COLOR FILTER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A color fitter substrate has a transparent base; a first transparent electrode layer; a black matrix having a plurality of black sections spaced from each other on the first transparent electrode layer; a second transparent electrode layer; and a color resistor layer, in sequence. A method for manufacturing the color filter substrate has steps of: forming a first transparent electrode layer on a transparent base; forming a black matrix having a plurality of black sections spaced from each other on the first transparent electrode layer; forming a second transparent electrode layer on the black sections and the first transparent electrode layer; and forming a color resistor layer on the second transparent electrode layer. The interference of the internal electric field is shielded by disposing the black sections between the first transparent electrode layer and the second transparent electrode layer.

Claims

1. A color filter substrate, comprising in sequence: a transparent base; a first transparent electrode layer formed on the transparent base; a black matrix comprising a plurality of black sections spaced from each other on the first transparent electrode layer; a second transparent electrode layer formed on the black sections and the first transparent electrode layer; and a color resistor layer formed on the second transparent electrode layer; wherein the black sections are disposed between the first transparent electrode layer and the second transparent electrode layer.

2. The color filter substrate according to claim 1, wherein the color filter substrate further comprises a protective plane formed on the color resistor layer.

2. or filter substrate according to claim 2, wherein the color filter substrate further comprises a plurality of space units spaced from each other on the protective plane and aligned to a portion of the black sections.

4. The color filter substrate according to claim 2, wherein a portion of the second transparent electrode layer is aligned to the black sections and directly contacts with the protective plane.

5. The color filter substrate according to claim 1, wherein the color resistor layer comprises a plurality of color resistor units and each of the color resistor units is disposed between two of the black sections adjacent to each other.

6. The color filter substrate according to claim 5, wherein a portion of the first transparent electrode layer is aligned to the color resistor units and is disposed between the second transparent electrode layer and the transparent base.

7. The color filter substrate according to claim 1, wherein a portion of the second transparent electrode layer is disposed between the first transparent electrode layer and the color resistor layer.

8. The color filter substrate according to claim 7, wherein the portion of the second transparent electrode layer directly contacts with the first transparent electrode layer.

9. The color filter substrate according to claim 1, wherein the first transparent electrode layer and the second transparent electrode layer commonly define a sealed space for containing at least one of the black sections.

10. A method for manufacturing a color filter substrate, comprising steps of: providing a transparent base; forming a first transparent electrode layer on the transparent base; forming a black matrix having a plurality of black sections spaced from each other on the first transparent electrode layer; forming a second transparent electrode layer on the black sections and the first transparent electrode layer; and forming a color resistor layer on the second transparent electrode layer; wherein the black sections are disposed between the first transparent electrode layer and the second transparent electrode layer.

11. The method according to claim 10, wherein after forming the color resistor layer, the method further comprises a step of: forming a protective plane on the color resistor layer.

12. The method according to claim 11, wherein the method further comprises a step of: forming a plurality of space units aligned to a portion of the black sections on the protective plane.

13. The method according to claim 11, wherein a portion of the second transparent electrode layer is aligned to the black sections and directly contacts with the protective plane.

14. The method according to claim 10, wherein the color resistor layer comprises a plurality of color resistor units and each of the color resistor units is disposed between two of the black sections adjacent to each other.

15. The method according to claim 14, wherein a portion of the first transparent electrode layer is aligned to the color resistor units and is disposed between the second transparent electrode layer and the transparent base.

16. The method according to claim 10, wherein a portion of the second transparent electrode layer is disposed between the first transparent electrode layer and the color resistor layer.

17. The method according to claim 16, wherein the portion of the second transparent electrode layer directly contacts with the first transparent electrode layer.

18. The method according to claim 10, wherein the first transparent electrode layer and the second transparent electrode layer commonly define a sealed space for containing at least one of the black sections.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG. 1 is a cross-sectional view of a color filter substrate according to one embodiment of the present invention.

[0030] FIG. 2 is a flowchart of a method for manufacturing a color filter substrate according to one embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] The detailed description of the following embodiments is used for exemplifying the specific embodiments of the present invention by referring to the accompany drawings. Furthermore, directional terms described by the present invention, such as upper, lower, front, back, left, right, inner, outer, side, etc., are only directions by referring to the accompanying drawings, and thus the directional terms are used to describe and understand the present invention, but the present invention is not limited thereto.

[0032] Referring to FIG. 1, which shows a cross-sectional view of a color filter substrate 10 according to one embodiment of the present invention. The color filter substrate 10 of the present invention can be applied to the IPS display technology for reducing, the interference to a black matrix from an electrostatic field or an alternating electric field caused by the IPS electric field. The color filter substrate 10 mainly comprises a transparent base 11; a first transparent electrode layer 12; a black matrix 13; a second transparent electrode layer 14; and a color resistor layer 15. The first transparent electrode layer 12 is formed on the transparent base 11. The black matrix 13 comprises a plurality of black sections 131 spaced from each other and arranged on the first transparent electrode layer 12. The second transparent electrode layer 14 is formed on the black sections 131 and the first transparent electrode layer 12. The color resistor layer 15 is formed on the second transparent electrode layer 14 and comprises a plurality of color resistor units 151. Each of the color resistor units 151 is disposed between two of the black sections 131 adjacent to each other. Preferably, the black sections 131 are disposed between the first transparent electrode layer 12 and the second transparent electrode layer 14.

