SELF-PASSIVATING QUANTUM DOT AND PREPARATION METHOD THEREOF
20170247614 ยท 2017-08-31
Assignee
Inventors
Cpc classification
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
Y10S977/818
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/95
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/824
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/896
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/892
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/774
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
Abstract
The invention relates to a self-passivating quantum dot and a preparation method thereof. The quantum dot is doped with a self-passivating element M and the self-passivating element M ranges from 0.1 wt % to 40 wt % in content. The self-passivating element is selected from the group consisting of Al, Zr, Fe, Ti, Cr, Ta, Si, and Ni. The preparation method comprises the steps of: adding a quantum dot core and a solvent into a reaction vessel, controlling the temperature to be 100-120 DEG C. and vacuumizing the reaction vessel for 30-50 min; filling the reaction vessel with inert gas, and rising the temperature to 230-280 DEG C.; and injecting a coating material precursor solution into the reaction vessel for coating the quantum dot core according to the injection amount being 1 or 2 times by molar concentration of the quantum dot core element per hour to prepare the self-passivating quantum dot. The self-passivating element M is doped with the quantum dot core precursor solution in the form of an M precursor, or is doped with the coating material precursor solution. Compared with the prior art, the self-passivating quantum dot has better appearance and is significantly improved in photostability.
Claims
1. A self-passivating quantum dot, characterized in that the self-passivating quantum dot is doped with a self-passivating element M; wherein the self-passivating element M ranges from 0.1 wt % to 40 wt % in content; and the self-passivating element is selected from the group consisting of Al, Zr, Fe, Ti, Cr, Ta, Si, and Ni.
2. The self-passivating quantum dot according to claim 1, characterized in that the quantum dot is a core-shell structure or a non core-shell structure comprising a quantum dot core and a coating material coated outside of the quantum dot core.
3. The self-passivating quantum dot according to claim 1, characterized in that the self-passivating element M is doped in a material of the quantum dot core or doped in the coating material.
4. The self-passivating quantum dot according to claim 2, characterized in that the coating material is the same or different with the material of the quantum dot core.
5. The self-passivating quantum dot according to claim 2, characterized in that the outside of the quantum dot core comprises 1-20 layers of coating material; and thickness of the coating material is adjusted by regulating and controlling number of coating layer.
6. The self-passivating quantum dot according to claim 2, characterized in that the quantum dot core is a binary structure quantum dot core, a ternary structure quantum dot core or a quaternary structure quantum dot core.
7. The self-passivating quantum dot according to claim 6, characterized in that the binary structure quantum dot core is AX, wherein A is selected from a group consisting of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium and copper, and X is selected from a group consisting of sulfur, selenium, nitrogen, phosphorus, arsenic, tellurium and antimony; the ternary structure quantum dot core is A.sub.1A.sub.2X, wherein A.sub.1 and A.sub.2 are respectively one of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium or copper, A.sub.1 and A.sub.2 are different with each other, and X is selected from a group consisting of sulfur, selenium, nitrogen, phosphorus, arsenic, tellurium and antimony; the quaternary structure quantum dot core is A.sub.1A.sub.2A.sub.3X, wherein A.sub.1, A.sub.2 and A.sub.3 are respectively one of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium or copper, A.sub.1, A.sub.2 and A.sub.3 are different with each other, and X is selected from a group consisting of sulfur, selenium, phosphorus, arsenic, tellurium and antimony.
8. The self-passivating quantum dot according to claim 7, characterized in that the binary structure quantum dot core is cadmium selenide (CdSe) and indium phosphide (InP), and the ternary structure quantum dot core is copper indium sulfur (CuInS.sub.2).
9. The self-passivating quantum dot according to claim 2, characterized in that the coating material is selected from the group consisting of group II-VI, group II-V, group III-VI, group III-V, group IV-VI, group II-IV-V, and group II-IV-VI semiconductor material, comprising cadmium selenide (CdSe), zinc selenide (ZnSe), mercury selenide (HgSe), cadmium sulfide (CdS), zinc sulfide (ZnS), mercury sulfide (HgS), cadmium telluride (CdTe), zinc telluride (ZnTe), mercury telluride (HgTe), gallium nitride (GaN), indium nitride (InN), gallium phosphide (GaP), gallium antimonide (GaSb), indium gallium phosphide (InGaP), zinc cadmium selenide (ZnCdSe) and cadmium zinc sulfide (CdZnS).
