A METHOD FOR FORMING A VIRTUAL GERMANIUM SUBSTRATE USING A LASER

Abstract

The present disclosure provides a method of manufacturing a semiconductor device. Furthermore the present disclosure provides a photovoltaic device and a light emitting diode manufactured in accordance with the method. The method comprises the steps of forming a germanium layer using deposition techniques compatible with high-volume, low-cost manufacturing, such as magnetron sputtering, and exposing the germanium layer to laser light to reduce the amount of defects in the germanium layer. After the method is performed the germanium layer can be used as a virtual germanium substrate for the growth of III-V materials.

Claims

1. A method for manufacturing a semiconductor device comprising the steps of: providing a substrate; forming a germanium layer over the substrate, the germanium layer having a concentration of lattice defects; exposing a region of the germanium layer to laser light; and forming at least one semiconductor device on a surface portion of the exposed region of the germanium layer; wherein the step of exposing the region of the germanium layer to laser light is conducted in a manner such that the concentration of lattice defects at the surface portion is reduced.

2. The method in accordance with claim 1 wherein the concentration of lattice defects in the germanium layer after the method is performed is less than 10.sup.7 defects/cm.sup.2.

3. The method in accordance with claim 1 wherein the step of exposing the region of the germanium layer to laser light is conducted such that at least a portion of the region of the germanium layer melts during exposure.

4. The method in accordance with claim 3 wherein the melted portion comprises the surface portion.

5. The method in accordance with claim 3 wherein the germanium layer forms an interface with the substrate and the melted portion extends from the surface portion to the interface.

6. The method in accordance with claim 3 wherein the germanium layer forms an interface with the substrate and the melted portion extends only partially into the region of the germanium layer without reaching the interface.

7. The method in accordance with claim 1 wherein the step of forming a germanium layer comprises the step of sputtering Ge, from a sputtering target containing Ge, onto the substrate.

8-11. (canceled)

12. The method in accordance with claim 1 wherein the method comprises the step of depositing a dielectric layer onto the germanium layer prior to exposing a region of the germanium layer to laser light and wherein the region of the germanium layer is exposed to laser light through the dielectric layer.

13. The method in accordance with claim 12 wherein the thickness of the dielectric layer is selected based on the wavelength of the laser light.

14. (canceled)

15. The method in accordance with claim 1 wherein the step of exposing a region of the germanium layer to laser light comprises the step of generating a continuous-wave laser beam and directing the continuous-wave laser beam towards a first portion of the germanium layer.

16. The method in accordance with claim 15 wherein the first portion is located at an edge of the germanium layer.

17. The method in accordance with claim 15 wherein the method further comprises the step of moving the laser beam along the germanium layer from the first portion to a second portion at a velocity comprised between 10 mm/min and 1000 mm/min.

18. (canceled)

19. The method in accordance with claim 15 wherein the portion of the germanium laser exposed to the laser beam temporary melts, while the portion is exposed to the laser beam, and quickly recrystallises after the laser beam moves away from the portion.

20. The method in accordance with claim 19 wherein the melted germanium portion recrystallises with a crystallographic structure and a concentration of defects similar to an adjacent germanium portion that has previously recrystallised.

21. The method in accordance with claim 19 wherein the region of the germanium layer is exposed to the laser beam for an overall time between 10 ms and 500 ms.

22. The method in accordance with claim 15 wherein the laser beam energy density is between 80 J/cm.sup.2 and 350 J/cm.sup.2.

23-25. (canceled)

26. The method in accordance with claim 1 wherein the method further comprises the step of heating the substrate and the germanium layer to a temperature comprised between 400° C. and 700° C. during the exposure of a region of the germanium layer to laser light.

27-28. (canceled)

29. The method in accordance with claim 26 wherein the substrate is a silicon crystalline wafer with a crystallographic orientation.

30. The method in accordance with claim 1 wherein the step of forming at least one semiconductor device onto a surface portion of the region of the germanium layer comprises the step of growing a plurality of layers comprising III-V compound materials.

31. The method in accordance with claim 30 wherein the plurality of layers comprising III-V compound materials form a multiple junction III-V solar cell with an energy conversion efficiency above 30%.

