Patent classifications
Y10T428/2852
Adhesive for electronic component
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
Reactive conductive pressure-sensitive adhesive tape
A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.
Radiation-curable mixture containing low-molecular, ethylenically unsaturated compounds having non-aromatic ring systems
A mixture having (A) a polymer obtain by polymerizing at least one free-radically polymerizable compound; and (B) at least one compound having at least one ethylenically unsaturated, free-radically polymerizable group and having a weight-average molecular weight Mw of less than 5000 g/mol, wherein at least 10% by weight of compounds (B) are one or more compounds B1 with at least one nonaromatic ring system.
PRESSURE-SENSITIVE ADHESIVES INCLUDING EXPANDABLE GRAPHITE
A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.
Waterproof sheet for use in bridge pier repair and waterproof working method using the same
When a bridge pier is reinforced or repaired by wrapping a reinforcement around the pier, a waterproof sheet having a sufficient flexibility to attach to and cover the interface between the pier and the reinforcement in a liquid-tight manner is useful. The waterproof sheet is attached to the interface between the pier and the reinforcement to prevent water from penetrating into the interface for thereby preventing the reinforcement from deterioration.
Damping adhesive
Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional nanoparticles dispersed therein. The nanoparticles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FROM THE SAME
A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.
Adhesive compositions that contain adhesive polymer and carbon nanotubes, and related products and methods
Described are adhesive compositions that contain adhesive polymer and carbon nanotubes; devices (e.g., electronic devices and electronic device enclosures) and compositions that include one of these adhesive compositions; and uses of such adhesive compositions as part of an electronic device.
Self adhesive fouling release coating composition
A multilayer self-adhesive fouling release coating composition includes an optional removable underlying liner; an adhesive layer applied over and to the optional underlying liner when the latter is present; and a synthetic material layer applied over and to the adhesive layer. Optionally, an intermediate silicone tie coat is applied over and to the synthetic material layer. A silicone fouling release top coat is applied over and to the synthetic material layer, or, when present, over and to the intermediate silicone tie coat. Optionally, a removable polymeric film is applied over and to the fouling release top coat.
Damping adhesive
Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional particles dispersed therein. The particles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.