10. The self-passivating quantum dot according to claim 9, characterized in that the coating material is cadmium sulfide (CdS) or zinc sulfide (ZnS).
11. A preparation method of the self-passivating quantum dot, characterized in that the preparation method comprises the following steps: (1) adding a quantum dot core and a solvent into a reaction vessel, controlling the temperature to be 100-120 DEG C. and vacuumizing the reaction vessel for 30-50 min; (2) filling the reaction vessel with inert gas, and rising the temperature to 230-280 DEG C.; (3) adopting an injection reaction method, injecting a coating material precursor solution into the reaction vessel for coating the quantum dot core according to the injection amount being 1 or 2 times by molar concentration of the quantum dot core element per hour to prepare the self-passivating quantum dot; the self-passivating element M is doped with the quantum dot core precursor solution in the form of an M precursor, or is doped with the coating material precursor solution. when a coating layer is multilayer, the step (3) is repeated, the coating material is continually performed outside of the self-passivating quantum dot prepared in step (3), and a core-shell structure with multilayer coating material coating the quantum dot core layer by layer.
12. The preparation method of the self-passivating quantum dot of claim 11, characterized in that the self-passivating element M precursor is a compound of M (M=Al, Zr, Fe, Ti, Cr, Ta, Ni, Si), comprising M chloride, M bromide, M fluoride, M nitrate, M sulfate, M perchlorate, M phosphate, M acetate, M formate, M oxalate, M propionate, trimethyl M, triethyl M, tripropyl M, triisopropyl M, tributyl M, tri-sec-butyl M, tri-tert-butyl M, tetraisopropyl M, M isopropoxide, M sec-butoxide or M acetylacetonate.
13. The preparation method of the self-passivating quantum dot according to claim 11, characterized in that the self-passivating element M precursor is isopropanol M or M acetylacetonate.
14. The preparation method of the self-passivating quantum dot according to claim 11, characterized in that the self-passivating quantum dot is processed by reagent peroxide to accelerate forming of a passivation layer, and the reagent peroxide is benzoyl peroxide.
15. The preparation method of the self-passivating quantum dot according to claim 11, characterized in that the self-passivating quantum dot is processed by a plasma generator to accelerate forming of the passivation layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0052] The preparation method of a self-passivating quantum dot, comprising the following steps:
[0053] (1) adding a quantum dot core and a solvent into a reaction vessel, controlling the temperature to be 100-120 DEG C. and vacuumizing the reaction vessel for 30-50 min;
[0054] (2) filling the reaction vessel with inert gas, and rising the temperature to 230-280 DEG C.;
[0055] (3) adopting an injection reaction method, injecting a coating material precursor solution into the reaction vessel for coating the quantum dot core according to the injection amount being 1 or 2 times of the quantum dot core per hour to prepare the self-passivating quantum dot.
[0056] If the quantum dot core is M-doped (M=Al, Zr, Fe, Ti, Cr, Ta, Si, Ni) or M-undoped, when the quantum dot core is coated, the coating material precursor solution contains or contains no M precursor, if the quantum dot core is M-undoped, the coating material precursor solution contains M precursor, so as to ensure M is doped in the quantum dot, and M ranges from 0.1 wt % to 40 wt % in content in the self-passivating quantum dot.
[0057] The quantum dot core can be a binary structure quantum dot core, a ternary structure quantum dot core or a quaternary structure quantum dot core, wherein the binary structure quantum dot core is AX, wherein A is selected from a group consisting of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium or copper, and X is selected from a group consisting of sulfur, selenium, nitrogen, phosphorus, arsenic, tellurium and antimony; the ternary structure quantum dot core is A.sub.1A.sub.2X, wherein A.sub.1 and A.sub.2 are respectively one of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium or copper, A.sub.1 and A.sub.2 are different with each other, and X is selected from a group consisting of sulfur, selenium, nitrogen, phosphorus, arsenic, tellurium and antimony; the quaternary structure quantum dot core is A.sub.1A.sub.2A.sub.3X, wherein A.sub.1, A.sub.2 and A.sub.3 are respectively one of cadmium, zinc, mercury, lead, tin, gallium, indium, calcium, barium or copper, A.sub.1, A.sub.2 and A.sub.3 are different with each other, and X is selected from a group consisting of sulfur, selenium, phosphorus, arsenic, tellurium and antimony. The coating material is selected from the group consisting group II-VI, group II-V, group III-V, group IV-VI, group II-IV-V, and group II-IV-VI semiconductor material, comprising cadmium selenide (CdSe), zinc selenide (ZnSe), mercury selenide (HgSe), cadmium sulfide (CdS), zinc sulfide (ZnS), mercury sulfide (HgS), cadmium telluride (CdTe), zinc telluride (ZnTe), mercury telluride (HgTe), indium nitride (InN), gallium nitride (GaN), gallium phosphide (GaP), gallium antimonide (GaSb), indium gallium phosphide (InGaP), zinc cadmium selenide (ZnCdSe) and cadmium zinc sulfide (CdZnS). 2-20 layers outside of the quantum dot core are coated.
