Method for forming an electrically conductive via in a substrate

Abstract

A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness R.sub.a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

Claims

1. Method for forming an electrically conductive via in a substrate, said method comprising the steps of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate, said through hole extending between a first surface and a second surface of said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating to form said electrically conductive via, wherein said electrically conductive material is deposited on said first surface of said second substrate, and f) removing said second substrate including said first surface of said second substrate on which said electrically conductive material is deposited, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness Ra of less than 2 nm, and in that in step (d) said first surface of said first substrate and said first surface of said second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

2. Method according to claim 1, wherein said second substrate is made of silicon or a metal.

3. Method according to claim 1, wherein said first substrate is made of glass or ceramic.

4. Method according to claim 1, wherein said first substrate is made of silicon, and wherein the method comprises step g), to be performed after step (b), of making the wall of said through hole electrically non-conductive.

5. Method according to claim 4, wherein step (g) is performed by oxidizing said wall.

6. Method according to claim 1, wherein said second substrate is made of highly doped silicon.

7. Method according to claim 6, wherein said highly doped silicon has a resistance lying in the range of 0.01-0.02 Ω/cm.

8. Method according to claim 1, wherein the method comprises the step, to be performed after step (a) and before step (d), of: h) forming a cavity in said first surface of said first substrate.

9. Method according to claim 8, wherein the method comprises the step, to be performed after steps (a) and (h) and before step (d), of: i) mounting a component in said cavity.

10. Method according to claim 9, wherein said component is an electrical, optical, mechanical or magnetic component.

11. Method according to claim 1, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness Ra of less than 1 nm.

12. Method according to claim 1, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness Ra of less than 0.5 nm.

Description

(1) The invention will now be explained in more detail with reference to figures illustrated in a drawing, wherein:

(2) FIGS. 1A-1G show the steps of a first embodiment of the method according to the invention,

(3) FIGS. 2A-2H show the steps of a second embodiment of the method according to the invention;

(4) FIGS. 3A-3H show the steps of a third embodiment of the method according to the invention.

(5) and

(6) FIGS. 4A-4I show the steps of a fourth embodiment of the method according to the invention.

(7) FIGS. 1A-1G, FIGS. 2A-2H, FIGS. 3A-3H and FIGS. 4A-4I show the steps of the method for forming an electrically conductive via in a substrate according to the invention. Corresponding features are denoted by corresponding reference numerals.

(8) In the first step, as shown in FIGS. 1A, and 2A, a first substrate 1 is provided. Said first substrate 1 comprises a first surface 3 having a surface roughness R.sub.a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm. Said first substrate 1 may for example be made of glass, ceramic or silicon.

(9) In the second step, which is shown in FIGS. 1B and 2B, a plurality of through holes 2 are formed in said first substrate 1, for example by means of powder blasting or etching. The through holes 2 extend between a first surface 3 and a second surface 4 of said first substrate 1.

(10) FIGS. 1C and 2C show a third step of the method, wherein a second substrate 5 is provided. Said second substrate 5 may be made of any (semi)conductive material with a first surface 6 having a surface roughness R.sub.a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm. For example, said second substrate 5 may be made of a metal. Alternatively, said second substrate 5 is made of silicon, preferably highly doped silicon having a resistance lying in the range of 0.01-0.02 Ω/cm. Such a silicon second substrate 5 is electrically conductive such that it is suitable for electroplating an electrically conductive material thereon. As such, no seed layer is required.

(11) Said second substrate 5 comprises a first surface 6 which is brought into direct contact (so without any intermediate layer, such as an adhesive layer) with said first surface 3 of said first substrate 1 by moving the second substrate 5 and the first substrate 1 in the direction of each other in a fourth step of the method. By bringing the first surfaces 3, 6 of respectively the first and second substrate 1, 5 into contact a direct bond between the two substrates 1, 5 is provided, see also FIGS. 1D and 2D. As a result of the direct bond between the two substrates 1, 5 no adhesive layer is required for attaching the two substrates 1, 5 to each other.

(12) Optionally the first surface 3 of the first substrate 1 and/or the first surface 6 of the second substrate 5 may be polished and/or cleaned prior to bringing them into contact with each other in order to increase the bonding strength between the two substrates 1, 5. Such polishing and surface cleaning is known per se and suitable conventional polishing and cleaning means may be used.

(13) As is shown in FIGS. 1D and 2D, the through holes 2 in said first substrate 1 are covered by said first surface 6 of said second substrate 5.

(14) In a fifth step, which is shown in FIGS. 1E and 2E, the through holes 2 in said first substrate 1 are filled with an electrically conductive material 7 by means of electroplating, wherein said electrically conductive material 7 is deposited on said first surface 6 of said second substrate 5. Said electrically conductive material 7 may be any metal that is suitable for forming a conductive via. For example, the material 7 may be chosen from the group comprising Copper (Cu), gold (Au) and Nickel (Ni). In order to deposit the material 7 on the electrically conductive second substrate 5 and not on the walls 8 of the through holes 2, the walls 8 must be electrically non-conductive. For example, glass and ceramic are electrically non-conductive materials, such that also the walls 8 of the through holes 2 of a glass or ceramic substrate 1 are non-conductive. In case of a first substrate 1, the walls 8 may for example be made electrically non-conductive by oxidizing the walls 8. Alternatively, a layer of a non-conductive material may be provided on the walls 8 (not shown).