32-35. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Features and advantages of the present invention will become apparent from the following description of embodiments thereof, by way of example only, with reference to the accompanying drawings in which:

[0033] FIGS. 1 and 2 are flow diagrams outlining the basic steps required to manufacture a photovoltaic device in accordance with embodiments;

[0034] FIG. 3 is a schematic illustration of a device exposed to laser light in accordance with an embodiment;

[0035] FIG. 4 shows schematic representations of photovoltaic devices in accordance with embodiments.

[0036] FIGS. 5 and 6 show TEM cross sectional images of germanium layers manufactured in accordance with an embodiment;

[0037] FIG. 7 shows TEM cross sectional images of germanium layers manufactured in accordance with an embodiment (a) and a plot representing the normalized peak temperatures of a germanium layer manufactured in accordance with an embodiment (b);

[0038] FIG. 8 shows a Raman comparison between a germanium layer as-deposited and a germanium layer annealed in accordance with embodiments.

[0039] FIG. 9 shows schematic representations of a light emitting diode device in accordance with embodiments.

DETAILED DESCRIPTION OF EMBODIMENTS

[0040] Embodiments of the present invention relate to a method of manufacturing a semiconductor device using a germanium layer. The method comprises a step of forming the germanium layer and a step of exposing a region of the germanium layer to laser light. The exposure to laser light allows reducing the concentration of defects in the germanium layer. After the exposure, the quality of the germanium layer is such that III-V semiconductor materials can be grown onto the germanium layer to form a solar cell or a light emitting diode. During the exposure of the germanium layer to laser light the concentration of defects, in particular threading dislocation defects, is reduced so that the crystalline properties of the surface portion of the germanium layer, where the semiconductor device is formed, are improved.

[0041] Epitaxial germanium layers are generally used for the growth of III-V based high efficiency solar cells. They provide a small lattice mismatch (0.08%) and almost no thermal expansion mismatch with GaAs.

[0042] The method disclosed herein allows forming a germanium layer with a surface portion with a crystalline quality which is close to crystalline bulk germanium layers using deposition techniques compatible with the costs and volume constraints typical of the photovoltaic industry, such as sputtering from a target containing germanium onto a crystalline silicon substrate.

[0043] Sputtered germanium layers generally contain a concentration of defects which is higher than crystalline bulk germanium layers. A contribution to this defect concentration is provided by the lattice mismatch between the crystalline silicon substrate and the germanium crystalline structure. This mismatch is about 4.2% between germanium and silicon and causes the generation of threading dislocation defects in the Ge layer.

[0044] By exposing the sputtered germanium layer to laser light at least a portion of the germanium layer melts. Typically, the laser light is directed to the surface of the germanium layer and moved across the germanium layer so that portions of the germanium layer are melted and ‘laterally’ recrystallise with a low concentration of defects.

[0045] As a result, the crystalline quality and the threading dislocation defects density at the surface become compatible with the growth of gallium arsenide and hence the formation of a multiple junction III-V based high efficiency cell. The method effectively creates a ‘virtual germanium’ substrate for the growth of the III-V materials.

[0046] Properties of the laser light, such as intensity and wavelength, and the exposure time, can be controlled to modify the shape of the melted portion of the germanium layer. For example, the laser light can be controlled in a manner such that the portion of germanium at the interface with the substrate does not melt. Alternatively, the germanium layer can be melted through its entire thickness to provide a lower concentration of defects.

[0047] An advantage of melting the germanium layer partially is that the diffusion of silicon into the germanium layer is prevented. In theory, this diffusion may result in the formation of a SiGe alloy on the surface in the germanium layer increasing the lattice mismatch between the germanium layer and the III-V material. However the Applicants have found that, even by melting the germanium layer entirely, only a small amount of silicon diffuses in the germanium layer without affecting the performance of the germanium layer significantly and, at the same time, providing a lower amount of defects.

[0048] Referring now to FIG. 1, there is shown a flow-diagram 10 outlining the basic steps required to manufacture a semiconductor device in accordance with embodiments. A substrate is provided, step 12. A germanium layer is then formed over the substrate, step 14. A region of the germanium layer is then exposed to laser light, step 16. Finally, at least one semiconductor device is formed onto a surface portion of the region of the germanium layer, step 18.

