DEVICE AND METHOD FOR RECOVERING TIN-LEAD SOLDER FROM SCRAP

Abstract

The invention relates to recovery of tin-lead solder from electronic printed circuit board scrap. The scrap is placed in a liquid-permeable and/or gas-permeable container, which is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder. After the tin-lead solder is melted, the heat-transfer medium is removed from the container, then, by means of rotation of the container, the melted tin-lead solder and the remains of the heat-transfer medium are removed from the container. The device comprises a hollow container, which is mounted so as to be capable of rotation and is designed in the form of a body of revolution, and is liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation. The container can be designed in the form of a drum, which can be vertically displaced and has perforated side walls.

Claims

1. A method for recovering tin-lead solder from electronic printed circuit board scrap, the method comprising: placing the scrap in a liquid-permeable and/or gas-permeable container, wherein the container is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder, and after the tin-lead solder is melted, removing the heat-transfer medium from the container, and rotating the container to remove the melted tin-lead solder and remains of the heat-transfer medium.

2. A device for recovering tin-lead solder from electronic printed circuit board scrap, comprising: a hollow container having a form of a solid of revolution, wherein the container is mounted so as to be rotatable and is liquid-permeable and/or gas-permeable in a radial direction from an axis of rotation of the container.

3. The device of claim 2, wherein the container is designed in the form of a drum.

4. The device of claim 1, wherein the container includes perforated side walls.

5. The device of claim 1, wherein the container is vertically displaceable.

Description

BRIEF DESCRIPTION OF THE ATTACHED FIGURES

[0011] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0012] In the drawings:

[0013] FIG. 1 shows a device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which can be vertically displaced and is located inside the container for the heat-transfer medium;

[0014] FIG. 2 shows the device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which can be vertically displaced and is located outside the container;

[0015] FIG. 3 shows the device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which is located inside the container for the heat-transfer medium and cannot be vertically displaced.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

[0017] FIG. 1 shows the device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which can be vertically displaced and is located inside the container for the heat-transfer medium. FIG. 2 shows the device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which can be vertically displaced and is located outside the container for the heat-transfer medium. FIG. 3 shows the device for recovering tin-lead solder from electronic printed circuit board scrap containing a hollow container, which is located inside the container for the heat-transfer medium and cannot be vertically displaced.

[0018] FIG. 1 has the following reference labels: 1—a hollow container, 2—permeable walls, 3—perforation, 4—a shaft, 5—the axis of rotation of the hollow container, 6—a container for the heat-transfer medium, 7—a heat-transfer medium, 8—motor.

[0019] The device for recovering tin-lead solder from electronic printed circuit board scrap is designed as follows.

[0020] The device for recovering tin-lead solder from electronic printed circuit board scrap contains a hollow container 1 designed from steel or stainless steel, in the form of a solid of revolution, with a diameter of about 270 mm (ranging from about 100 mm to about 3000 mm), a height of about 300 mm (ranging from about 100 mm to about 3000 mm), and a thickness of walls of about 1 mm (ranging from about 0.5 mm to about 10 mm). The hollow container 1 is mounted on a shaft 4 and is capable of rotating around the axis 5, at about 700 rpm (ranging from 60 to 2000 rpm). The container 1 rotates when driven by the motor 8. The walls 2 of the container 1 are liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation 5. Optionally, the container 1 can be designed in the form of a drum. Optionally, the container 1 is made permeable by means of perforation 3 of its side walls 2, with the perforations being about 3 mm diameter (ranging from about 1 mm to about 30 mm). Optionally, the container 1 can be vertically displaced, in the range of 100 mm-3000 mm of vertical displacement, so as to be able to fully immerse the container in the medium and to be able to raise the container fully above it. The device also contains a container 6 for the heat-transfer medium, having a diameter of about 300 mm (ranging from 100 mm to 3000 mm). Optionally, the container 6 for the heat-transfer medium has an open top. The medium can be polyethylene glycol or similar.

[0021] The method for recovering tin-lead solder from electronic printed circuit board scrap is carried out as follows.

