THERMOSENSITIVE CHIP FOR COMPOSITE ELECTRODE

Abstract

A thermosensitive chip for a composite electrode is provided, including a thermosensitive substrate, wherein each of the two surfaces of the thermosensitive substrate is sequentially provided thereon with a silver electrode and a gold electrode from the inside to the outside in a stacked manner. The thermosensitive chip is suitable for the gold wire bonding technology, the gold electrode on the outer surface thereof facilitates better bonding with a gold wire, and the silver electrode on the bottom of the gold electrode can greatly reduce manufacturing costs. In addition, an operation of coating with gold is conducted through a vacuum sputtering machine, so that the manufacturing process is simple and convenient, and the manufacturing effect is good.

Claims

1-4. (canceled)

5. A thermosensitive chip for composite electrode, comprising a thermosensitive substrate, wherein each of two surfaces of the thermosensitive substrate is sequentially provided thereon with a silver electrode and a gold electrode from inside to outside in a stacked manner.

6. The thermosensitive chip for composite electrode of claim 5, wherein thickness range of the silver electrodes is 3 to 30 micrometers.

7. The thermosensitive chip for composite electrode of claim 5, wherein thickness range of the gold electrodes is 0.5 to 5 micrometers.

8. The thermosensitive chip for composite electrode of claim 6, wherein thickness range of the gold electrodes is 0.5 to 5 micrometer.

9. The thermosensitive chip for composite electrode of claim 7, wherein the gold electrodes are formed by evenly coating the silver electrodes with gold using a vacuum sputtering machine.

10. The thermosensitive chip for composite electrode of claim 8, wherein the gold electrodes are formed by evenly coating the silver electrodes with gold using a vacuum sputtering machine.

Description

BRIEF DESCRIPTION

[0014] Some of the embodiments will be described in detail, with reference to the following figures, wherein like designations denote like members, wherein:

[0015] FIG. 1 is a schematic view of the thermosensitive chip for composite electrode of embodiments of the present invention.

[0016] FIG. 2 is a schematic view of the manufacturing process of the thermosensitive chip for composite electrode of embodiments of the present invention using a vacuum sputtering machine.

DETAILED DESCRIPTION

[0017] In FIG. 1, the thermosensitive chip for composite electrode of embodiments of the present invention comprises a thermosensitive substrate 1, wherein each of the two surfaces of the thermosensitive substrate is sequentially provided thereon with a silver electrode 2 and a gold electrode 3 from the inside to the outside in a stacked manner. The thickness range of the silver electrode 2 is 3 to 30 micrometer, and the thickness range of the gold electrode 3 is 0.5 to 5 micrometer.

[0018] The gold electrode 3 in embodiments of the present invention is formed by evenly coating the silver electrode with gold using a vacuum sputtering machine.

[0019] The manufacturing process of the thermosensitive chip for a composite electrode of embodiments of the present invention using a vacuum sputtering machine 10 will be described in detail below.

[0020] (1) to complete the preparatory work of making the thermosensitive substrate 1: first mixing ingredients, ball-milling, ultra-high pressure molding, sintering, slicing, coating silver, sintering silver, and then acquiring the thermosensitive substrate 1 with silver electrodes.

[0021] (2) a crucible 20 is disposed inside the vacuum sputtering machine 10. Place the gold inside crucible 20 as evaporative material.

[0022] (3) to place the thermosensitive substrate 1 with silver electrodes in front of the crucible 20 inside the vacuum sputtering machine 10.

[0023] (4) to turn on the vacuum sputtering machine 10 to evacuate to a high vacuum, then the crucible 20 is heated to evaporate the gold therein so that the gold molecules are sputtered onto the surfaces of the silver electrodes 2 of the thermosensitive substrate 1.

[0024] (5) To take out the thermosensitive substrate 1 whose surfaces are coated evenly with gold after completing the system operation.

[0025] (6) to slice the thermosensitive substrate 1 coated with gold, and then acquire the thermosensitive chip for composite electrode of embodiments of the present invention.

[0026] Although the present invention has been disclosed in the form of preferred embodiments and variations thereon, it will be understood that numerous additional modifications and variations could be made thereto without departing from the scope of the invention.

[0027] For the sake of clarity, it is to be understood that the use of ‘a’ or ‘an’ throughout this application does not exclude a plurality, and ‘comprising’ does not exclude other steps or elements.