[0058] For example if the quantum dot core is quantum dot CdSe, it can be obtained by high temperature injection method, comprising following steps:
[0059] (1) mixing 16 mmol of cadmium oxide, 16 ml of oleic acid and 40 ml of octadecene into a reactor, and vacuumizing the reactor for 30-50 min under 100-120 DEG C.;
[0060] (2) filling the reactor with nitrogen, rising the temperature to 280-300 DEG C., when the solution becomes clear, cooling to 270 DEG C.;
[0061] (3) rapid injecting 8 mmol of trioctylphosphine-selenium solution into the reactor, cooling to 240 DEG C., reacting for 3-5 min, cleaning and obtaining CdSe quantum dot.
[0062] If the self-passivating quantum dot core is doped with binary structure CdSe, it can be obtained by high temperature injection method, comprising following steps:
[0063] (1) adding 16 mmol of cadmium oxide, 16 ml of oleic acid, 1.6 mmol of M isopropoxide and 40 ml of octadecene into a reactor, and vacuumizing the reactor for 30-50 min under 100-120 DEG C.;
[0064] (2) filling the reactor with nitrogen, rising the temperature to 280-300 DEG C., when the solution becomes clear, cooling to 270 DEG C.;
[0065] (3) rapid injecting 8 mmol of trioctylphosphine-selenium solution into the reactor, cooling to 240 DEG C., reacting for 3-5 min, cleaning and obtaining M-doped binary structure quantum dot CdSe.
[0066] The present invention is described in detail with reference to embodiments and drawings.
Embodiment 1
[0067] Preparation of Aluminum-Doped CdSe/CdS Core-Shell Structure Quantum Dot
[0068] Preparation of CdSe core quantum dot: adding 16 mmol of cadmium oxide, 16 ml of oleic acid, 1.6 mmol of oleic acid and 40 ml of octadecene into a three-necked flask, vaccumizing the flask for 30 min under 120 DEG C., rising the temperature to 290 DEG C. in the atmosphere of nitrogen, when the solution becomes clear, cooling to 270 DEG C.; rapid injecting 8 mmol of tris(trimethylsilyl)phosphine-selenium solution into the three-necked flask, cooling to 240 DEG C. and reacting for 3 min. After the reaction is completed, cleaning the CdSe quantum dot and taking it as a core quantum dot stock solution.
[0069] Adding 0.1 mmol of CdSe stock solution, 20 ml of octadecene into 100 ml of the three-necked flask, vaccumizing the flask for 30 min under 120 DEG C., rising the temperature to 280 DEG C. in the atmosphere of nitrogen; starting micro-injection pump under 230 DEG C., injecting aluminum and sulfur precursor solution and oleic acid cadmium solution into the flask, adjusting parameters of injection pump, so that the generated CdS per hour is 2 times by molar weight of CdSe. In whole reaction, aluminum is injected by molar weight according to 0.5-2 times of Cd in CdS.
Embodiment 2
[0070] Preparation of Aluminum-Doped CIS/ZnS Core-Shell Structure Quantum Dot
[0071] Preparation of CIS core quantum dot: placing 0.5032 mmol of cuprous iodide, 0.5497 mmol of indium acetate, 60 ml of N-dodecyl mercaptan, 40 ml of octadecene and 0.5 ml of oleylamine into 250 ml of three-necked flask. After filling nitrogen for 20 min, heating the temperature to 100 DEG C., keeping the temperature for 1 h until the solution in the flask becomes clear and transparent, rising the temperature to 230 DEG C. with rate of 13 DEG C./min, starting timing, stopping reaction after 1 h, cooling and taking it as core quantum dot stock solution.
