Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof

Abstract

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Claims

1. A compression-molded circuit board of camera module, comprising: a circuit and at least a circuit board body, wherein said circuit board body and said circuit are molded into an integral structure by compression-molding for electrically connecting a photosensitive chip of the camera module, wherein said circuit board body is formed by resin material which is solidified from a viscous fluid and integrally molded with said circuit.

2. The compression-molded circuit board, as recited in claim 1, wherein said circuit board body is molded from epoxy resin.

3. The compression-molded circuit board, as recited in claim 1, further comprising a reinforced member, wherein said circuit board body is made by press-molding said reinforced member, as a base material, with laminated resin.

4. The compression-molded circuit board, as recited in claim 3, wherein said resin is epoxy resin.

5. The compression-molded circuit board, as recited in claim 1, wherein said circuit board is made by cutting a whole piece of multiple circuit boards made by compression-molding into a plurality of said circuit boards.

6. The compression-molded circuit board, as recited in claim 4, wherein said circuit board is made by cutting a whole piece of multiple circuit boards made by compression-molding into a plurality of said circuit boards.

7. A camera module, comprising: an optical lens; a photosensitive chip; and a compression-molded circuit board which is made by compression-molding, wherein said compression-molded circuit board comprises a circuit and at least a circuit board body, wherein said circuit board body is formed by resin material which is solidified from a viscous fluid and integrally molded with said circuit, wherein said optical lens is provided in a photosensitive path of said photosensitive chip which is electrically connected with said compression-molded circuit board.

8. The camera module, as recited in claim 7, wherein said camera module is a fixed focal camera module.

9. The camera module, as recited in claim 7, further comprising a driver, wherein said optical lens is installed on said driver to form a zooming camera module.

10. (canceled)

11. The camera module, as recited in claim 7, wherein said circuit board body is made of epoxy resin.

12. The camera module, as recited in claim 7, wherein said circuit board further comprises a reinforced member, wherein said circuit board body is made by press-molding said reinforced member, as a base material, with laminated resin.

13. The camera module, as recited in claim 12, wherein said resin is epoxy resin.

14. The camera module, as recited in claim 7, further comprising a frame integrally formed with said circuit board by compression-molding.

15. The camera module, as recited in claim 14, further comprising an optical filter provided on said frame.

16. A manufacturing method of a camera module, comprising the steps of: (a) obtaining a circuit board by compression-molding in which resin material is solidified from a viscous fluid to form a circuit board body which is integrally molded with a circuit; and (b) electrically connecting a photosensitive chip to said circuit board and installing an optical lens in a photosensitive path of said photosensitive chip.

17. The manufacturing method, as recited in claim 16, wherein the step (a) further comprises a step of compression-molding said resin material and said circuit based on a reinforced member.

18. The manufacturing method, as recited in claim 17, wherein the step (a) further comprises a step of forming said circuit board with a structure of one more layers by compression-molding at least one layer of conductive member and at least one layer of said resin.

19. The manufacturing method, as recited in claim 17, wherein said resin is epoxy resin.

20. The manufacturing method of a camera module, as recited in claim 17, wherein the step (a) further comprises the steps of forming a whole piece of multiple circuit boards and cutting said whole piece of multiple circuit boards into multiple single circuit board boards and selecting a single circuit board as said circuit board obtained by compression-molding.

21. The manufacturing method of a camera module, as recited in claim 17, wherein the step (a) further comprises the steps of heating resin powder of said resin material to melt into said viscous fluid and then solidifying said viscous fluid by applying pressure and heat.

22. The manufacturing method of a camera module, as recited in claim 17, wherein the step (a) further comprises the steps of injecting melted resin material which is viscous fluid and then solidifying said viscous fluid by applying pressure and heat.

23. The manufacturing method of a camera module, as recited in claim 17, the step (a) further comprises a step of forming a frame which is integrally formed with said circuit board by compression-molding.

