METHOD AND SYSTEM FOR GAS TEMPERATURE MEASUREMENT
20170276622 · 2017-09-28
Inventors
Cpc classification
G01N25/00
PHYSICS
G01K13/02
PHYSICS
International classification
Abstract
A multi-function gas temperature measurement probe includes an outer casing, at least one high-temperature thermocouple inserted within the outer casing, at least one gas emissions sampling aperture defined within the outer casing, and at least one thin filament coupled to the outer casing. The at least one high-temperature thermocouple, the at least one gas emissions sampling aperture, and the at least one thin filament are proximate to each other.
Claims
1. A multi-function gas temperature measurement probe comprising: an outer casing; at least one high-temperature thermocouple inserted within said outer casing; at least one gas emissions sampling aperture defined within said outer casing; and at least one thin filament coupled to said outer casing, wherein said at least one high-temperature thermocouple, said at least one gas emissions sampling aperture, and said at least one thin filament are proximate to each other.
2. The measurement probe in accordance with claim 1, wherein said outer casing comprises a high-temperature alloy.
3. The measurement probe in accordance with claim 1 further comprising at least one cooling fluid inlet conduit and at least one cooling fluid outlet conduit.
4. The measurement probe in accordance with claim 3 further comprising a cooling fluid shell coupled to said outer casing, said cooling fluid shell defining at least one cooling fluid plenum therein, said at least one cooling fluid plenum coupled in flow communication with said at least one cooling fluid inlet conduit and said at least one cooling fluid outlet conduit.
5. The measurement probe in accordance with claim 1 further comprising at least one translation device coupled to said outer casing.
6. The measurement probe in accordance with claim 1, said outer casing comprising at least one thin filament standoff configured to secure said at least one thin filament.
7. The measurement probe in accordance with claim 1 further comprising a plurality of gas emissions sampling apertures, wherein said plurality of gas emissions sampling apertures comprises said at least one gas emissions sampling aperture, said plurality of gas emissions sampling apertures configured to facilitate generating gas species concentration measurements of at least a portion of a high-temperature combustion gas stream.
8. A gas temperature measurement system comprising: at least one multi-function gas temperature measurement probe comprising: an outer casing; at least one high-temperature thermocouple inserted within said outer casing; at least one gas emissions sampling aperture defined within said outer casing; and at least one thin filament coupled to said outer casing, wherein said at least one high-temperature thermocouple, said at least one gas emissions sampling aperture, and said at least one thin filament are proximate to each other; an optical system configured to receive at least a portion of thermal radiation emitted from said at least one thin filament; a thermocouple electronics system coupled to said at least one high-temperature thermocouple; and a gas analyzer system coupled to said at least one gas emissions sampling aperture.
9. The gas temperature measurement system in accordance with claim 8 further comprising a controller communicatively coupled to said optical system, said thermocouple electronics system, and said gas analyzer system, said controller configured to: transform optical system electrical signals to thin filament pyrometry (TFP) temperature indications; transform thermocouple electronics system electrical signals to thermocouple temperature indications; and transform gas analyzer system electrical signals to gas species concentration indications.
10. The gas temperature measurement system in accordance with claim 8 further comprising: a plurality of multi-function gas temperature measurement probes, said plurality of multi-function gas temperature measurement probes comprising said at least one multi-function gas temperature measurement probe, said plurality of multi-function gas temperature measurement probes comprising: a plurality of said high-temperature thermocouples comprising said at least one high-temperature thermocouple; a plurality of gas emissions sampling apertures comprising said at least one gas emissions sampling aperture; and a plurality of said thin filaments comprising said at least one thin filament, said plurality of multi-function gas temperature measurement probes configured to facilitate at least one of: spatial resolution of temperature fields and temperature gradients measured in three dimensions by said plurality of said thin filaments; spatial resolution of gas emissions species concentrations measured in three dimensions by said plurality of gas emissions sampling apertures; spatial resolution of temperature fields and temperature gradients generated in three dimensions based on the spatial resolution of measured gas emissions species concentrations; cross-validation of an accuracy of gas temperature measurement data collected by said plurality of said high-temperature thermocouples and said plurality of said thin filaments and generated gas temperature data from the measured gas emissions species concentrations; and generation of spatially-resolved gas temperature field measurements and gas temperature gradient measurements using selected values from the cross-validation of the accuracy of the gas temperature measurement data.