[0072] Adding 0.1 mmol of CIS stock solution, 20 ml of octadecene into 100 ml of the three-necked flask, vaccumizing the flask for 30 min under 120 DEG C. Starting micro-injection pump to 230 DEG C. in the atmosphere of nitrogen, injecting aluminum and sulfur precursor solution and oleic acid zinc solution into the flask, adjusting parameters of injection pump, so that the generated ZnS per hour is 2 times by molar weight of CIS. In whole reaction, aluminum is injected by molar weight according to 0.5-2 times of Zn.
Embodiment 3
[0073] Preparation of Cr-Doped InP/ZnS Core-Shell Structure Quantum Dot
[0074] Preparation of InP core quantum dot: placing 0.2 mmol of indium acetate, 8 ml of octadecene, and 0.6 mmol of myristic acid into 100 ml of three-necked flask. After filling nitrogen for 20 min, heating the temperature to 100 DEG C., keeping the temperature for 1 h until the solution in the flask becomes clear and transparent, rising the temperature to 270 DEG C. with rate of 13 DEG C./min, rapid injecting 0.1 mmol of tris(trimethylsilyl)phosphine solution into the three-necked flask, cooling to 250 DEG C. and reacting for 20 min. After the reaction is completed, cleaning the indium phosphide quantum dot and taking it as a core quantum dot stock solution.
[0075] Adding 0.1 mmol of InP core quantum dot stock solution, 20 ml of octadecene into 100 ml of three-necked flask, vaccumizing the flask for 30 min under 120 DEG C., starting micro-injection pump to 230 DEG C. in the atmosphere of nitrogen, injecting Cr and sulfur precursor solution and oleic acid zinc solution into the flask, adjusting parameters of injection pump, so that the generated ZnS per hour is 2 times by molar weight of InP. In whole reaction, Cr is injected by molar weight according to 0.5-2 times of Zn. The structure of prepared Cr-doped InP/ZnS core-shell quantum dot is regular, and the quantum dot size is distributed evenly.
Embodiment 4
[0076] Photostablity Test of Aluminum-Doped CdSe/CdS Core-Shell Structure Quantum Dot;
[0077] Preparing 450 nm of CdSe/CdS quantum dot and aluminum-doped CdSe/CdS quantum dot toluene solution with 0.1 absorbance and the same coating layer, adding solution of same volume in sealed test bottle respectively, placing the bottle in blue light plane light source (450 nm, Philips) of 0.2 A and 50V (10 W, energy density is 0.35 W/cm.sup.2), taking out quantitive sample after a period of time, testing the fluorescence spectrum, integrating and obtaining corresponding fluorescence peak intergral area, and intensity-time decay curve is made by the comparison of the intergral area and initial fluorescence peak intergral area.
Embodiment 5
[0078] Photostablity Test of Aluminum-Doped CIS/ZnS Core-Shell Structure Quantum Dot;
[0079] Preparing 450 nm of CIS/ZnS quantum dot and aluminum-doped CIS/ZnS quantum dot toluene solution with 0.1 absorbance and the same CIS coating layer, adding solution of same volume in sealed test bottle respectively, placing the bottle in blue light plane light source (450 nm, Philips) of 0.2 A and 50V (10 W, energy density is 0.35 W/cm.sup.2), taking out quantitive sample after a period of time, testing the fluorescence spectrum, integrating and obtaining corresponding fluorescence peak intergral area, and intensity-time decay curve is made by the comparison of the intergral area and initial fluorescence peak intergral area.
Embodiment 6
[0080] Preparation of Fe-Doped CdSe/CdTe Core-Shell Structure Quantum Dot
[0081] a. Preparation of Quantum Dot CdSe
[0082] (1) mixing 16 mmol of cadmium oxide, 16 ml of oleic acid and 40 ml of octadecene into a reactor, and vacuumizing the reactor for 50 min under 100 DEG C.;
[0083] (2) filling the reactor with nitrogen, rising the temperature to 280 DEG C., when the solution becomes clear, cooling to 270 DEG C.;
[0084] (3) rapid injecting trioctylphosphine-selenium solution into the reactor, the molar ratio of the trioctylphosphine-selenium and the cadmium oxide is 1:2, cooling to 240 DEG C., reacting for 3 min, cleaning and obtaining CdSe quantum dot.
