METHOD FOR ATTACHMENT OF A BALANCE SPRING FOR A MECHANICAL TIMEPIECE MOVEMENT AND BALANCE SPRING ATTACHED BY SUCH A METHOD

Abstract

Method for attachment of a last outer coil of a timepiece balance spring inside a groove provided in a balance spring stud, wherein the method includes the step of adhesive bonding the last outer coil of the timepiece balance spring by means of a fluid adhesive whose viscosity is comprised between 200 and 400 mPa.Math.s.

Claims

1. A Method for attachment of a last outer coil of a timepiece balance spring in a balance spring stud, wherein the method includes the step of adhesive bonding the last outer coil of the timepiece balance spring by means of a fluid adhesive whose viscosity is comprised between 200 and 400 mPa.Math.s.

2. The method according to claim 1, wherein the last outer coil of the timepiece balance spring is adhesive bonded inside a groove provided in the balance spring stud.

3. The attachment method according to claim 1, wherein the fluid adhesive is cured by means of ultraviolet irradiation.

4. The attachment method according to claim 2, wherein the fluid adhesive is cured by means of ultraviolet irradiation.

5. The attachment method according to claim 1, wherein the fluid adhesive is an adhesive that hardens on contact with the air.

6. The attachment method according to claim 2, wherein the fluid adhesive is an adhesive that hardens on contact with the air.

7. A balance spring for a timepiece movement formed of a winding of concentric coils and comprising a last outer coil attached in a balance spring stud by the method according to claim 1, wherein the last outer coil ends in a plate which is thicker than the other coils of the balance spring, wherein the plate is provided with at least one notch to promote the adhesion of the fluid adhesive once the latter has hardened.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features and advantages of the present invention will appear more clearly from the following detailed description of an example implementation of the method according to the invention, this example being given purely by way of non-limiting illustration with reference to the annexed drawing, in which:

[0018] FIGS. 1A and 1B are general perspective views of an oscillating system for a timepiece movement to which the present invention applies.

[0019] FIGS. 2A and 2B schematically illustrate a balance spring whose outer end is bonded to a stud by means of a light-curable adhesive.

[0020] FIG. 3 is a view of a timepiece balance spring whose last outer coil ends in a plate that is thicker than the other coils of the balance spring and in which are provided notches to promote the adhesion of the adhesive.

DETAILED DESCRIPTION OF AN EXAMPLE EMBODIMENT OF THE INVENTION

[0021] The present invention proceeds from the general inventive idea that consists in adhesive bonding the last outer coil of a balance spring onto a balance spring stud by means of a fluid adhesive whose viscosity is comprised between 200 and 400 mPa.Math.s. Indeed, it was observed that, when the last outer coil of the balance spring is adhesive bonded, for example by means of a hot melt adhesive, the viscosity of the adhesive is such that it exerts on the balance spring capillary forces that tend to move the balance spring away from its position of rest and to induce therein mechanical stresses which considerably hamper its rate accuracy. Conversely, with a sufficiently fluid adhesive, even if the balance spring moves away from its position of rest at the moment when the adhesive is deposited, the balance spring can spontaneously return to its position of rest free of any stress, before the adhesive hardens. Consequently, the rate accuracy of the balance spring is not affected by the operation that consists in the adhesive bonding thereof onto the stud.

[0022] According to a first variant embodiment of the invention, the adhesive used is a fluid adhesive that hardens on contact with the air. According to a second variant embodiment of the invention, the fluid adhesive is an adhesive that hardens by curing under the effect of exposure to ultraviolet irradiation.

[0023] A “photo-curable adhesive” means a polymeric adhesive capable of curing under the effect of ultraviolet irradiation. This is why photo-curable adhesives are usually designated by the term “UV adhesive”. Photo-curable adhesives have a great number of advantages: they are one-part adhesives, quick to cure and may, in some cases, do so without solvent, they are easy to apply, can produce heat-sensitive bonding and have no pot life. “Pot life” means the period of time in which a resin can be used before complete hardening, starting from the moment when the two constitutents of the resin are mixed, and the chemical reaction occurs.

[0024] Very broadly, a photo-curable adhesive consists of a base resin, a photo-activator and, if required, one or more additives.