[0049] FIG. 2 shows a flow-diagram 20 outlining the steps required to manufacture a photovoltaic device in accordance with an embodiment. In flow-diagram 20, a crystalline silicon substrate is provided, step 21. The germanium layer is then sputtered onto the crystalline silicon substrate, step 22. The difference in lattice parameters between the two materials generates threading dislocation defects in the germanium layer. The silicon substrate and the sputtered germanium layer are then heated to a temperature between 400° C. and 700° C., step 24. A LIMO continuous-wave diode laser beam with a beam energy density between 80 J/cm.sup.2 and 350 J/cm.sup.2 is scanned over a region of the heated germanium layer, step 26. Finally a multiple junction III-V solar cell is formed onto the exposed region of the germanium layer, step 28.

[0050] FIG. 3 shows a device 30 comprising a silicon crystalline substrate 32 and a sputtered germanium layer 34. The device 30 is heated to 600 ° C. and then exposed to a laser beam 36 from a LIMO continuous-wave (CW) diode laser 38. Laser 38 has line-focus optics, beam size of 12 mm×170 μm FWHM and the wavelength is 808 nm. A single laser beam 36 can be sized to cover width of the germanium layer from side to side. Alternatively an array of diode lasers 38 can be used. The laser beam 38 can be scanned on the germanium layer 34 multiple times at different velocities. Typically the scanning velocity is between 10 mm/min and 500 mm/min and the surface region of the germanium layer is exposed to the laser beam for an overall time between 10 ms and 500 ms. The typical laser beam energy density used is between 80 J/cm.sup.2 and 350 J/cm.sup.2. In an alternative embodiment, germanium layer 34 can be exposed to the laser beam through a dielectric layer, such as a SiO.sub.2 layer. The dielectric layer allows trapping a portion of the laser light in the germanium layer reducing the amount of power required to melt the germanium material. The thickness of the dielectric layer can be selected based on the wavelength of the laser light to optimise trapping of the laser light. In addition, a thicker dielectric layer may help to maintain the surface of the germanium layer smoother.

[0051] The germanium layer 34 is deposited by an AJA ATC2200 RF magnetron sputtering system equipped with a quartz halogen lamp substrate heater. Germanium is sputtered from a 4 inch intrinsic Ge target (99.999% purity) at a process pressure of 1 mT at a deposition rate of 5 nm/min. A rotation of 30 revolutions per minute is applied to the substrate during deposition to ensure the uniformity of the films.

[0052] FIG. 4 shows schematic representations of photovoltaic devices 40a and 40b manufactured in accordance with embodiments. Device 40a is a multi-junction III-V solar cell realised on the ‘virtual germanium’ substrate formed in accordance with embodiments. Device 40a comprises a silicon crystalline substrate 32a, which is an n-type silicon wafer, and laser annealed germanium layer 34a. The silicon substrate 32a is cleaned using RCA solutions followed by a HF dip before depositing the germanium layer. The germanium layer 34a is sputtered while silicon substrate 32a is kept at 300° C. and has a thickness of 300 nm. A 30 nm thick SiO.sub.2 capping layer (not shown) is deposited to protect the germanium layer 34a while it is transferred from the sputtering machine to another deposition machine. The SiO.sub.2 capping layer is chemically removed before the III-V solar cell is formed onto the germanium layer 34a.

[0053] The III-V solar cell comprises a bottom low bandgap III-V solar cell 45a, a middle III-V solar cell 46a with a bandgap higher than the bottom cell, and a top III-V solar cell 47a with a high bandgap which converts high energy photons. Device 40a also comprises a conductive layer 48a and electrical contacts 49a.

[0054] Device 40b is a multi-junction III-V solar cell comprising a silicon homojunction bottom cell. In this embodiment, a single junction solar cell 32b is realised first. Subsequently a germanium layer 34b is formed in accordance with embodiments. The device further comprised two III-V solar cells: a middle III-V solar cell 46b with a bandgap higher than the silicon solar cell 32b, and a top III-V solar cell 47b with a high bandgap which converts high energy photons. Device 40b also comprises a conductive layer 48b and electrical contacts 49b. The germanium layer 34b for device 40b is thinner than layer 34a as it has to absorb a minimum amount of photons.

