CERAMIC HEATER WITH SHAFT

Abstract

A ceramic heater with a shaft includes: a ceramic plate in which a resistance heating element is embedded; a hollow ceramic shaft having an upper end bonded to a surface on an opposite side of a wafer placement surface of the ceramic plate; and a shaft heater embedded in a side wall near an upper end of the ceramic shaft.

Claims

1. A ceramic heater with a shaft, comprising: a ceramic plate in which a resistance heating element is embedded; a hollow ceramic shaft having an upper end bonded to a surface on an opposite side of a wafer placement surface of the ceramic plate; and a shaft heater embedded in a side wall near the upper end of the ceramic shaft.

2. The ceramic heater with a shaft according to claim 1, wherein the ceramic shaft has a cylindrical shaft body, and an insulating film that covers a side surface near the upper end of the shaft body, and the shaft heater is provided on the side surface near the upper end of the shaft body, and is embedded in the ceramic shaft by being covered with the insulating film.

3. The ceramic heater with a shaft according to claim 2, wherein the insulating film is an aerosol deposition film or a thermal spray film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is a vertical cross-sectional view of a ceramic heater with a shaft of the present embodiment.

DETAILED DESCRIPTION OF THE INVENTION

[0011] A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a vertical cross-sectional view of a ceramic heater with a shaft of the present embodiment.

[0012] As illustrated in FIG. 1, the ceramic heater with a shaft includes a ceramic plate, a ceramic shaft, and a shaft heater. A resistance heating element is embedded in the ceramic plate. The resistance heating element is designed so that when it is energized, the section, bonded to the ceramic shaft, of the whole ceramic plate has a temperature lower than that of the part other than the section. The resistance heating element is energized through a power supply rod embedded in the inner space of the ceramic shaft. The resistance heating element may be provided in each of multiple zones of the ceramic plate. The ceramic shaft is a hollow shaft which is bonded to the surface on the opposite side of the wafer placement surface of the ceramic plate by direct bonding. The ceramic shaft has a cylindrical shaft body, and an insulating film that covers the side surface near the upper end of the shaft body. The shaft heater is a resistance heating element embedded in the side wall near the upper end of the ceramic shaft. Herein, the shaft heater is provided on the side surface near the upper end of the shaft body by printing or plating, and is embedded in the ceramic shaft by being covered with an insulating film (for example, an alumina film). It is preferable that the insulating film be an aerosol deposition (AD) film or a thermal spray film. Particularly, an AD method (including a plasma AD method) is suitable for forming a thin film of fine ceramic particles with high accuracy. In addition, the AD method allows a film of ceramic particles to be formed by an impact consolidation phenomenon, thus it is not necessary to sinter ceramic particles at a high temperature. The shaft heater may be energized through a power supply rod housed in the inner space of the ceramic shaft, or energized through a power supply rod embedded in the side wall of the ceramic shaft.

[0013] In the ceramic heater with a shaft of the present embodiment described above, the shaft heater embedded in the side wall near the upper end of the ceramic shaft can be controlled independently of the resistance heating element embedded in the ceramic plate. Therefore, it is possible to reduce the variation in temperature between the section bonded to the ceramic shaft and the part other than the section.

[0014] Note that at least one of an electrostatic electrode and an RF electrode may be embedded in the ceramic plate.

[0015] The present invention is not limited to the above-described embodiment, and can be carried out by various modes as long as they belong to the technical scope of the invention.

[0016] The present application claims priority from Japanese Patent Application No. 2019-122788, filed on Jul. 1, 2019, the entire contents of which are incorporated herein by reference.