Provided is a method of manufacturing a wire with a terminal, the wire with a terminal including a wire, a metal terminal, and a sealing member obtained by curing an anti-corrosive material, the method using a manufacturing apparatus for the wire with a terminal including a transparent mold including a cavity portion, and a protruding portion that protrudes into the cavity portion, the method including an introducing step of placing, in the cavity portion, a non-sealed wire with a terminal before including the sealing member including the wire and the metal terminal, and introducing the anti-corrosive material into the cavity portion; and an irradiating step of irradiating the anti-corrosive material in the cavity portion with ultraviolet light through the transparent mold.

A method of forming a resonator includes forming top and bottom dielectric structures over a substrate. A piezoelectric layer is formed between the top and bottom dielectric structures. A bottom electrode is formed between the piezoelectric layer and the bottom dielectric structure, and a top electrode is formed between the piezoelectric layer and the top dielectric structure. A metal layer is formed over the top dielectric structure and is patterned, thereby forming a first contact pad making electrical contact to the top electrode, a second contact pad making electrical contact with the bottom electrode, and a mass bias located over the top dielectric structure.

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

Intravascular devices, systems, and methods are disclosed. In some instances, the intravascular device is a guide wire with electrical conductors embedded within a core wire. In some instances, the electrical conductors are coupled to conductive bands adjacent a proximal portion of the guide wire and a sensing element adjacent a distal portion of the guide wire. Methods of making, manufacturing, and/or assembling such intravascular devices and associated systems are also provided.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer.

A device for measuring a physiological parameter of a user carrying the device that includes a sensor having at least two sensor elements for detecting a sensor signal, a carrier configured to carry the sensor, and electrical contacts of the sensor elements that lead on, into or through the carrier. One or more frames carried by the carrier are formed around the sensor and/or the individual sensor elements, and an insulator material is filled between the one or more frames and the sensor and/or the sensor elements surrounded by a respective frame without covering a top surface of a respective sensor element facing away from the carrier.

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.