Patent classifications
Y10T403/20
Disconnect housing for use in automation systems
A disconnect housing for selectively receiving a tooling boom is disclosed. The disconnect housing is configured with a sensor to indicate when a predetermined amount of force sufficient to retain the tooling boom therein has been applied so as to indicate operability of a handling system.
METHOD OF DETERMINING WEAR IN A BEARING SURFACE
A method of determining an amount of wear in a spherical working surface of a bearing ring of a spherical plain bearing, the method including providing a reference groove of predetermined depth in an unworn working surface, using the reference groove and axial end faces of the bearing ring as reference surfaces for centering and aligning a measuring tool. The tool having a first surface, and a protrusion that extends from the first surface in radial direction and is adapted to fit into the reference groove and two or more radial openings that extend from a second surface of the tool. Determining the amount of wear by measuring the radial distance to the spherical working surface through each of the radial openings and comparing the measured value with a reference value measured using the tool for an unworn working surface comprising a reference groove of the same predetermined depth.
Wafer-to-wafer alignment method
A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
Indication bolt for monitoring adhesive bonds in structural elements
A structural element includes a first component and a second component; a bonded joint, by which the first component and the second component are interconnected; and an indication bolt, which is fixed to the first component and the second component. The indication bolt is designed to indicate when the first component and the second component have moved relative one another.
Overload protection device for cable strands
An overload protection device for cable lines, and in particular in cranes, is provided, having at least one electronic overload safety means. The overload protection device is provided to prevent any kind of damage which can be caused by an overload. That is achieved by providing a mechanical or magnetic overload protection device (1) in addition to the electronic overload safety means. The overload protection device (1) is integrated into the cable line or arranged at the cable fixing point and responds when a permissible cable tension force is exceeded and implements a cable extension.
Structure for fastening verification
An apparatus for a fastening verification structure includes a fastener disposed in a cavity, where a leading end of the fastener is configured to press a non-insulated contact pad. The first end of a first lead electrically coupled to the fastener and a second end of the first lead electrically coupled to a power source. The first end of a second lead electrically coupled to the non-insulated contact pad and a second end of the second lead electrically coupled to a visual indicator. The first end of a third lead electrically coupled to the visual indicator and a second end of the third lead electrically coupled to the power source.
Semi-circular alignment features of an elastic averaging alignment system
A semi-circular male alignment feature elastic averaging alignment system utilizing a plurality of semi-circular male alignment features which interface by elastic averaging with a plurality of female alignment features, wherein semi-circular male alignment features of a first component are received during a mating process by respective female alignment features formed in a second component, whereby precise alignment of the first and second components and stiffness are provided by elastic averaging of the male and female alignment features.
Attachment arrangement and installation method
An arrangement for attaching a system to a structure having a base element to retain the system, a positioning element to position the base element at a location on the structure and a fixation device to fix the base element at the location on the structure. The base element has a section for holding the system and a section for being clamped to the structure. The clamping section has an element for alignment on the positioning element. The positioning element has a surface for being bonded to the structure and a positioning section for acting together with the alignment element. The fixation device has a counter element with a clamping area for being positioned on an opposite side of the structure from the clamping section and a fastener for clamping the base element and the counter element to the structure. An installation method for such an attachment arrangement is provided.
Bicycle seatpost assembly
A bicycle seatpost assembly comprises a first cylinder, a second cylinder, a positioning structure, and a mechanical position informing structure. The second cylinder is configured to be telescopically received in the first cylinder. The positioning structure is configured to relatively position the first cylinder and the second cylinder such that a positional relationship between the first cylinder and the second cylinder is continuously adjustable within an adjustable position range of the bicycle seatpost assembly. The mechanical position informing structure is configured to inform a user that at least one of the first and second cylinders reaches a reference position. The reference position is defined between a maximum-length position and a minimum-length position of the adjustable position range.
WAFER-TO-WAFER ALIGNMENT METHOD
A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.