[0025] The base resin, which may be a monomer or an oligomer, has well-defined functional groups which, after UV curing, will determine the physical and chemical properties of the resulting polymer. The curing reaction may be based either on radical mechanisms to which, for example, acrylic constituents are subjected, or on cationic mechanisms to which, for example, epoxy constituents are subjected. In the case of a radical reaction, the photo-curing ceases as soon as exposure to UV irradiation ends. Further, radical systems of the acrylic type are subject to oxygen inhibition. Conversely, in the case of a cationic reaction, the photo-curing continues even after UV irradiation stops and is not subject to oxygen inhibition. Further, it is possible to complete UV curing with a last heat curing step.

[0026] In the case of the present invention, we are concerned with curing reactions of both the radical and cationic type. To this end, the base resin may be selected from:

[0027] epoxide compounds which comprise cycloaliphatic epoxides and glycidyl epoxides, vinyl ethers and electron-rich vinyl compounds;

[0028] alcohols in combination with epoxide compounds, and

[0029] acrylic compounds.

[0030] It will be noted that the alcohols and polyols both react with the epoxides and acrylics as chain transfer agents, generally improving the cure speed of the formulations. It will also be noted that cycloaliphatic epoxide resins produce a faster cationic curing reaction than glycidyl epoxide resins since they have higher chain flexibility than the latter.

[0031] In addition to a base resin, the UV adhesive composition is completed by a photoinitiator. A photoinitiator is a molecule that absorbs light and forms a reactive chemical species. These photoinitiator compounds generally produce a superacid that allows the cross-linking of cationic systems. These systems are therefore inhibited in a base or wet medium. However, they are not inhibited by the presence of oxygen. Conventional cationic photoinitiators are notably:

[0032] diaryliodonium salts;

[0033] triarylsulfonium salts;

[0034] dialkylphenacylsulfonium salts.

[0035] These salts which react at short wavelengths (200-300 nm) may be used alone or in combination with photosensitizers, i.e. molecules capable of absorbing light and transferring the excitation to another molecule for greater efficiency.

[0036] Photoinitiators must have excellent reactivity, a suitable absorption spectrum, no yellowing, good stability, compatibility with monomers and substrates, minimum odor and be non-toxic.

[0037] The composition of a photo-curable adhesive may be completed by one or more additives, among which the following can be cited: coinitiators, i.e. molecules that do not participate in light absorption but which contribute to the production of reactive particles, antioxidants, UV stabilizers, reactive diluents, or adhesion promoters or surface active agents.

[0038] An example embodiment of the invention is illustrated in FIGS. 1A and 1B annexed hereto. These Figures represent an oscillating system for a timepiece movement designated as a whole by the general numeral reference 1. Oscillating system 1, mounted on a bridge 2 of the main plate of a timepiece movement, comprises a timepiece balance spring 4 formed of a very fine spring wound in concentric coils and which is attached via a first inner coil 6 (FIGS. 2B and 3) to a balance staff 8 by means of a collet 10 (FIGS. 2A, 2B and 3). Balance spring 4 is attached via a last outer coil 12 at an attachment point formed by a balance spring stud 14 carried by a stud holder or balance-cock 16.

[0039] Oscillating system 1 also comprises a balance 18 whose staff 8 is connected to a felloe 20 by means of radial arms 22. Balance staff 8 is pivoted between first and second bearings 24, only one of which is visible in the drawing, and which are pressed into bridge 2 and the main plate of the timepiece movement.

[0040] Further, oscillating system 1 comprises a double-roller 26 formed of a roller 28 that carries an impulse pin 30 and a safety-roller 32 in which is provided a notch 34.

[0041] The oscillating system finally comprises a pallet-lever 36 with staff 38 which is pivoted between first and second pivots 40, only one of which is visible in FIGS. 1A and 1B. Pallet-lever 36 consists of a lever 42 that connects a fork 44 to an entry arm 46 and to an exit arm 48. Fork 44 is formed of an entry horn 50 and an exit horn 52 between which extends a guard pin 54. The travel of fork 44 is limited by an entry banking pin and an exit banking pin (not visible in the drawing) which may be made in one-piece with a pallet-cock. Entry arm 46 and exit arm 48 respectively carry an entry pallet 56 and an exit pallet 58.

[0042] Finally, pallet-lever 36 cooperates with an escape wheel 60 comprising an arbor 62 of escape wheel 60 pivoted between first and second pivots 64.

