Method For Mounting SMD Components On Contact Springs In Electric Motors

Abstract

A method for mounting SMD components on contact springs in electric motors. In a first method variation, the SMD component is mounted on the base of a carrier of the electric motor, which has already been provided with a contact spring protruding into a cavity. As the SMD component is installed, the contact spring is pressed back such that no frictional or sliding contact arises during installation. In a second variation, the SMD component is mounted first and then a contact spring is inserted using a press tool. As the contact spring is inserted, the spring is held back such that likewise no frictional or sliding contact arises with the SMD component that has already been installed. This avoids damage to the SMD component caused by the contact spring during installation.

Claims

1.-7. (canceled)

8. A method for mounting SMD components on at least one projecting contact spring comprising: gripping an SMD component to be mounted on a base of a support using a gripping and mounting tool; moving the SMD component over a mounting point on the support; pushing back the at least one projecting contact spring using a pusher; arranging the SMD component on the base of the support; removing the gripping and mounting tool; and removing the pusher.

9. A method for mounting SMD components on at least one contact spring of a component comprising: gripping an SMD component to be mounted on a base of a support of the component using a gripping and mounting tool; arranging the SMD component on the base of the support; pressing a device holding the at least one contact spring onto a component of the device using a pressing tool and simultaneously holding back the at least one contact spring using a pusher; d. removing the pressing tool and the pusher; and f. removing the gripping and mounting tool.

10. The method as claimed in claim 8, wherein the SMD component is arranged in a cavity of the support into which the at least one contact spring projects.

11. The method as claimed in claim 10, wherein a pressing tool is used on which the pusher is arranged.

12. The method as claimed in claim 8, wherein the SMD component is moved onto its mounting point until it touches fixed lead frame contacts.

13. The method as claimed in claim 8, wherein a pusher pin is used as a pusher.

14. The method as claimed in claim 8, wherein the method is performed simultaneously with multiple SMD components to be mounted.

15. The method for mounting SMD components on at least one contact spring as claimed in claim 8, wherein the at least one contact spring is in an electromotor.

16. The method for mounting SMD components as claimed in claim 9, wherein the component is an electromotor.

17. The method as claimed in claim 9, wherein the SMD component is arranged in a cavity of the support into which the at least one contact spring projects.

18. The method as claimed in claim 17, wherein a pressing tool is used on which the pusher is arranged.

19. The method as claimed in claim 9, wherein the SMD component is moved onto its mounting point until it touches fixed lead frame contacts.

20. The method as claimed in claim 9, wherein a pusher pin is used as a pusher.

21. The method as claimed in claim 9, wherein the method is performed simultaneously with multiple SMD components to be mounted.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The invention is explained in detail below with the aid of an exemplary embodiment in conjunction with the drawings, in which:

[0031] FIG. 1 is a schematic view of the mounting of an SMD component according to a first embodiment of the invention; and

[0032] FIG. 2 is a schematic view of the mounting of an SMD component according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS

[0033] FIG. 1 shows schematically a plastic brush holder of an electromotor that has a cavity 1 open at the top into which it is intended for an SMD component 2 to be mounted, and a support 5. A contact spring 3, already mounted on the support 5 and via which it is intended for electrical pressure contact to be established with the SMD component 2 to be installed, projects into the cavity 1. The SMD component 2 is gripped by a gripping and mounting tool and arranged above the cavity 1. The already previously installed contact spring 3 is pushed back by a pin designed as a pusher 4 so far that no friction or sliding contact with the contact spring 3 occurs when the SMD component 2 is inserted into the cavity 1. In FIG. 1, the pusher 4 is shown in a position shortly before the contact spring 3 is pushed back.

[0034] After the SMD component 2 has reached its final position, the gripping and mounting tool (not shown) and the pusher 4 are removed again. The contact spring 3 therefore moves into the untensioned position shown in FIG. 1 in which it contacts with pressure the installed SMD component 2.

[0035] In the variant of the method shown schematically in FIG. 2, the SMD component 2 is first arranged in the cavity 1 of the support 5, after which the contact spring 3 is mounted. The SMD component 2 is hereby likewise moved into the cavity 1 using a gripping and mounting tool and is then moved horizontally to the left. In the drawing until the SMD component 2 touches the fixed lead frame contacts (not shown). A device 8 (shown only schematically) holding the contact spring 3 is then pressed onto the portion 7 of the brush holder of the motor using a pressing tool 6. In this process, the contact spring 3 is simultaneously pushed back and held back by a pusher 4, arranged on the pressing tool 6, in the form of a pin so that no friction or sliding contact with the already previously installed SMD component 2 occurs when the spring is installed. When the pressing tool 6 is removed, the pusher 4 is simultaneously moved upward with it so that the contact spring 3 can assume its untensioned end position in which it makes pressure contact with the installed SMD component 2.

[0036] In both variants of the method, gentle treatment of the SMD component 2 therefore takes place during the installation.

[0037] Thus, while there have shown and described and pointed out fundamental novel features of the invention as applied to a preferred embodiment thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those elements and/or method steps which perform substantially the same function in substantially the same way to achieve the same results are within the scope of the invention. Moreover, it should be recognized that structures and/or elements and/or method steps shown and/or described in connection with any disclosed form or embodiment of the invention may be incorporated in any other disclosed or described or suggested form or embodiment as a general matter of design choice. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.