11. The gas temperature measurement system in accordance with claim 8, wherein said outer casing comprises a high-temperature alloy.
12. The gas temperature measurement system in accordance with claim 8 further comprising at least one cooling fluid inlet conduit and at least one cooling fluid outlet conduit.
13. The gas temperature measurement system in accordance with claim 12 further comprising a cooling fluid shell coupled to said outer casing, said cooling fluid shell defining at least one cooling fluid plenum therein, said at least one cooling fluid plenum coupled in flow communication with said at least one cooling fluid inlet conduit and said at least one cooling fluid outlet conduit.
14. The gas temperature measurement system in accordance with claim 8 further comprising at least one translation device coupled to said outer casing.
15. The gas temperature measurement system in accordance with claim 8, said outer casing comprising at least one thin filament standoff configured to support said at least one thin filament.
16. A method of testing at least a portion of a gas turbine engine, said method comprising: generating thermocouple temperature measurements of at least a portion of a high-temperature combustion gas stream through at least one high-temperature thermocouple of a multi-function gas temperature measurement probe; generating thin filament pyrometry (TFP) temperature measurements of the at least a portion of the high-temperature combustion gas stream through at least one thin filament of the multi-function gas temperature measurement probe; and generating gas species concentration measurements of the at least a portion of the high-temperature combustion gas stream through at least one gas emissions sampling aperture of the multi-function gas temperature measurement probe, wherein the at least one high-temperature thermocouple, the at least one thin filament, and the at least one gas emissions sampling aperture are proximate to each other.
17. The method in accordance with claim 16, wherein the at least a portion of the gas turbine engine includes a plurality of multi-function gas temperature measurement probes within the hot gas path, and wherein TFP temperature measurements through the multi-function gas temperature measurement probes comprises generating a plurality of measured three-dimensional (3D) temperature fields and a plurality of measured 3D temperature gradients with a predetermined spatial resolution.
18. The method in accordance with claim 16, wherein the at least a portion of the gas turbine engine includes a plurality of multi-function gas temperature measurement probes within the hot gas path, and wherein generating gas species concentration measurements comprises generating a plurality of measured 3D gas emissions species concentrations with a predetermined spatial resolution.
19. The method in accordance with claim 18 further comprising generating a plurality of measured 3D temperature fields and a plurality of measured 3D temperature gradients with a predetermined spatial resolution from the measured 3D gas emissions species concentrations.
20. The method in accordance with claim 19, wherein the at least a portion of the gas turbine engine includes a plurality of multi-function gas temperature measurement probes within the hot gas path, and wherein generating thermocouple temperature measurements and generating TFP temperature measurements through the multi-function gas temperature measurement probe comprises performing a cross-validation of an accuracy of the gas temperature measurement data collected by the plurality of high-temperature thermocouples and the plurality of thin filaments and the gas temperature data generated from the measured 3D gas emissions species concentrations.
21. The method in accordance with claim 20 further comprising generating 3D spatially-resolved gas temperature field measurements and gas temperature gradient measurements using selected values from the cross-validation of the accuracy of the gas temperature measurement data collected by the plurality of high-temperature thermocouples and the plurality of thin filaments and the gas temperature data generated from the measured 3D gas emissions species concentrations.
22. The method in accordance with claim 16 further comprising translating the multi-function gas temperature measurement probe through the hot gas path, thereby increasing a quantity of spatially-resolved temperature and gas species concentration measurements.
Description
DRAWINGS
[0007] These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
[0008]
[0009]
[0010]
[0011]
[0012] Unless otherwise indicated, the drawings provided herein are meant to illustrate features of embodiments of the disclosure. These features are believed to be applicable in a wide variety of systems comprising one or more embodiments of the disclosure. As such, the drawings are not meant to include all conventional features known by those of ordinary skill in the art to be required for the practice of the embodiments disclosed herein.