24. The manufacturing method of a camera module, as recited in claim 23, wherein said resin material is used to integrally form both of said frame and said circuit board body.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG. 1 illustrated a perspective view of a camera module according to a preferred embodiment of the present invention.

[0025] FIG. 2 illustrated an explosive view of the camera module according to the above mentioned preferred embodiment of the present invention.

[0026] FIG. 3 illustrated a perspective view of the circuit board when being compression-molded according to the above mentioned preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0027] The following description is disclosed to enable any person skilled in the art to make and use the present invention. Preferred embodiments are provided in the following description only as examples and modifications will be apparent to those skilled in the art. The general principles defined in the following description would be applied to other embodiments, alternatives, modifications, equivalents, and applications without departing from the spirit and scope of the present invention.

[0028] One skilled in the art can understand that in the detailed description of the present invention, the terminology used such as longitudinal, transverse, upper, lower, front, rear, left, right, vertical, horizontal, top, bottom, inner, outer and etc. are only to indicate the positional relationship according the orientation or positional relationship shown in the figures. It is only for the purpose the description, but not indicating that the device or the components must be manufactured or operated in a specific orientation, thus the above mentioned terms are not limitations of the present invention.

[0029] Referring to FIGS. 1 to 3, a camera module according to a preferred embodiment of the present invention is illustrated. The camera module comprises a frame 10, a circuit board 20, a light-sensitive sensor such as a photosensitive chip 30, an optical lens 40, and a driver such as a motor 50. One skilled in the art can understand that without the motor 50, the camera module can be embodied as a fixed-focal camera module.

[0030] As shown in the figures, the photosensitive chip 30 is provided on the circuit board 20. The frame 10 is installed on the circuit board 20. The optical lens 40 is mounted on the motor 50 which is mounted on the frame 10. So that the optical lens 40 is supported and positioned above the circuit board 20 in such a manner that the emitting light traveling through the optical lens 40 can be sensed by,the photosensitive chip 30.

[0031] Specifically, the optical lens 40 is mounted on the motor 50, and can be driven by the motor for auto-focusing. The circuit board 20 and the motor 50 are provided on the opposite side of the frame 10 respectively, which makes the optical lens 40 located along a photosensitive path of the photosensitive chip 30. When the camera module is used to capture image of an object, the reflect light of the object can be processed by the optical lens 40 and further be accepted by the photosensitive chip 30 for photoelectric conversion.

[0032] The circuit board 20 comprises a plurality of circuit board conductive members 21, a circuit board body 22 and a circuit 23, wherein the circuit board conductive members 21 are provided on the circuit board body 22 for electrically connecting the light-sensitive chip 30. The circuit 23 is provided on the circuit board body 22.

[0033] Specifically, the photosensitive chip 30 comprises a plurality of photosensitive chip conductive members and a photosensitive chip body, wherein the photosensitive chip conductive members are provided on the photosensitive chip body. The photosensitive chip conductive members are used to electrically connect the circuit board 20 and the circuit board conductive members 21, so as to ensure the electrical connection of the photosensitive chip 30 and the circuit board 20. Specifically, the photosensitive chip and the circuit board 20 are electrically connected by lead wires, or other electrical connection method such as soldering, ACP (anisotropic conductive paste) and hot-pressing. One skilled in the art would understand that the lead wire is for exemplary only and not intended to limit the present invention.

[0034] It is worth mentioning that, according to the present invention, the circuit board 20 is formed by compression-molding which is different from the conventional circuit board manufacturing method. More particularly, to manufacture the circuit board 20, layers of resin are laminated on a reinforced member 201 or copper board to form the circuit board body 22. In other words, the circuit board 21 is integrally formed by molding. During the molding process, different materials can be used for molding. In one embodiment of the present invention, it is preferably to use hot melting material or hot setting material such as epoxy resin. One skilled in the art can understand that the hot melting material or hot setting material such as epoxy resin is for exemplary only and not intended to limit the present invention.

