PHOTODIODE USING GRAPHENE-SILICON QUANTUM DOT HYBRID STRUCTURE AND METHOD OF MANUFACTURING THE SAME
20170250304 · 2017-08-31
Assignee
Inventors
Cpc classification
H01L31/09
ELECTRICITY
H01L31/109
ELECTRICITY
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
H01L31/10
ELECTRICITY
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
H01L31/0384
ELECTRICITY
Y10S977/843
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B82Y30/00
PERFORMING OPERATIONS; TRANSPORTING
Y10S977/948
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/847
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/896
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/814
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/734
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01L31/03529
ELECTRICITY
H01L31/1804
ELECTRICITY
Y10S977/89
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/774
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H01L31/18
ELECTRICITY
H01L31/0352
ELECTRICITY
Abstract
Disclosed is a photodiode, which includes a graphene-silicon quantum dot hybrid structure, having improved optical and electrical characteristics by controlling the sizes of silicon quantum dots and the doping concentration of graphene. The photodiode including the graphene-silicon quantum dot hybrid structure of the present disclosure may be easily manufactured, may be manufactured over a large area, has a wide photodetection band from the ultraviolet light region to the near infrared region, and allows selective absorption energy control.
Claims
1. A photodiode comprising a graphene-silicon quantum dot hybrid structure, the photodiode comprising: a hybrid structure composed of a silicon quantum dot layer comprising silicon (Si) quantum dots, each of which is formed in a thin film of a silicon oxide, and doped graphene formed on the silicon quantum dot layer; and an electrode formed upper and lower parts of the hybrid structure, wherein optical and electrical characteristics of the photodiode are controlled according to the size of the silicon quantum dots and a doping concentration of the doped graphene.
2. The photodiode according to claim 1, wherein the silicon quantum dot layer comprise silicon quantum dots formed in a SiO.sub.2 thin film by sequentially laminating SiO.sub.2 and SiOx thin films on a substrate and then thermally treating at 1000° C. to 1200° C. in a nitrogen atmosphere.
3. The photodiode according to claim 2, wherein x is controlled to have a value of 0.8 to 1.6 and the size of the silicon quantum dots are controlled to correspond to a value of x.
4. The photodiode according to claim 3, wherein each of the SiO.sub.2 and SiOx thin films is sequentially laminated 23 to 25 times to a thickness unit of 2 nm each time.
5. The photodiode according to claim 1, wherein a doping concentration of the doped graphene is controlled by treating graphene formed by reacting a catalyst layer with a mixed gas containing carbon and depositing a reacted product on the catalyst layer by chemical vapor deposition (CVD).
6. The photodiode according to claim 5, wherein the hybrid structure is formed by transferring the deposited graphene onto the silicon quantum dot layer.
7. The photodiode according to claim 5, wherein the doped graphene is formed by spin coating AuCl.sub.3, which has a concentration of 10 to 30 mM, on the deposited graphene and performing annealing at 90° C. to 110° C.
8. A method of manufacturing a photodiode comprising a graphene-silicon quantum dot hybrid structure, the method comprising: forming a silicon quantum dot layer comprising silicon quantum dots, each of which is formed in a thin film of a silicon oxide, on a substrate; forming a hybrid structure by forming doped graphene on the silicon quantum dot layer; and forming an electrode on upper and lower parts of the hybrid structure.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0038] The above and other objects, features and other advantages of the present invention be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[0039]
[0040]
[0041]
[0042]
[0043]
[0044]
[0045]
[0046]
[0047]
[0048]
[0049]
[0050]
[0051]
[0052]
DETAILED DESCRIPTION OF THE INVENTION
[0053] Hereinafter, the embodiments of the present invention are described with reference to the accompanying drawings and the description thereof but are not limited thereto.
[0054] It will be understood that when an element or layer is referred to as being “on” another element or layer, it can be directly on the other element or layer or intervening elements or layers may be present therebetween. In contrast, when an element or layer is referred to as being “directly on” another element or layer, there are no intervening elements or layers present.
