When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic components are installed on the component pallets for installation, which determines the types of the electronic components installed on the component pallets based on planned multiple jobs continuously performed by multiple electronic component mounting machines to which the component pallets are attached and an execution order for the jobs such that the number of the component pallets exchanged during job switching is minimized.

A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

A battery retention system is configured to facilitate insertion and removal of batteries from an electronic device. The electronic device includes a housing that defines a battery cavity for receiving a battery. The battery cavity has a floor. A floor contact extends from the floor. The floor contact is configured to provide a biasing force to push the battery away from the floor of the battery cavity. The housing has tabs extending into the battery cavity to hold the battery in the battery cavity against the biasing force of the floor contact. The battery cavity has a recess that allows the battery to move in a lateral direction along the floor to a position where the battery disengages from at least one of the tabs to allow at least a portion of the battery to be pushed out of the battery cavity by the biasing force of the floor contact.

A plurality of signal terminals are disposed in parallel and comprise an embedded part embedded and held in a base member of insulating material and a protruding part that protrudes from the base member, the protruding part forms a connecting part that is electrically connected by contacting or solder-connecting to a mating connecting body, the base member comprises a main body holding part that covers the entire circumference of the circumferential surface of the signal terminals and holds the signal terminals, and a semi-exposed holding part that exposes a portion of the circumferential surface of the signal terminals while covering and holding the remaining portion, with the protruding part of the signal terminals protruding from the semi-exposed holding part with regard to the main body holding part.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.