A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.

A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.

An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400 C. to 1000 C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100 C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

The present disclosure provides a capacitor package structure and an antioxidation electrode foil thereof. The antioxidation electrode foil includes a base layer, a conductive film structure, and an antioxidation film structure. The base layer has a top surface and a bottom surface. The conductive film structure includes a plurality of first conductive film layers. The antioxidation film structure includes a plurality of first antioxidation film layers. The first conductive film layers and the first antioxidation film layers are alternately stacked on top of one another and disposed on the top surface of the base layer.

A reference foil comprises an unsymmetric marker foil device which advantageously includes spatially separated pieces of a marker material foil in unsymmetric arrangement and/or at least one unsymmetric integral piece of the marker material foil. The reference foil and a carrier device for the same may be used for example in image-guided surgery.

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f.sub.3t.sub.3)/(f.sub.2t.sub.2)=>1 wherein t.sub.2 (mm) is a thickness of the copper foil, f.sub.2 (MPa) is a stress of the copper foil under tensile strain of 4%, t.sub.3 (mm) is a thickness of the resin layer, f.sub.3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f.sub.1/(FT) wherein f.sub.1 (N/mm) is 180 peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 g/dm.sup.2. is formed on a surface of the copper foil on which the resin layer is not laminated.