DETAILED DESCRIPTION
[0013] In the following specification and the claims, reference will be made to a number of terms, which shall be defined to have the following meanings.
[0014] The singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise.
[0015] “Optional” or “optionally” means that the subsequently described event or circumstance may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
[0016] Approximating language, as used herein throughout the specification and claims, may be applied to modify any quantitative representation that may permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about”, “approximately”, and “substantially”, are not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value. Here and throughout the specification and claims, range limitations may be combined and interchanged; such ranges are identified and include all the sub-ranges contained therein unless context or language indicates otherwise.
[0017] As used herein, the terms “processor” and “computer” and related terms, e.g., “processing device”, “computing device”, and “controller” are not limited to just those integrated circuits referred to in the art as a computer, but broadly refers to a microcontroller, a microcomputer, a programmable logic controller (PLC), an application specific integrated circuit, and other programmable circuits, and these terms are used interchangeably herein. In the embodiments described herein, memory may include, but is not limited to, a computer-readable medium, such as a random access memory (RAM), and a computer-readable non-volatile medium, such as flash memory. Alternatively, a floppy disk, a compact disc—read only memory (CD-ROM), a magneto-optical disk (MOD), and/or a digital versatile disc (DVD) may also be used. Also, in the embodiments described herein, additional input channels may be, but are not limited to, computer peripherals associated with an operator interface such as a mouse and a keyboard. Alternatively, other computer peripherals may also be used that may include, for example, but not be limited to, a scanner. Furthermore, in the exemplary embodiment, additional output channels may include, but not be limited to, an operator interface monitor.
[0018] Further, as used herein, the terms “software” and “firmware” are interchangeable, and include any computer program stored in memory for execution by personal computers, workstations, clients and servers.
[0019] As used herein, the term “non-transitory computer-readable media” is intended to be representative of any tangible computer-based device implemented in any method or technology for short-term and long-term storage of information, such as, computer-readable instructions, data structures, program modules and sub-modules, or other data in any device. Therefore, the methods described herein may be encoded as executable instructions embodied in a tangible, non-transitory, computer readable medium, including, without limitation, a storage device and a memory device. Such instructions, when executed by a processor, cause the processor to perform at least a portion of the methods described herein. Moreover, as used herein, the term “non-transitory computer-readable media” includes all tangible, computer-readable media, including, without limitation, non-transitory computer storage devices, including, without limitation, volatile and nonvolatile media, and removable and non-removable media such as a firmware, physical and virtual storage, CD-ROMs, DVDs, and any other digital source such as a network or the Internet, as well as yet to be developed digital means, with the sole exception being a transitory, propagating signal.
[0020] As used herein, the term “real-time” refers to at least one of the time of occurrence of the associated events, the time of measurement and collection of predetermined data, the time to process the data, and the time of a system response to the events and the environment. In the embodiments described herein, these activities and events occur substantially instantaneously.
[0021] The gas temperature measurement probes and systems described herein use an integrated suite of temperature measurement devices suited for high-temperature environments. Specifically, the gas temperature measurement probes and systems described herein integrate thin filament pyrometry (TFP), high temperature thermocouples (TC), and gas emissions sampling probes into a single package that is easily inserted into the hot gas path of gas turbine engines. Also, the integrated TFP/TC/gas emissions probe is water-cooled to facilitate service life extension in the harsh environments. The TFP portion of the probe facilitates spatial resolution of the temperature fields and gradients in three dimensions and the TFP measurements are compared to the spatially resolved emissions measurements. Moreover, the probes described herein may be used in a stationary mode and they may be mounted on a translating device (or devices) and moved around the hot gas path to get a map of the gas temperatures in several planes. The probes described herein are especially suited for testing arrangements to facilitate cross-validation of the accuracy of gas temperature measurement data for product validation.
