Y10T428/12847

Chromium-based coating, a method for producing a chromium-based coating and a coated object
11371156 · 2022-06-28 · ·

A chromium-based coating including chromium (Cr), carbon (C) and iron (Fe), Cr being electroplated from a trivalent Cr bath. The coating is further includes nickel (Ni) electroplated from the Cr bath having at least 20 mg l−1 Ni cations, in that C is at least partially in the form of at least one chromium carbide compound, in that the coating has been heat-treated at a temperature of 400-1,200° C., and in that the hardness of the coating is at least 1,500 HV on a Vickers microhardness scale as measured according to standard SFS-EN ISO 4516. A method for producing a coating and to a coated object is also disclosed.

Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Composite coating and fabrication method thereof

The present disclosure provides a composite coating and a method for fabricating the composite coating. The composite coating comprises a polymer layer, a metal interlayer and an amorphous metal coating. The polymer layer is formed on a substrate and acts as a diffusion barrier layer, which is thick and dense enough to prevent the corrosive substances from penetrating into the substrate. The metal interlayer is formed between the polymer layer and the amorphous metal coating for improving the adhesion of the amorphous metal coating to the substrate.

Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Electro-spark deposition of molybdenum on stainless steel and products thereof
11130190 · 2021-09-28 · ·

Molybdenum is alloyed into stainless steel surface by electro-spark deposition technique. Shielding gas is used during electro-spark deposition process to minimize the oxidation of materials. Control of electro-spark voltage, frequency, capacitance, time can determine the alloying depth of Molybdenum. The alloyed surface thickness varies from 5 μm to 80 μm depending on the electro-spark deposition parameters. The alloyed surface comprises, by weight, 15 to 40% of Molybdenum, 8 to 22% of Cr, 0-15% of other alloy elements and impurities. The molybdenum alloyed stainless steel surface exhibits improvement in micro-hardness, wear resistance, and especially corrosion resistance in sodium chloride solutions. Thus, the present invention would be utilized in marine and handling of brines application, as well as in other applications which better corrosion resistance of stainless steel is desired.

Trivalent chromium-containing composition for aluminum and aluminum alloys
11085115 · 2021-08-10 · ·

A low sludge trivalent chromium based conversion coating bath is provided which forms corrosion resistant coatings on aluminum and aluminum alloys by contact with the bath, which is suitable for use as a rinseable or dry-in place conversion coating for metal, that comprises trivalent chromium cations, fluorometallate anions, guanidinium ions and at least one organic anti-corrosion additive, and other optional components, as well as methods of making and using same, and metals coated using the compositions, the coated aluminum serving as an effective base for paint primers.

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Metallic material and connection terminal

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Coated article for hot hydrocarbon fluid and method of preventing fuel thermal degradation deposits

A hydrocarbon fluid containment article having a wall with a surface that is wetted by hydrocarbon fluid. The surface includes an anti-coking coating. The anti-coking coating includes a copper salt, a silver salt, or a combination thereof. A gas turbine engine component including a wall having a first surface and an anti-coking coating on the first surface of the wall that is wetted by hydrocarbon fluid. The anti-coking coating including a copper salt, a silver salt, or a combination thereof that prevents the formation of gum or coke on a surface thereon. Methods for reducing the deposition of thermal decomposition products on a wall of an article are also provided.

COPPER-CLAD LAMINATE

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.