[0055] Spatially-relative terms such as “below”, “beneath”, “lower”, “above” or “upper” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that spatially-relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below. Since the device may be oriented in another direction, the spatially-relative terms may be interpreted in accordance with the orientation of the device.
[0056] The terminology used in the present disclosure serves the purpose of describing particular embodiments only and is not intended to limit the disclosure. As used in the disclosure and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless context clearly indicates otherwise. It will be further understood that the terms “includes” and/or “including,” when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof.
[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
[0058] Meanwhile, in the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention unclear. The terms used in the specification are defined in consideration of functions used in the present invention, and can be changed according to the intent or conventionally used methods of clients, operators, and users. Accordingly, definitions of the terms should be understood on the basis of the entire description of the present specification.
[0059]
[0060] Referring to
[0061] Optical and electrical characteristics of the photodiode 100 including a graphene-silicon quantum dot hybrid structure according to an embodiment of the present disclosure are controlled according to the sizes of the silicon quantum dots 111 and a doping concentration of the doped graphene 130.
[0062] The hybrid structure 130 includes a silicon quantum dot layer 110 including the silicon quantum dots 111, each of which is formed inside a thin film of silicon oxide; and doped graphene 120 formed on the silicon quantum dot layer 110.
[0063] A doping concentration of the doped graphene 120 may be controlled by treating graphene formed by reacting a catalyst layer with a mixed gas containing carbon and depositing a reacted product on the catalyst layer by chemical vapor deposition (CVD).
[0064] For example, the doping concentration of the doped graphene 120 may be controlled by spin coating AuCl.sub.3 with a concentration of 10 to 30 mM on the deposited graphene, followed by annealing at 90° C. to 110° C.
[0065] According to another embodiment of the present disclosure, the hybrid structure 130 may be formed by transferring the deposited graphene onto the silicon quantum dot layer 110.
[0066] The silicon quantum dot layer 110 may include the silicon quantum dots 111 formed in a SiO.sub.2 thin film by sequentially stacking SiO.sub.2 and SiOx thin films on the substrate 150 and then thermally treating at 1000° C. to 1200° C. in a nitrogen atmosphere. x may be controlled to have a value of 0.8 to 1.6 and the sizes of the silicon quantum dots 111 may be controlled to correspond to a value of x.
[0067] In addition, the SiO.sub.2 and SiOx thin films may be sequentially laminated 23 to 25 times to a thickness of 2 mm each time, respectively.
[0068]
[0069] <Manufacture of Silicon Quantum Dots>
[0070] As illustrated in
[0071] Referring to
[0072] For example, the silicon quantum dot layer 110 may be formed by alternately depositing the SiO.sub.2 thin film 112 to a thickness of 2 nm and the SiOx thin film 113 to a thickness of 2 nm at a predetermined cycle on the substrate 150 by ion beam sputtering deposition, followed by rapidly, thermally treating for 20 minutes at 1000° C. to 1200° C. in a nitrogen atmosphere 20. In this case, the SiO.sub.2 thin film 112 having a thickness of 2 nm and the SiOx thin film 113 having a thickness of 2 nm may be deposited up to a total thickness of 100 nm through 25 cycles. Here, x is controlled to have a value of 0.8 to 1.6 and the sizes of the silicon quantum dots may be adjusted to correspond to a value of x.
[0073] In addition, a value of x may be adjusted by means of an X-ray spectro (XPS).
[0074] Referring to
[0075] The hybrid structure 130 includes the silicon quantum dot layer 110 including the silicon quantum dots 111, each of which is formed inside a thin film of a silicon oxide, and the doped graphene 120 formed on the silicon quantum dot layer 110.
[0076] The doped graphene 120 may be deposited on the catalyst layer by reacting a catalyst layer with carbon-containing gas using chemical vapor deposition (CVD) and a doping concentration thereof may be adjusted. A process of manufacturing the doped graphene will be described in more detail.
