collocated with the flexboxes, which are powered “behind the meter.” When a computational operation to be performed at the critical datacenter is identified and determined that it can be performed at a lower cost at a flexible datacenter, the computational operation is instead routed to the flexible datacenters for performance. The critical datacenter and flexible datacenters preferably shared a dedicated communication pathway to enable high-bandwidth, low-latency, secure data transmissions.

According to one embodiment, a data center air cooling system includes a first information technology (IT) room and a second IT room, each with electronic racks with one or more pieces of IT equipment. The system includes an air cooling unit that provides cooling air into an air chamber, which supplies the cooling air to the first IT room. The system includes an air duct system that supplies the cooling air from the air chamber to the second IT room and returns warmed air from the first IT room and the second IT room to the air cooling unit. The system includes several louvers that are each arranged to open and close independently and in different combinational modes to create several airflow management modes for cooling pieces of IT equipment in the first IT room, in the second IT room, or a combination thereof.

A configurable data center platform includes an enclosure configured to affix to a support structure, the enclosure configured for housing one or more processing systems that form a data center, one or more transceivers configured to enable the one or more processing systems to communicate with one or more remote devices, one or more sensors; and an electrical power distribution subsystem configured to condition a received electrical current to one or more conditioned electrical currents that power the one or more processing systems and the one or more sensors, wherein the enclosure comprises a cooling system that removes heat from the one or more processing systems and the one or more sensors.