Projector System

Abstract

The invention is a small, low-power consuming, projector system. Once programmed and provided with image data, it can be a standalone system for presenting varying length, silent, videos. Its programmability and FPGA-based micro-circuitry allows it to be repurposed with minimal effort to support other embedded-light-system applications.

Claims

1. An image projection system comprising: a memory module; a programmable microcontroller module; a projector module; a power and data bus allowing said memory, programmable microcontroller and projector modules to convey and receive data and control signals; a heat-conducting substrate structure; a first interface means enabling external power and systems to convey and receive data and control signals; an enclosure within which resides said memory, programmable microcontroller and projector modules; and said power and data bus; said enclosure has a first aperture allowing light images produced by said projector module to be beamed outside said enclosure and projected onto a reflective surface; said enclosure has a second aperture that supports a first interface connector; said first and said second aperture may be any closed geometric shape; and said first interface connector shares said power and data bus.

2. A system as in claim 1 further comprising: a module supporting a wired-networking standard; said module supporting a wired-networking standard interfaces with said power and data bus; said enclosure has a third aperture that supports a second interface connector; said third aperture may be any closed geometric shape; and said second interface connector enables said module supporting a wired-networking standard to convey and receive data and control signals.

3. A system as in claim 1 further comprising: a module supporting a wireless-networking standard; said module supporting a wireless-networking standard interfaces with said power and data bus; said enclosure has a third aperture that supports a second interface connector; and said second interface connector enables said module supporting a wireless-networking standard to convey and receive data and control signals.

4. A system as in claim 1 further comprising at least one external lens adapter.

5. A system as in claim 1 further comprising at least one external thermal conduction cooling fixture.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0004] FIG. 1 illustrates a first embodiment.

[0005] FIG. 2 illustrates another embodiment.

[0006] FIG. 3 shows the invention of FIG. 1 with external lens adaptors.

[0007] FIG. 4 shows the invention of FIG. 1 with external heat conducting fixtures.

[0008] FIG. 5 shows a three-dimensional view of the embodiment of FIG. 1.

[0009] FIG. 6 shows a side view of the invention of FIG. 1 wherein the conducting substrate and interface aperture is illustrated.

[0010] FIG. 7 shows the three dimensional view of FIG. 5 with the addition of lens adaptors.

[0011] FIG. 8 shows the three dimensional view of FIG. 5 with the addition of external heat-conducting fixtures.

DETAILED DESCRIPTION OF INVENTION

[0012] The invention herein disclosed and claimed is a small projector system that can store fixed image data, and new data conveyed by an external subsystem, system or systems. Image and control data is processed by its built-in microcontroller, which can be re-programmed, and processed image and control data is conveyed to a projector module which then projects the resulting image through an aperture in the invention's enclosure.

[0013] The invention can be scaled down to one inch by one inch (length and width) and a half inch in height. Using today's field-programmable gate array (FPGA) microcircuit technology, the modules that comprise the invention are kept to relatively small dimensions without compromising storage capacity, speed, and image quality while obviating the need for active cooling by making use of a heat-conducting substrate layer.

[0014] FIG. 1 is an exemplary embodiment of the invention wherein the functional modules are shown as separate entities but could be further integrated into more complex modules and fewer components. The enclosure (101) can be hermetically sealed and houses a memory module (102), a microcontroller module (103) and a projector module (104). The projector module has an aperture (105) through which light can be projected, and the enclosure has a first aperture (106) enabling the light projected by the projection module to pass through the enclosure onto a target screen. As shown, a power and data bus (107) interconnects the functional modules allowing them convey and receive data and control signals. Furthermore, the power and data bus can be accessed externally via a port (108) supported by a second aperture on the enclosure.

[0015] FIG. 2 shows the embodiment of FIG. 1 augmented with a module (201) that supports wired- or wireless-networking standards, such as Ethernet, USB, Bluetooth and WiFi. As later technologies emerge, the invention can be easily adapted to support them, as well. The module 201 conveys and receives control and image data on the aforementioned power and data bus. The module, in turn, receives wired or wirelessly conveyed image and control data via an interface (202) which is supported by the enclosure.

[0016] FIG. 3 illustrates the embodiment of FIG. 1 wherein external lens adapters (301) are attached to the enclosure on the same face as its first aperture.

[0017] FIG. 4 illustrates the embodiment of FIG. 1 wherein external heat-conducting fixtures (402) are added to the top face of the enclosure. These could augment the conduction cooling of the aforementioned conduction-cooling substrate.

[0018] To help envision the invention in three dimensions, FIG. 5 shows the first aperture and second aperture as well as the functional modules within.

[0019] To help envision the conduction cooling substrate, FIG. 6 shows a side view of an invention embodiment wherein the layer (601) is on the bottom face of the enclosure.

[0020] FIG. 7 illustrates in three dimensions an invention embodiment wherein external lens adaptors (301) are employed.

[0021] FIG. 8 illustrates in three dimensions an invention embodiment wherein external heat-conducting fixtures (402) are employed.

[0022] Regarding the memory module, it could comprise volatile and non-volatile memory technologies.

[0023] Regarding the microcontroller module, it would allow reprogramming via the power and data bus, or via wired- or wireless-networking technology.

[0024] Regarding the projector module, the preferred implementation is a module using laser and single mirror. Such devices do not require focusing and are energy efficient. That said, other basic types of micro projector module light sources and modulation may also be employed.

[0025] Regarding the enclosure, it can have a hollow interior; it can be epoxy potting wherein the components are surrounded by potting material which can conduct heat away from them. Dimensions are not critical. Aperture shape and sizes may be determined by the required projection characteristics and by the standard or customized interface connectors.

[0026] The conduction-cooling substrate may be sufficiently cooled using only thermal conductive copper strips. A preferred embodiment would use silicon substrates in direct contact with a thermally conductive metal.

[0027] The invention is versatile. It is a small, low-power, silent video communications device that can provide variable duration, fixed presentations. It is also a software reconfigurable router-server-smart microcontroller with embedded light engine enabling it to be adapted to changing needs of specific applications.

[0028] The drawings are exemplary and not drawn to scale. They should not be seen as limiting the scope of the invention's specifications or claims.