[0022]
[0023] In the exemplary embodiment, gas turbine engine system 101 includes a compressor 104 and turbine 106 mounted on a common shaft 108 and coupled in a serial flow arrangement with a combustor 110 positioned between them. A load 112, such as, but not limited to, a generator, a pump, and a compressor is also drivingly coupled to shaft 108.
[0024] During operation, air or other oxygen containing working fluid is received at an air intake 114 and directed to an inlet 116 of compressor 104, compressed air is then directed to combustor 110, where fuel 118 is added to the flow of compressed air and ignited, generating a flow of relatively hot, high-energy gases. The gases are directed through turbine 106, where work is extracted to drive compressor 104 and load 112. The exhausted gases are expelled through an exhaust section 119.
[0025] While gas turbine engine system 101 is in operation, gas temperature measurement system 102 monitors one or more temperatures of the gases passing through gas turbine engine system 101. Gas temperature measurement system 102 includes a plurality of temperature measurement probes 120 positioned within a flow path of the hot high-energy gases generated in combustor 110. In various embodiments, probes 120 may be positioned at for example, but not limited to, an inlet to combustor 110, an outlet from combustor 110, an inlet to turbine 106, and an outlet from turbine 106. Probes 120 may also be coupled to various components operating in the gas paths of gas turbine engine system 101, such as, but not limited to, stationary surfaces, e.g., compressor vanes, cooling apertures, turbine nozzles, and turbine exhausts, and rotatable surfaces, e.g., land-based turbine buckets, aircraft engine blades, and compressor/fan blades.
[0026] Also, in the exemplary embodiment, gas temperature measurement probes 120 are integrated devices that integrate thin filament pyrometry (TFP), high temperature thermocouples (TC), and gas emissions sampling probes into a single package inserted into the associated gas paths. Therefore, for the TFP portions of probe 120, an optical system 124 includes sufficient collection optics, i.e., optical system 124 includes an optical component 126 fabricated of a material that is at least partially transparent to thermal radiation emitted by probes 120 to collect the thermal radiation light from probes 120. Optical component 126 is any device that enables operation of optical system 124 and gas temperature measurement system 102, including, without limitation, windows, lens, and mirrors. Optical system 124 also includes a wavelength splitting device 128 that is configured to split broad wavelength band thermal radiation signals into a plurality of relatively narrow band thermal radiation signals. Optical system 124 further includes at least one detector array 130 that is configured to convert the relatively narrow band thermal radiation signals to digital signals.
[0027] In addition, in the exemplary embodiment, gas temperature measurement system 102 includes a controller 132 that includes a processor 134 and a memory 136. Memory 136 includes one or more predetermined algorithms configured, when executed by processor 134 to convert the digital signals into temperature indication based on a predetermined calibration curve. Controller 132 is programmed with sufficient instructions and algorithms to enable operation of gas temperature measurement system 102 as described herein based on measurements collected by the TFP portions of probe 120.
[0028] Further, in the exemplary embodiment, gas temperature measurement system 102 includes a gas analyzer system 140 in flow communication with probe 120 and in operative communication with controller 132. Gas analyzer system 140 includes, without limitation, oxygen, carbon monoxide, carbon dioxide, unburned hydrocarbons, methane, and nitrogen oxide measurement devices. Gas analyzer system 140 also includes, without limitation, at least one vacuum pump to facilitate collecting samples from probes 120. Gas temperature measurement system 102 also includes a thermocouple electronics system 150 operatively coupled to probe 120 and controller 132. Thermocouple electronics system 150 includes, without limitation, a reference junction sensor, e.g., without limitation, a semiconductor thermometer, for cold junction compensation. Controller 132 is further programmed with sufficient instructions and algorithms to enable operation of gas temperature measurement system 102 as described herein based on measurements collected by the TC and gas emissions portions of probe 120. In addition, controller 132 is programmed with sufficient instructions and algorithms to enable operation of gas temperature measurement system 102 as described herein to, and without limitation, facilitate spatial resolution of the temperature fields and gradients in three dimensions, compare the TFP measurements with the spatially resolved emissions measurements, and to facilitate cross-validation of the accuracy of gas temperature measurement data for product validation under testing conditions.