[0077] <Manufacture of Doped Graphene-Silicon Quantum Dot Hybrid Structure>
[0078] A process of manufacturing single-layer graphene by chemical vapor deposition is as follows. Copper (or nickel) utilized as a catalyst layer is deposited on a substrate, followed by reaction with a mixed gas including methane and hydrogen gases at high temperature such that an appropriate amount of carbon is dissolved in or adsorbed onto the catalyst layer. Subsequently, cooling is performed, whereby carbon atoms included in the catalyst layer are crystallized and thus a graphene crystal structure is formed on a metal.
[0079] Subsequently, the catalyst layer is separated from the synthesized graphene thin film and thus removed from a substrate, thereby manufacturing a single-layer graphene.
[0080] In an example of the present disclosure, a 70 μm copper foil was inserted into a quartz tube, the flow rate of methane gas was changed from 10 sccm to 30 sccm, the flow rate of hydrogen gas was fixed to 10 sccm, and a process pressure was fixed to 3 mTorr, thereby synthesizing graphene.
[0081] Subsequently, PMMA, which was prepared by mixing poly(methyl methacrylate) with benzene, was spin-coated on the synthesized graphene. Here, the PMMA coating was performed such that, when the copper foil was removed using an ammonium persulfate solution, PMMA grasped and fixed graphene.
[0082] Subsequently, after removing the copper foil from the ammonium persulfate solution, an ammonium persulfate solution remaining on the graphene was washed using DI water. The washed graphene was transferred onto a 300 nm SiO.sub.2/Si substrate,
[0083] Next, after transfer of the graphene onto the SiO.sub.2/Si substrate, thermal treatment was performed to increase binding strength between the substrate and the graphene. Subsequently, the PMMA present on the graphene was removed using acetone, and rapid heat treatment was performed by means of a rapid heat treatment machine so as to remove a PMMA residue remaining on a graphene surface. As a result, a single-layer graphene was finally manufactured.
[0084] Referring again to
[0085] Referring again to
[0086] In particular, the doped graphene 120 may be manufactured by spin coating a p-type or n-type doping solution on graphene and performing annealing. For example, the doped graphene 120 is formed by spin coating AuCl3 having a concentration of 10 mM to 30 mM on graphene, which has been formed by deposition, and annealing the same at 90° C. to 110° C. for 10 minutes. A doping concentration of the doped graphene 120 may be controlled by adjusting the concentration of AuCl.sub.3.
[0087] <Manufacture of Photodiode Having Graphene-Silicon Quantum Dot Hybrid Structure>
[0088] Referring to
[0089] For example, the method of manufacturing the photodiode including a graphene-silicon quantum dot hybrid structure according to an embodiment of the present disclosure may include a process of sequentially depositing a chrome/gold (Cr/Au) metal on upper and lower parts of the doped graphene-silicon quantum dot hybrid structure 130 and thus forming an electrode on each thereof.
[0090]
[0091] Referring to
[0092] Referring to
[0093] In addition, it can be confirmed that great change is observed, compared to other doping concentrations, when a great a doping concentration of graphene is 20 mM, and, at all doping concentrations of graphene, a change in photo current is large at a wavelength of 600 nm.
[0094]
[0095] Referring to
[0096] Referring to
[0097] Compared to a driving voltage. i.e., −15 V, of a generally used silicon-based photodetector, a driving voltage of the photodiode including the graphene-silicon quantum dot hybrid structure according to an embodiment of the present disclosure is very low. Accordingly, applicability of the photodiode including the graphene-silicon quantum dot hybrid structure of the present disclosure is very high.
[0098]
[0099] Referring to
[0100] Such high photoresponsivity of the silicon quantum dots of the photodiode including the graphene-silicon quantum dot hybrid structure according to an embodiment of the present disclosure occurs due to high optical absorption of the silicon quantum dots in the visible light region.