[0043] According to the embodiment of the invention illustrated in FIGS. 2A and 2B, last outer coil 12 of balance spring 4 is adhesive bonded to stud 14 by means of a drop of photo-curable adhesive 66. This drop of adhesive is, for example, deposited by means of an automated dispensing device, such as a dispenser. The drop of photo-curable adhesive 66 is cured by exposure to light irradiation produced by an ultraviolet light source 68. Exposure to ultraviolet light is sufficient to cause complete curing of the adhesive. It will be noted that first inner coil 6 of balance spring 4 may also be bonded to collet 10 by means of the same conductive UV adhesive that the one employed for bonding balance spring 4 to stud 14.

[0044] As revealed by an examination of FIGS. 2A and 2B, last outer coil 12 of balance spring 4 is disposed in a groove 70 provided at the upper end of stud 14. In FIG. 2A, the drop of photo-curable adhesive 66 has been deposited using a dispenser and, under the effect of the projection force of the adhesive, the end of last outer coil 12 of balance spring 4 has moved slightly away from its position of rest and is touching the walls of groove 70, which is very detrimental to the rate accuracy of the balance spring. However, as seen in FIG. 2B, before the adhesive cures, the end of last outer coil 12 of balance spring 4 has spontaneously returned to its position of rest. This is made possible by the fact that photo-curable adhesive 66 is very fluid, its viscosity being comprised between 200 and 400 mPa.Math.s, such that the adhesive does not resist the spontaneous return movement of the end of balance spring 4 to its position of equilibrium. Consequently, the operation to attach balance spring 4 does not induce any mechanical stress in balance spring 4, which is very favourable for the rate accuracy of the latter.

[0045] According to another feature of the invention, last outer coil 12 of balance spring 4 ends in a plate 72 made in one-piece with the end of last outer coil 12 and which is thicker than the other coils of balance spring 4. Purely by way of example, the cross-section of the plate is 0.1×0.1 mm.sup.2 and its length L is 0.6 millimeters. It will also be observed that plate 72 is provided with at least one and, preferably, with two notches 74 to promote the adhesion of the adhesive once the latter has hardened. Finally, it will be observed that last outer coil 12 is not concentric with the other coils of balance spring 4. Last outer coil 12 moves away slightly from the centre of balance spring 4 so that the penultimate coil 68 that precedes it does not touch stud 14.

[0046] It goes without saying that the present invention is not limited to the embodiments that have just been described and that various simple modifications and variants can be envisaged by those skilled in the art without departing from the scope of the invention as defined by the annexed claims. It will be understood, in particular, that according to another variant embodiment of the invention, last outer coil 12 of balance spring 4 may be bonded to stud 14 by means of a drop of adhesive that hardens on contact with the air. The material used to make balance springs is usually an alloy based on cobalt, nickel and chromium. Such an alloy is ductile and must be resistant to corrosion. Recent developments however, propose balance springs made of silicon. Silicon balance springs are much more accurate than their steel predecessors. However, their cost price is substantially higher than that of steel balance springs. The term “silicon balance spring” means a balance spring made of a material including single crystal silicon, doped single crystal silicon, polycrystalline silicon, doped polycrystalline silicon, porous silicon, silicon oxide, quartz, silica, silicon nitride or silicon carbide. Of course, when the silicon-based material is in crystalline phase, any crystalline orientation may be used.

NOMENCLATURE

[0047] 1. Oscillating system [0048] 2. Bridge [0049] 4. Timepiece balance spring [0050] 6. First inner coil [0051] 8. Balance staff [0052] 10. Collet [0053] 12. Last outer coil [0054] 14. Balance spring stud [0055] 16. Stud-holder or balance-cock [0056] 18. Balance [0057] 20. Felloe [0058] 22. Radial arms [0059] 24. First and second bearings [0060] 26. Double-roller [0061] 28. Roller [0062] 30. Impulse pin [0063] 32. Safety roller [0064] 34. Notch [0065] 36. Pallet-lever [0066] 38. Staff [0067] 40. First and second pivots [0068] 42. Lever [0069] 44. Fork [0070] 46. Entry arm [0071] 48. Exit arm [0072] 50. Entry horn [0073] 52. Exit horn [0074] 54. Guard pin [0075] 56. Entry pallet [0076] 58. Exit pallet [0077] 60. Escape wheel [0078] 62. Arbor [0079] 64. First and second pivots [0080] 66. Photo-curable adhesive [0081] 68. Ultraviolet light source [0082] 70. Groove [0083] 72. Plate [0084] 74. Notches