[0029] As shown in the exemplary embodiment, gas temperature measurement system 102 monitors one or more temperatures of the gases passing through turbine 106 of gas turbine engine system 101. Alternatively, gas temperature measurement system 102 may be used to measure gas temperatures associated with other portions of gas turbine engine system 101, including, without limitation, any portion of air intake 114, compressor 104, combustor 110, and exhaust section 119.
[0030]
[0031]
[0032] Also, in the exemplary embodiment, multi-function gas temperature measurement probe 300 includes at least one high-temperature thermocouple 310 (only one shown n
[0033] Further, in the exemplary embodiment, multi-function gas temperature measurement probe 300 includes a plurality of gas emissions sampling apertures 314 defined within face 312 of outer casing 302. While eight apertures 314 are shown in
[0034] Moreover, in the exemplary embodiment, multi-function gas temperature measurement probe 300 includes at least one thin filament 316 (only one shown in
[0035] In addition, in the exemplary embodiment, high-temperature thermocouple 310, gas emissions sampling apertures 314, and thin filament 316 are proximate to each other. Such proximate to positioning of such measurement instruments facilitates generating a plurality of measured three-dimensional (3D) temperature fields and a plurality of measured 3D temperature gradients with a predetermined spatial resolution. Also, such proximate to positioning of such measurement instruments facilitates performing a cross-validation of an accuracy of the gas temperature measurement data collected by high-temperature thermocouples 312 and thin filaments 316. Further, such proximate to positioning of such measurement instruments facilitates generating a plurality of measured 3D gas emissions species concentrations with a predetermined spatial resolution. Moreover, such proximate to positioning of such measurement instruments facilitates comparing 3D spatially-resolved temperature field and gradient measurements with spatially-resolved gas emissions species concentration measurements. These cross-correlation features enhance data validation, especially in testing environments.
[0036] Multi-function gas temperature measurement probe 300 also includes at least one cooling fluid inlet conduit 318 (only one shown in
[0037] In the exemplary embodiment, probe 300 is substantially stationary. Alternatively, probe 300 is coupled to at least one translation device through outer casing 302 such that high-temperature thermocouple 310, gas emissions sampling apertures 314, and thin filament 316 are translated in one, two, or three dimensions to facilitate movement around hot gas path 220 (shown in
[0038]
[0039] Referring to
[0040] Method 400 further includes generating 404 thermocouple temperature measurements of the high-temperature combustion gas stream through high-temperature thermocouple 310 of multi-function gas temperature measurement probe 300. Method 400 also includes generating 406 thin filament pyrometry (TFP) temperature measurements of the high-temperature combustion gas stream through at least one thin filament 316 of multi-function gas temperature measurement probe 300. Method 400 further includes generating 408 gas species concentration measurements of the high-temperature combustion gas stream through a plurality of gas emissions sampling apertures 314 of multi-function gas temperature measurement probe 300, where high-temperature thermocouple 310, thin filament 316, and gas emissions sampling apertures 318 are proximate to each other. In the exemplary embodiment, method steps 404, 406, and 408 are performed substantially simultaneously through their respective systems, i.e., TC electronics system 150, optical system 124, and gas analyzer system 140, respectively. Alternatively, method steps 404, 406, and 408 are performed individually through their respective systems.
[0041] Method 400 also includes generating 410 a plurality of measured three-dimensional (3D) temperature fields and a plurality of measured 3D temperature gradients with a predetermined spatial resolution using the TFP temperature measurements. Method 400 further includes generating 412 a plurality of measured 3D gas emissions species concentrations with a predetermined spatial resolution with the gas species concentration measurements. Method 400 also includes generating 414 a plurality of measured 3D temperature fields and a plurality of measured 3D temperature gradients with a predetermined spatial resolution from the measured 3D gas emissions species concentration information. The species information is used to compute approximate gas temperatures through known chemistry relationships within the combustion gases.