[0101] Referring to
[0102]
[0103] Referring to
[0104] In addition, as illustrated in
[0105]
[0106] Referring to
[0107] Referring to
[0108] In addition, it can be confirmed that, as illustrated in
[0109] Referring to
[0110]
[0111]
[0112] From
[0113] Referring to
[0114]
[0115] Referring to
[0116] In addition, peaks of photoluminescence are shifted toward longer wavelengths, compared to peaks of photoresponsivity, as shown in
[0117] In addition, the peaks of photoluminescence are shifted toward longer wavelengths because electrons in a valence band on an energy band are excited to a conduction band and the excited electrons are shifted and fall to an interface state of Si═O and thus energy smaller than the energy of an actual energy band gap occurs.
[0118] As shown in
[0119] In addition, the photodiode including the graphene-silicon quantum dot hybrid structure according to the present disclosure exhibits the best characteristics when the size of the silicon quantum dot is 2.8 nm and a doping concentration of AuCl.sub.3 of graphene is 20 mM.
[0120]
[0121] In photodetector devices, it is important that photoresponsivity is maintained regardless of the sizes of devices.
[0122] Referring to
[0123] In addition, the wavelengths of the lasers used to measure photoresponsivity were 325 nm and 532 nm. The size of a laser beam, i.e., 10 points for the area of an active layer, was measured. Averages of measured values were calculated and results thereof are illustrated in the drawing.
[0124] Referring to
[0125]
[0126] With regard to
[0127] Referring to
[0128]
[0129] Referring to
[0130] In step 1710, SiO.sub.2 and SiOx thin films are sequentially laminated on a substrate and then thermal treatment is performed at 1000° C. to 1200° C. in a nitrogen atmosphere, whereby the silicon quantum dots are formed in the SiO.sub.2 thin film. Here, x may be controlled to have a value of 0.8 to 1.6 and the sizes of the silicon quantum dots may be controlled to correspond to a value of x.
[0131] At step 1720, doped graphene is formed on the silicon quantum dot layer, thereby forming a hybrid structure.
[0132] Step 1720 may include a step of forming graphene on a catalyst layer by reacting the catalyst layer with a mixed gas containing carbon and thus performing chemical vapor deposition (CND).
[0133] In addition, step 1720 may include a step of doping graphene by transferring the formed graphene onto the silicon quantum dot layer, spin-coating AuCl.sub.3 at a concentration of 10 to 30 mM, and performing annealing at 90° C. to 110° C.
[0134] In step 1730, an electrode is formed on upper and lower parts of the hybrid structure.
[0135] As described above, the present disclosure provides a photodiode including a graphene-silicon quantum dot hybrid structure and a method of manufacturing the same. Accordingly, a photodiode may be easily manufactured and may be fabricated over a large area, the photodiode has a wide photodetection band from the ultraviolet light region to the near infrared region, and selective absorption energy control is possible.
[0136] In addition, due to provision of the photodiode including a graphene-silicon quantum dot hybrid structure and the method of manufacturing the same, the performance of the photodiode may be optimized by controlling the doping concentration of graphene and thus controlling the Fermi level of the graphene.
[0137] In addition, the present disclosure may increase the performance of the photodiode by controlling the sizes of silicon quantum dots and thus controlling the energy bandgap thereof.
[0138] Further, the present disclosure provides an ideal photodiode including a graphene-silicon quantum dot hybrid structure which may be utilized in photodiode-based optoelectronic devices.
[0139] Although exemplary embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. For example, proper result may be achieved even if the techniques described above are implemented in an order different from that for the disclosed method, and/or disclosed constituents such as a system, structure, device and circuit are coupled to or combined with each other in a form different from that for the disclosed method or replaced by other constituents or equivalents.
[0140] It should be understood, however, that there is no intent to limit the invention to the embodiments disclosed, rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the claims,