[0055] FIGS. 5 and 6 show TEM cross sectional images of a germanium layer treated with laser radiation in accordance with embodiments. The germanium layer in FIGS. 5 and 6 is partially melted during the laser exposure. FIGS. 5(a) and 5(c) are bright field TEM views of germanium whilst FIGS. 5(b) and 5(d) are dark field TEM views. FIGS. 5(a) and 5(b) show the germanium layer before the exposure to laser light, whilst FIGS. 5(c) and 5(d) show the germanium layer after the exposure to laser light with a dose of 280 J/cm.sup.2 with a thin dielectric capping layer. FIGS. 5(a) and 5(b) show that the film before diode laser annealing (52) has a high threaded dislocation density which is estimated to be of the order of 10.sup.10 cm.sup.−2. After the diode laser exposure step, a top layer 57 which has a very low defect density and a defective bottom layer 58 can be observed in FIGS. 5(c) and 5(d). The threaded dislocation density of the exposed germanium layer is reduced by three orders of magnitude to 10.sup.7 cm.sup.−2.

[0056] The high quality surface is related to the partial melting of the germanium layer during the diode laser exposure. FIGS. 6(a) and 6(b) illustrate the ability of the continuous wave laser to control the melting depth of the germanium layer 34 by varying the scan times and laser power. FIG. 6(a) shows the depth of the melted germanium extending only partially into the region of the germanium layer without reaching the interface with the silicon substrate. The depth is 120 nm (62) after one laser scan. FIG. 6(b) shows the same sample after five scans resulting in a 180 nm (66) melted germanium layer.

[0057] FIG. 7(a) shows TEM cross sectional images of a germanium layer treated with laser radiation in accordance with embodiments. The germanium layer in FIGS. 7(a) has been entirely melted during laser exposure. Image 70 shows the silicon substrate 71 and the 200 nm sputtered germanium layer 72 before the exposure to laser light. Image 73 shows the silicon substrate 74 and the germanium layer 75 after the exposure to laser light with a dose of 80 J/cm.sup.2 through a SiO.sub.2 capping layer or 150 nm. A full melt is obtained despite the lower dose as a consequence of the light trapping created by the capping layer.

[0058] It is evident from FIG. 7(a) that germanium layer 75 has a much lower defect concentration than germanium layer 72. In particular germanium layer 72 has dislocation density in the order of 10.sup.10 cm.sup.−2; germanium layer 75 has dislocation density in the order of 10.sup.6-10.sup.7 cm.sup.−2.

[0059] FIG. 7(b) shows a plot 76 of the normalized peak temperatures of a 200 nm sputtered germanium layer exposed through a SiO.sub.2 capping layer of 150 nm for different laser doses.

[0060] With increasing laser dosage, the temperature of layer first increases linearly and then saturates at the melting temperature due to absorption of latent heat. A full melt can be obtained using low doses as a consequence of the light trapping created by the capping layer.

[0061] By meting the germanium layer entirely, silicon from the substrate may diffuse in the germanium layer. This may result in the formation of a SiGe alloy on the surface in the germanium layer which could increase the lattice mismatch between the germanium layer and the III-V material.

[0062] FIG. 8 shows a Raman plot 80 with two traces with the SiGe Raman peak for a germanium layer before 82 and after 84 a laser annealing with a dose of 80 J/cm.sup.2. The similarity of the peaks in plot 80 proves that, even by melting the germanium layer entirely, only a small amount of silicon diffuses in the germanium layer.

[0063] Referring now to FIG. 9, there is shown a schematic representation of a light emitting diode structure 90. The diode is formed by a series of III-V semiconductor layers and can emit light with wavelengths in the range 560 nm to 1100 nm. The III-V semiconductor layers are formed on a germanium layer 92 formed in accordance with embodiments. The germanium layer 92 is formed on a silicon substrate 93, a buffer layer 94 (which could be made of GaAs or GaInP) is formed on the germanium layer 92 and a DBR (Distributed Bragg reflector) layer 95, which can reflect the light generated from the light emitting layer 96, is formed on the buffer layer 94.

[0064] A light emitting structure comprising a first conductive type layer 97, a light emitting layer 96, and a second conductive type layer 98, is formed on the DBR layer 95.

[0065] Metallic contacts 99 are provided on the on the second conductive type layer 98 and on the backside of silicon wafer 93 to apply a voltage to the LED device. The lattice constants of 94, 95, 97 and 96 are similar to the lattice constant of germanium layer 92.

[0066] It will be appreciated by persons skilled in the art that numerous variations and/or modifications may be made to the invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.