[0085] b. Preparation of Fe-Doped CdSe/CdTe Core-Shell Structure Quantum Dot
[0086] (1) adding binary structure quantum dot core CdSe and a solvent octadecene into a reaction vessel, controlling the temperature to be 100 DEG C. and vacuumizing the reaction vessel for 50 min;
[0087] (2) filling the reaction vessel with inert gas, and increasing the temperature to 230 DEG C.;
[0088] (3) adopting an injection reaction method, injecting a coating material precursor solution (including Fe precursor solution, Cd precursor solution and Te precursor solution) into the reaction vessel for coating the quantum dot core according to the injection amount being 1 times of the quantum dot core per hour to prepare the self-passivating quantum dot.
[0089] (4) adopting the same coating material precursor to repeat step (3) for 20 times, a layer of CdTe is coated again outside of the self-passivating quantum dot prepared in step (3), and obtaining two-layer coated Fe-doped CdSe/CdTe core-shell structure quantum dot, and Fe is 0.1 wt % in content.
Embodiment 7
[0090] A. the self-passivating quantum dot core is doped with binary structure CdSe is obtained by high temperature injection method, comprising following steps:
[0091] (1) adding 16 mmol of cadmium oxide, 16 ml of oleic acid, 1.6 mmol of M isopropoxide and 40 ml of octadecene into a reactor, and vacuumizing the reactor for 30 min under 120 DEG C. (M=Al, Zr, Fe, Ti, Cr, Ta, Si or Ni);
[0092] (2) filling the reactor with nitrogen, rising the temperature to 300 DEG C., when the solution becomes clear, cooling to 270 DEG C.;
[0093] (3) rapid injecting trioctylphosphine-selenium solution into the reactor, the molar ratio of the trioctylphosphine-selenium and the cadmium oxide is 1:2, cooling to 240 DEG C., reacting for 5 min, cleaning and obtaining aluminum-doped binary structure quantum dot core CdSe.
[0094] b. The preparation method of a self-passivating quantum dot, comprising the following steps:
[0095] (1) adding M-doped binary structure quantum dot core CdSe and a solvent octadecene into a reaction vessel, controlling the temperature to be 120 DEG C. and vacuumizing the reaction vessel for 30 min;
[0096] (2) filling the reaction vessel with inert gas, and rising the temperature to 280 DEG C.;
[0097] (3) adopting an injection reaction method, injecting a coating material precursor solution (including Zn precursor solution and S precursor solution) into the reaction vessel for coating the quantum dot core according to the injection amount being 2 times of the quantum dot core per hour to obtain M-doped CdSe/ZnS core-shell structure quantum dot.
[0098] (4) adopting different coating material precursor solution containing or containing no M precursor solution (M=Al, Zr, Fe, Ti, Cr, Ta, Si or Ni), 20 layers of coating material are sequentially coated outside of the M-doped CdSe/ZnS core-shell structure quantum dot, the doped M element in each layer of coating material is the same or different, and preparing the self-passivating quantum dot product, and in the product, aluminum is 40 wt % in content, the coating material precursor solution is soluable solution of element comprising coating material.
Embodiment 8
[0099] (1) preparing benzoyl peroxide toluene solution with concentration of 0.05 mmol/mL;
[0100] (2) adding 100 microliter of 0.05 mmol/mL benzoyl peroxide toluene solution into 2 ml of CdSe/CdS:Cr toluene solution, water bathing for 2 h under 60 DEG C., wherein the concentration of CdSe/CdS:Cr toluene solution is 15 mg/mL;
[0101] (3) cleaning CdSe/CdS:Cr quantum dot solution for comparing stability.
Embodiment 9
[0102] (1) spin coating CdSe/CdS:Cr toluene solution with concentration of toluene solution on silicon wafer;
[0103] (2) putting the silicon wafer into the plasma generator for processing 0.5 h, and dissolving in the toluene solution for stability test.
[0104] It should be emphasized that above disclosure are merely some embodiments, and are described for clear understanding the principle of the disclosure, many variations and modifications can be made to above embodiments without departing from the spirit and principle of the disclosure, and these variations and modifications shall be within the scope of the disclosure.