DEVICE FOR HARDENING AN ELECTRICALLY CONDUCTIVE ADHESIVE

Abstract

A device for curing an electrically conductive adhesive arranged between a first component and a second component. The device includes at least one punch to both apply a compressive force onto the first component in the direction of the second component, and introduce a current into the adhesive via the components.

Claims

1-19. (canceled)

20. A method for producing an adhesively bonded connection between a first component and a second component, the method comprising: applying an electrically conductive adhesive between the first component and the second component; and curing the electrically conductive adhesive by applying a compressive force onto the first component in the direction of the second component, and introducing a current into electrically conductive adhesive via the first component and the second component.

21. The method of claim 20, wherein the electrically conductive adhesive is cured via heating due to the current.

22. The method of claim 20, wherein the current is introduced via the first component by a first punch.

23. The method of claim 20, wherein the current is introduced via the second component by a second punch.

24. The method of claim 20, wherein: the current is introduced via the first component by a first punch; and the current is introduced via the second component by a second punch.

25. The method of claim 20, further comprising: measuring a temperature of the first component; and regulating the current introduced via the first component according to the measured temperature.

26. The method of claim 25, wherein the temperature measurement is conducted by the first punch.

27. A method for producing an adhesively bonded connection, the method comprising: introducing an electrically conductive adhesive between a first component and a second component; and curing the electrically conductive adhesive to connect the first component and the second component, by applying a compressive force onto the first component and introducing a current into the first component and the second component.

28. The method of claim 26, wherein the current is introduced via the second component by a second punch.

29. The method of claim 26, wherein: the current is introduced via the first component by a first punch; and the current is introduced via the second component by a second punch.

30. The method of claim 26, further comprising: measuring a temperature of the first component; and regulating the current introduced via the first component according to the measured temperature.

31. The method of claim 30, wherein the temperature measurement is conducted by the first punch.

32. A method for producing a connection, the method comprising: introducing an electrically conductive adhesive between first components laterally spaced apart from each other, and a common second component; curing the electrically conductive adhesive to connect a first one of the first components and the second component, by applying a compressive force onto the first component and introducing a current into the first one of the first components; and curing the electrically conductive adhesive to connect a second one of the first components and the second component, by applying a compressive force onto the first component and introducing a current into the first one of the first components.

33. The method of claim 32, wherein the current is introduced into the first one of the first components via a first punch.

34. The method of claim 32, wherein the current is introduced into the second one of the first components via a second punch.

35. The method of claim 32, wherein: the current is introduced into the first one of the first components via a first punch; and the current is introduced into the second one of the first components via a second punch.

36. The method of claim 32, further comprising: measuring a temperature of the first one of the first components; and regulating the current introduced via the first one of the first components according to the measured temperature.

37. The method of claim 36, wherein the temperature measurement is conducted by the first punch.

38. The method of claim 32, further comprising: measuring a temperature of the second one of the first components; and regulating the current introduced via the second one of the first components according to the measured temperature.

39. The method of claim 38, wherein the temperature measurement is conducted by the second punch.

40. The method of claim 32, further comprising: measuring a temperature of the first one of the first components and regulating the current introduced via the first one of the first components according to the measured temperature; and measuring a temperature of the second one of the first components and regulating the current introduced via the second one of the first components according to the measured temperature.

Description

DRAWINGS

[0028] Embodiments will be illustrated by way of example in the drawings and explained in the description below.

[0029] FIG. 1 illustrates a schematic side view of a device to cure an electrically conductive adhesive, in accordance with the embodiments.

[0030] FIG. 2 illustrates a schematic side view of a device to cure an electrically conductive adhesive, in accordance with the embodiments.

[0031] FIG. 3 illustrates a temperature curve at a bonding point in a method in accordance with the embodiments.

DESCRIPTION

[0032] As illustrated in FIG. 1, in accordance with embodiments, a device for curing an electrically conductive adhesive 1 which is arranged between an electrically conductive first component 2, such as, for example, a metal sheet, and an electrically conductive second component 3, such as, for example, a second metal sheet. The device forms a pair of tongs 7 with first and second punches 4, 6 arranged on the clamping jaws of the tongs 7. In a closed position of the tongs 7, the punches 4, 6 press from both sides onto the arrangement of the first component 2, adhesive 1, and the second component 3. This serves to press the components 2, 3 against the adhesive 1, so that the components 2, 3 are fixed and the components 2, 3 are prevented from slipping. In this case, the punches 4, 6 are additionally electrically connected to a voltage source (not illustrated), so that through the punches 4, 6 a current may be introduced into the components 2, 3 and the adhesive 1 in order to cure the adhesive.

[0033] When introducing the current, the temperature is measured by way of a temperature measuring unit 5 which is applied to the first punch 4, and which is to detect the heat produced thereby on the first component 2. The detection of the temperature and the regulation of the current supply may thereby take place automatically by a corresponding regulation unit. A possible temperature curve which is implemented by the regulation unit is illustrated in FIG. 3.

[0034] As illustrated in FIG. 2, in accordance with embodiments, a device for curing an electrically conductive adhesive 1 which is arranged between electrically conductive and spaced apart first components 2, and a common second component 3 used as a common mass point for at least two punches 4. To this end, the second component 3 is connected via an electrical connection 8 to a voltage source. A second pole is in this case formed by the at least two punches 4, which in turn, press the spaced apart first components 2 with a compressive force F against the adhesive 1 at at least two bonding points, and against the common second component 3. Both punches 4 may be provided with a temperature measuring unit 5. At each bonding point, the electrical power may be regulated so that the surface temperature at each individual bonding point corresponds to a desired temperature curve.

[0035] As illustrated in FIG. 3, a desired temperature curve at a bonding point and/or on the surface of a component 2 is provided, wherein the temperature T is indicated vertically and the time t horizontally. In each case, the temperature T may be determined via the temperature sensor(s) 5 (See FIGS. 1 and 2), and, using a control variable, electrical power may be regulated to the desired temperature curve, the respective heating curve. In the example illustrated, in a first time interval A, the bonding point is heated with a uniform gradient, for example at 50 degrees Celsius per minute. The time interval B represents a time period in which a uniform temperature T is maintained and the curing substantially takes place. At the end of the time interval B, the supply of electrical power is disconnected and the tongs opened and/or the punch(es) lifted away from the components. In the time interval C the components and the adhesive then cool. The duration of the time interval B may be varied depending on the desired degree of curing. For simple fixings, this time interval may, for example, be only one minute or a few minutes.

[0036] The term “coupled” or “connected” may be used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms “first,” “second,” etc. are used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.

[0037] Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments may be implemented in a variety of forms. Therefore, while the embodiments have been described in connection with particular examples thereof, the true scope of the embodiments should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.

LIST OF REFERENCE SIGNS

[0038] 1 Adhesive

[0039] 2 First component

[0040] 3 Second component

[0041] 4 First punch

[0042] 5 Temperature measuring unit/sensor

[0043] 6 Second punch

[0044] 7 Pair of tongs

[0045] 8 Electrical connection

[0046] F Compressive force

[0047] T Temperature axis

[0048] t Time axis

[0049] A Time interval

[0050] B Time interval

[0051] C Time interval