[0022] Electronic printed circuit board scrap is placed in the liquid-permeable and/or gas-permeable container 1. The container 1 containing the scrap is then placed in a liquid or gaseous heat-transfer medium 7 heated to or above the melting temperature of the tin-lead solder. The container 1 containing the scrap can be placed in the heat-transfer medium 7, for instance, by vertically submerging the container 1 into the heat-transfer medium 7, or by filling the container 1 containing the scrap, which is first placed in a heat-transfer medium-tight container, with the heat-transfer medium 7. The heat-transfer medium 7 can be heated either in advance or after the container 1 containing the scrap is placed in the medium. The tin-lead solder is melted in the heated heat-transfer medium 7, at a temperature of about 160° C.-300° C. Then, after the tin-lead solder is melted, the heat-transfer medium 7 is removed from the container 1 containing the scrap.

[0023] The heat-transfer medium 7 is removed from the container 1 containing the scrap, for example, by vertically withdrawing the container from the medium 7 or by pumping it away. After that, by means of rotation of the container 1 and the resulting centrifugal force, the melted tin-lead solder and the remains of the heat-transfer medium 7 are removed from the container.

[0024] The device for recovering tin-lead solder from electronic printed circuit board scrap operates as follows.

[0025] Electronic printed circuit board scrap is placed into the hollow container 1, which, after that, is placed in a liquid or gaseous heat-transfer medium 7, heated to or above the melting temperature of the tin-lead solder, bringing the scrap into contact with the heat-transfer medium along the way. For example, the hollow container 1 can be put into the container 6 having an open top, which contains the heat-transfer medium 7, heated in advance above the melting temperature of the tin-lead solder. Otherwise, the scrap can be brought into contact with the heat-transfer medium 7 by pumping the medium into the container 1 containing the scrap, in which case the hollow container 1 is first placed in the heat-transfer medium-tight container 6, connected with feed and discharge lines for the heat-transfer medium 7.

[0026] The heat-transfer medium 7 can be heated either in advance or after the container 1 containing the scrap is placed in the medium, for example, by means of heating elements. The tin-lead solder is melted in the heated hat-transfer medium 7. Then, after the tin-lead solder is melted, the heat-transfer medium 7 is removed from the container 1 containing the scrap. The heat-transfer medium 7 is removed from the container 1 containing the scrap, for example, by vertically withdrawing the container 1 from the medium 7 or by pumping it away.

[0027] After that, by means of rotation of the container 1 and the resulting centrifugal force, the melted tin-lead solder and the remains of the heat-transfer medium 7 are removed from the container. The melt of the tin-lead solder is separated from the heat-transfer medium 7, for example, by means of decantation. By using a liquid or gaseous heat-transfer medium 7, it is possible to distribute the thermal energy evenly in the amount of electronic printed circuit board scrap. In the processing cycle of the claimed device, the scrap can fill the entire capacity of the hollow container 1. The electronic printed circuit board scrap to be processed may comprise either whole or crushed parts.

[0028] The technical result of the proposed technical solution is an increase in the productivity of the recovery of tin-lead solder from electronic printed circuit board scrap by means of the claimed method for recovering tin-lead solder from electronic printed circuit board scrap, characterized in that the scrap is placed in a liquid-permeable and/or gas-permeable container, which is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder, then, after the tin-lead solder is melted, the heat-transfer medium is removed from the container, then, by means of rotation of the container, the melted tin-lead solder and the remains of the heat-transfer medium are removed from the container, and also by means of the claimed device characterized in that it comprises a hollow container, which is designed in the form of a body of revolution and is mounted in such a way as to be capable of rotation, and is liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation, wherein the container is designed in the form of a drum, which has perforated side walls so as to be permeable and can be vertically displaced.

[0029] Having thus described a preferred embodiment, it should be apparent to those skilled in the art that certain advantages of the described method and apparatus have been achieved.

[0030] It should also be appreciated that various modifications, adaptations and alternative embodiments thereof may be made within the scope and spirit of the present invention. The invention is further defined by the following claims.