[0042] Method 400 also includes performing 416 a cross-validation of an accuracy of the gas temperature measurement data collected by the plurality of high-temperature thermocouples 310, the plurality of thin filaments 316, and the computed gas temperature data derived from the species information. Such cross-validation is a check, or verification of the remaining temperature data after a temperature data reduction is completed, with the TFP and gas species data having a greater likelihood of inaccuracy and removal from the data to be validated. Method 400 further includes generating 418 3D spatially-resolved gas temperature field measurements and gas temperature gradient measurements using selected values from the cross-validation of the accuracy of the gas temperature measurement data collected by the plurality of high-temperature thermocouples and the plurality of thin filaments and the gas temperature data generated from the measured 3D gas emissions species concentrations. Such selected values will primarily be based on the determination of the accuracy such that the most accurate values are used for the 3D spatially-resolved gas temperature field measurements and gas temperature gradient measurements.
[0043] The above-described gas temperature measurement probes and systems described herein use an integrated suite of temperature measurement devices suited for high-temperature environments. Specifically, the gas temperature measurement probes and systems described herein integrate thin filament pyrometry (TFP), high temperature thermocouples (TC), and gas emissions sampling probes into a single package that is easily inserted into the hot gas path of gas turbine engines. Also, the integrated TFP/TC/gas emissions probe is water-cooled to facilitate service life extension in the harsh environments. The TFP portion of the probe facilitates spatial resolution of the temperature fields and gradients in three dimensions and the TFP measurements are compared to the spatially resolved emissions measurements. Moreover, the probes described herein may be used in a stationary mode and they may be mounted on a translating device (or devices) and moved around the hot gas path to get a map of the gas temperatures in several planes. The probes described herein are especially suited for testing arrangements to facilitate cross-validation of the accuracy of gas temperature measurement data for product validation.
[0044] An exemplary technical effect of the methods, systems, and apparatus described herein includes at least one of: (a) substantially reduced physical intrusion into the hot gas path of gas turbine engines due to the elimination of multiple independent temperature measurement probes; (b) reduced material and installation costs; (c) increasing the accuracy and spatial resolution of the associated temperature measurements through taking temperature measurements with three devices in close proximity; and (d) facilitating cross-validation of the accuracy of gas temperature measurement data for product validation under testing conditions.
[0045] Exemplary embodiments of gas temperature measurement systems for gas turbine engines are described above in detail. The gas temperature measurement systems, and methods of operating such systems are not limited to the specific embodiments described herein, but rather, components of systems and/or steps of the methods may be utilized independently and separately from other components and/or steps described herein. For example, the methods may also be used in combination with other systems requiring observation of temperatures in high temperature environments, and are not limited to practice with only the gas turbine engines as described herein. Rather, the exemplary embodiment can be implemented and utilized in connection with many other high temperature applications.
[0046] Although specific features of various embodiments of the invention may be shown in some drawings and not in others, this is for convenience only. In accordance with the principles of the invention, any feature of a drawing may be referenced and/or claimed in combination with any feature of any other drawing.
[0047] Some embodiments involve the use of one or more electronic or computing devices. Such devices typically include a processor, processing device, or controller, such as a general purpose central processing unit (CPU), a graphics processing unit (GPU), a microcontroller, a reduced instruction set computer (RISC) processor, an application specific integrated circuit (ASIC), a programmable logic circuit (PLC), a field programmable gate array (FPGA), a digital signal processing (DSP) device, and/or any other circuit or processing device capable of executing the functions described herein. The methods described herein may be encoded as executable instructions embodied in a computer readable medium, including, without limitation, a storage device and/or a memory device. Such instructions, when executed by a processing device, cause the processing device to perform at least a portion of the methods described herein. The above examples are exemplary only, and thus are not intended to limit in any way the definition and/or meaning of the term processor and processing device.
[0048] This written description uses examples to disclose the embodiments, including the best mode, and also to enable any person skilled in the art to practice the embodiments, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.