(15) FIGS. 1E and 2E show two different types of filling the through holes, i.e. partial (FIG. 1E) and bumped (FIG. 2E). With partial filling the through holes 2 are filled with material 7 up to below the second surface 4 of the first substrate 1, such that the material 7 does not extend out of said through holes 2 beyond the second surface 4. With bumped filling the through holes 2 are filled with material 7 up to above the second surface 4 of the first substrate 1, such that the material 7 does extend out of said through holes 2 beyond the second surface 4, thereby forming little bumps on the surface 4.

(16) In a sixth step, see FIGS. 1F and 2F, the second substrate 5 is removed from the first substrate 1. As is clear from this figure, because of the direct bond between the two substrates 1, 5 and the absence of any adhesive layer, the material 7 does not extend out of the through holes 2 beyond the first surface 3. Removing of the second substrate 5 may take place relatively easy, because the process and material 7 are chosen such that the material 7 does not strongly attach to the second substrate 5.

(17) After removing the second substrate 5, the substrate 1 having electrically conductive vias 9 that is manufactured by means of the method according to FIGS. 1A-1F is finished, see FIG. 1G. It is not required to polish any of the surfaces 3, 4, because the material 7 does not extend out of the through holes 2 beyond any of the surfaces 3, 4.

(18) The substrate 1 having electrically conductive vias 9 that is manufactured by means of the method according to FIGS. 2A-2F may not yet be finished after removing the second substrate 5. Due to said described bumped filling of the through holes 2, the material 7 extends beyond the second surface 4, see FIG. 2G, such that polishing of the second surface 4 may be required. After polishing the second surface 4 is flat, see FIG. 2H. In accordance with the invention the first surfaced 3 does not need to be polished. Alternatively the bumps on the surface 4 may remain thereon, such that the substrate 1 of FIG. 2G may be the finished substrate.

(19) After removing the second substrate 5, the second substrate 5 may be reused for manufacturing another substrate 1. As such the method according to the invention is cost effective because the second substrate 5 may be reused and does not need to be thrown away after a single use. Also, because no seed layer is required it is not required to provide a new seed layer on the second substrate after use in the method for forming a via in a substrate, as may be the case with the conventional method as described above.

(20) The method according to FIGS. 3A-3H and FIGS. 4A-4I are similar to the method according to FIGS. 1A-1G. In particular, the step of FIGS. 3A and 4A is equal to the step of FIG. 1A, the step of FIGS. 3C and 4C is equal to the step of FIG. 1B, and the steps of FIGS. 3D-3H and 4E-4I are equal to the steps of FIGS. 1C-1G. For a description of the steps of FIGS. 3A, 3C, 3D-3H, 4A, 4C, 4E-4I the reader is referred to the description of FIGS. 1A-1G. The method according to FIGS. 3A-3H further comprises one additional step as shown in FIG. 3B, and the method according to FIGS. 4A-4I further comprises two additional steps as shown in FIGS. 4B and 4D, wherein the steps of FIGS. 3B and 4B are the same steps.

(21) In the step of FIGS. 3B and 4B two cavities 10 are formed in the first surface 3 of the first substrate 1. For example, said cavities 10 may be formed by means of powder blasting or etching. It is noted that any number of cavities 10 may be provided. The step of FIGS. 3B and 4B is performed after the first step of providing the first substrate as shown in FIGS. 3A and 4A. The step of FIGS. 3B and 4B is performed before, simultaneously with, or after the second step of forming the through holes 2 as shown in FIGS. 3C and 4C, wherein in this example the step of FIGS. 3B and 4B is performed before the second step as shown in FIGS. 3C and 4C.

(22) The method according to the invention, in which the step of polishing said first surface of said first substrate is eliminated, allows for the cavities 10 being present in the first surface.

(23) In the step of FIG. 4D two components 11 are mounted in the two cavities 10. Said components 11 may be electrical, optical, mechanical and/or magnetic components. The step of FIG. 4D is performed before the step of bringing the first surfaces 3, 6 of respectively the first and second substrate 1, 5 in to contact, as shown in FIGS. 4E and 4F. The step of FIG. 4D is preferably performed after the step of forming the through holes 2 as shown in FIG. 4C, such that the components cannot be damaged during the step of forming the through holes 2. It is clear that the step of FIG. 4D is performed after forming the cavities 10 of FIG. 4B.

(24) The method according to the invention, in which the step of polishing said first surface of said first substrate is eliminated, allows for the components 11 being present in the cavities 10 in the first surface.

(25) The invention is not restricted to the variants shown in the drawing, but it also extends to other preferred embodiments that fall within the scope of the appended claims.