[0035] More specifically, the compression-molded circuit board of the this embodiment manufactured by means of compression-molding. Specifically, electroplating circuit and film/resin film are added into the molding die. Then, resin material is filled, such as filling in resin powder or by injection. And finally close the mold and press to form the circuit board.

[0036] More particularly, according to the preferred embodiment of the present invention, as shown in FIG. 3, the reinforcing member 201 is received in a molding die (not shown), and then conductive member 202 is added together with resin material 203 such as resin powder. Then, the molding die is heated to a predetermined temperature. When the resin powder is melted with heat and becomes viscous fluid, under the effect of pressure, the viscous fluid flows and fills the inner cavity of the entire molding die. Then, while the temperature is increased continuously, the resin is crosslinked and its molecular weight is increased, so that the viscous fluid further loses its flowability and is solidified. The electrical and electronic components 204, such as resistors, capacitors and driver chip, can further be attached and connected with the conductive member 202 to form a complete circuit board 20.

[0037] It is appreciated that when the resin material 203 is added, it is also feasible to inject the melted resin material 203 into the molding die directly, and then by applying pressure and heat, the resin material 203 is solidified. It is also feasible to add a layer of conductive member 202 and a layer of resin material 203 repeatedly and overlappedly to form a multi-layer structure. The conductive member 202 and the electrical components 204 form the circuit 23 of the circuit board 20. The above mentioned electrical frame and the integral circuit board member can also be manufactured using the similar manufacturing method.

[0038] It is worth mentioning that the circuit board 21 manufactured by such molding method have advantages such as high flatness, ultra-thin, high integration, fine wire width, and etc., so that the contraction of configuration of the circuit parts and the increasing size of the circuit board can be solved. In one embodiment of the present invention, the circuit board body 22 manufactured by compression-molding as mentioned above have a good flatness. The wiring width could be 0.01 mm to 0.09 mm. : The thickness of the circuit board 20 could be 0.1 mm to 0.6 mm. The layers of the circuit board could be 2 to 10 layers. One skilled in the art will understand that all figures mentioned above is exemplary only and not intended to be limiting.

[0039] It is worth mentioning, the frame 10 could be manufactured in all predetermined shape according to the demands. In other words, the circuit board 20 with the photosensitive chip 30 can be assembled with a conventional frame, and the frame 10 can be further installed with an optical filter 70.

[0040] In addition, the frame 10 can be manufactured using above mentioned compression-molding technology. In other words, the circuit board 20 and the frame 10 can be manufactured using laminated resin as an integral. In compression-molding, a recess could be provided on the top of the circuit board 20 for mounting the photosensitive chip 30 therein.

[0041] It is worth mentioning that the circuit board 20 with the photosensitive chip 30 can be assembled with different types of camera module such as fixed-focal camera module, auto-focus camera module or zooming camera module. And further connected with a control panel in a variety of electrical device through a flexible PCB. One skilled in the art will understand the circuit board 20 is exemplary only and not intended to be limit the present invention.

[0042] It is also worth mentioning that, in the application of the circuit board 20, a single circuit board 20 can be manufactured independently to assemble together with other parts to constitute a camera module. A plurality of circuit boards 20 could be manufactured together using makeup method. That is forming an entire piece of the board with more than one piece of the circuit boards 20 by compression-molding process, and then the entire board is cut into multiple circuit boards 20. One skilled in the art will understand that the number of the circuit board 20 is exemplary only and not intended to be limit the present invention.

[0043] One skilled in the art will understand that the embodiment of the present invention as shown in the drawings and described above is exemplary only and not intended to be limiting.

[0044] It will thus be seen that the objects of the present invention have been fully and effectively accomplished. The embodiments have been shown and described for the purposes of illustrating the functional and structural principles of the present invention and is subject to change without departure from such principles. Therefore, this invention includes all modifications encompassed within the spirit and scope of the following claims.