A proximity sensor includes a lead supported on an outer surface of a case structure and a sensor wire that extends from the lead and through an opening in the case structure. The sensor is formed by applying alternating layers of electrically conductive and non-conductive materials in a non-cured state. A base non-conductive layer is applied to an inner surface of the case structure around the sensor wire in a non-cured state. Once cured, a conductive layer is deposited onto the base non-conductive layer and encapsulates the sensor wire. A cover non-conductive layer is then deposited over portions of the conductive layer to insulate the conductive layer. Portions of the non-conductive layer are then removed such that an area of the conductive layer is exposed to define a sensor area.

A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed.

The present disclosure relates to methods of fabricating electronic devices or components thereof. The electronic devices can be vacuum electronic devices. The methods can include disposing a first material on or in a substrate. The methods can further include removing a portion of the first material to form one or more structure protruding from the substrate. The methods can further include disposing a second material onto the one or more structure of the first material, and then removing a portion of the second material to form one or more sidewall structures. A second portion of the one or more structures of the first material can also be removed to form a fabricated structure including the substrate and one or more sidewall structures protruding therefrom.

The present invention provides for an electroactive device having a first conductive layer, a second conductive layer, and one or more electroactive layers sandwiched between the first and second conductive layers. One or more adjacent layers of the electroactive device may include a physical separation between a first portion and a second portion of the adjacent layers, the physical separation defining a respective tapered sidewall of each of the first and second portions. The one or more adjacent layers may include one of the first and second conductive layers. The remaining layers of the electroactive device may be formed over the physical separation of the one or more adjacent layers. The remaining layers may include the other of the first and second conductive layers.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Sensor systems are described that are designed to be integrated with gloves for the human hand. An array of sensors detects forces associated with action of a hand in the glove, and associated circuitry generates corresponding control information that may be used to control a wide variety of processes and devices.

This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer having a first dielectric material layer and a first metal wire protruding from the first dielectric material layer; a conductive pillar layer formed on the first wiring layer and including a molding compound layer, a second dielectric material layer formed on the molding compound layer, and a metal pillar connected to the first metal wire; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.