[0033] Next, referring to FIG. 1, a portion of the first transparent electrode layer 12 is aligned to the color resistor units 151 and disposed between the second transparent electrode layer 14 and the transparent base 11. A portion 14a of the second transparent electrode layer 14 is disposed between the first transparent electrode layer 12 and the color resistor layer 15. The portion 14a of the second transparent electrode layer 14 directly contacts with the first transparent electrode layer 12. The first transparent electrode layer 12 and the second transparent electrode layer 14 commonly define a sealed space for containing at least one of the black sections 131

[0034] Subsequently referring to FIG. 1, the color filter substrate 12 according to one embodiment of the present invention can further comprise a protective plane 16 formed on the color resistor layer 15, and filling the intervals between the color resistor units 151 to form a flat surface. Preferably, a portion 14b of the second transparent electrode layer 14 is aligned to the black sections 131 and directly contacts with the protective plane 16. In addition, the color filter substrate 10 can further comprise a plurality of space units 17 spaced from each other on the protective plane 16 and aligned to a portion of the black sections 131.

[0035] Referring to FIG. 2. another embodiment of the present invention provides a method for manufacturing a color filter substrate, which mainly comprises steps of (S1) providing a transparent base 11; (S2) forming a first transparent, electrode layer 12 on the transparent base 11; (S3) forming a black matrix 13 having a plurality of black sections 131 spaced from each other on the first transparent electrode layer 12; (S4) forming a second transparent electrode layer 14 on the black sections 131 and the first transparent electrode layer 12; and (S5) forming a color resistor layer 15 on the second transparent electrode layer 14. Preferably, the black sections 131 are disposed between the first transparent electrode layer 12 and the second transparent electrode layer 14. In the step (S1), the transparent base 11 can be a glass substrate having a thickness ranged from about 0.4 to 1 mm. in the steps (S2) and (S4), the first transparent electrode layer 12 and the second transparent electrode layer 14 can be metal oxides (ex. ITO), graphene-based materials, polyaniline-based materials, or polypyrrole-based materials, which can be formed by, for example, magnetron sputtering, electrochemical atomic layer epitaxy, chemical vapor deposition, or physical vapor deposition. The first transparent electrode layer 12 and the second transparent electrode layer 14 respectively have a thickness of 20 to 300 nm. In the step (S3), the material of the black matrix 13 can be a composition of acrylic and black carbon materials, which is formed by imprinting, ink-jetting, or exposure after slit coating, but it is not limited thereto. In the step (S5), the color resistor layer 15 is for example formed by RGB color resistor materials and has a thickness ranged from 1.5 to 3 microns. The color resistor layer 15 can be formed by the lithography technology.

[0036] Preferably, according to the present invention, a portion of the first transparent electrode layer 12 of the color filter substrate 10 is aligned to the color resistor units 151 and disposed between the second transparent electrode layer 14 and the transparent base 11. In addition, a portion 14a of the second transparent electrode layer 14 is disposed between the first transparent electrode layer 12 and the color resistor layer 15. The portion 14a of the second transparent electrode layer 14 directly contacts with the first transparent electrode layer 12. The first transparent electrode layer 12 and the second transparent electrode layer 14 construct a sealed space for containing at least one of the black sections 131.

[0037] I addition to the above steps (S1) to (S5), the present invention comprises the steps: (S6) forming a protective plane 16; and (S7) forming a plurality of space units 17 on, the protective plane 16. The protective plane 16 can be formed by thermosetting overcoat materials or UV curing overcoat materials, such as a mixture having a main component of acrylic resins, with a thickness ranged from 1 to 3 microns. The intervals between the color resistor units 151 can be filled with the protective plane 16 to form a flat surface. A portion 14b of the second transparent electrode layer 14 is aligned to the black sections 131 and directly contacts with the protective plane 16. The space units 17 can be formed by using the lithography technology, and has a height ranged from 2.5 to 4 microns. The space units 17 are spaced from each other and arranged on the protective plane 16 as well as aligned to the positions corresponding with a portion of the black sections 131.

[0038] As mentioned above, the black matrix is covered and sandwiched by two layers of the transparent conductive layers, thereby effectively shielding the internal electric field generated from the black matrix, and further solving the problem of orientation behavior of the liquid crystal molecules disturbed by the internal electric field. Moreover, the defects such as green mura and light leakage caused by the black matrix using high carbon number materials can also be reduced.

[0039] The present invention has been described with preferred embodiments thereof and it is understood that many changes and modifications to the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.