High-K LTCC Dielectric Compositions And Devices

Abstract

Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.

Claims

1-14. (canceled)

15. A composition comprising a mixture of precursors that, upon firing, forms a dielectric material comprising: from about 20.0 wt % to about 45.0 wt % BaO; from about 10.0 wt % to about 38.0 wt % SrO; from about 15.0 wt % to about 47.0 wt % TiO.sub.2; from about 0.1 wt % to about 25.0 wt % WO.sub.3; and from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

16. The composition according to claim 15, wherein the mixture of precursors further comprises precursors such that, upon firing, the dielectric material further comprises at least one selected from the group consisting of: from about 0.1 to about 15.0 wt % ZnO; from about 0.1 to about 10.0 wt % B.sub.2O.sub.3; from about 0.01 to about 2.0 wt % LiF; from about 0.01 to about 2.0 wt % CuO; and from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

17. The composition according to claim 16 comprising a mixture of precursors that, upon firing, forms a dielectric material comprising: from about 20.0 wt % to about 45.0 wt % BaO; from about 10.0 wt % to about 38.0 wt % SrO; from about 15.0 wt % to about 47.0 wt % TiO.sub.2; from about 0.1 wt % to about 25.0 wt % WO.sub.3; from about 0.01 wt % to about 12.0 wt % SiO.sub.2; from about 0.1 to about 15.0 wt % ZnO; from about 0.1 to about 10.0 wt % B.sub.2O.sub.3; from about 0.01 to about 2.0 wt % LiF; from about 0.01 to about 2.0 wt % CuO; and from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

18. A lead-free and cadmium-free dielectric paste comprising a solids portion, wherein the solids portion comprises: from about 20.0 wt % to about 45.0 wt % BaO; from about 10.0 wt % to about 38.0 wt % SrO; from about 15.0 wt % to about 47.0 wt % TiO.sub.2; from about 0.1 wt % to about 25.0 wt % WO.sub.3; from about 0.01 wt % to about 12.0 wt % SiO.sub.2. from about 0.1 to about 17.0 wt % BaCO.sub.3; from about 0.1 to about 15.0 wt % ZnO; from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3; from about 0.01 to about 2.0 wt % LiF; from about 0.01 to about 2.0 wt % CuO; and from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

19. A method of forming an electronic component comprising: applying the composition of claim 15 to a substrate; and firing the substrate at a temperature sufficient to sinter the composition.

20. The method of claim 19, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

21. A method of forming an electronic component comprising: applying the composition of claim 16 to a substrate; and firing the substrate at a temperature sufficient to sinter the composition.

22. The method of claim 21, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

23. A method of forming an electronic component comprising: applying the composition of claim 17 to a substrate; and firing the substrate at a temperature sufficient to sinter the composition.

24. The method of claim 23, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

25. A method of forming an electronic component comprising: applying the dielectric paste of claim 18 to a substrate; and firing the substrate at a temperature sufficient to sinter the dielectric paste.

26. The method of claim 25, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

27. The composition according to claim 15, wherein the mixture of precursors further comprises further ingredients such that the composition further comprises at least one selected from the group consisting of: from about 0.1 to about 17.0 wt % BaCO.sub.3; from about 0.1 to about 15.0 wt % ZnO; from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3; from about 0.01 to about 2.0 wt % LiF; from about 0.01 to about 2.0 wt % CuO; and from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

28. The composition according to claim 27, comprising: from about 20.0 wt % to about 45.0 wt % BaO; from about 10.0 wt % to about 38.0 wt % SrO; from about 15.0 wt % to about 47.0 wt % TiO.sub.2; from about 0.1 wt % to about 25.0 wt % WO.sub.3; from about 0.01 wt % to about 12.0 wt % SiO.sub.2. from about 0.1 to about 17.0 wt % BaCO.sub.3; from about 0.1 to about 15.0 wt % ZnO; from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3; from about 0.01 to about 2.0 wt % LiF; from about 0.01 to about 2.0 wt % CuO; and from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

29. A method of forming an electronic component comprising: applying the composition of claim 27 to a substrate; and firing the substrate at a temperature sufficient to sinter the composition.

30. The method of claim 29, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

31. A method of forming an electronic component comprising: applying the composition of claim 28 to a substrate; and firing the substrate at a temperature sufficient to sinter the composition.

32. An electric or electronic component comprising, prior to firing, the composition of claim 15, together with a conductive paste comprising: 60-90 wt % Ag+Pd+Pt+Au, 1-10 wt % of an additive selected from the group consisting of silicides, carbides, nitrides, and borides of transition metals, 0.5-10 wt % of at least one glass frit, and 10-40 wt % of an organic portion.

33. An electric or electronic component comprising, prior to firing, the composition of claim 16, together with a conductive paste comprising: 60-90 wt % Ag+Pd+Pt+Au, 1-10 wt % of an additive selected from the group consisting of silicides, carbides, nitrides, and borides of transition metals, 0.5-10 wt % of at least one glass frit, and 10-40 wt % of an organic portion.

34. An electric or electronic component comprising, prior to firing, the dielectric paste of claim 17, together with a conductive paste comprising: 60-90 wt % Ag+Pd+Pt+Au, 1-10 wt % of an additive selected from the group consisting of silicides, carbides, nitrides, and borides of transition metals, 0.5-10 wt % of at least one glass frit, and 10-40 wt % of an organic portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0060] LTCC (Low Temperature Co-fired Ceramic), is a multi-layer, glass ceramic substrate technology which is co-fired with low resistance metal conductors, such as Ag, Au, Pt or Pd, or combinations thereof, at relatively low firing temperatures (less than 1000° C.). Sometimes it is referred to as “Glass Ceramics” because its main composition may consist of glass and alumina or other ceramic fillers. Some LTCC formulations are recrystallizing glasses. Glasses herein may be provided in the form of frits which may be formed in situ or added to a composition. In some situations, base metals such as nickel and its alloys may be used, ideally in non-oxidizing atmospheres, such as oxygen partial pressures of 10.sup.−12 to 10.sup.−8 atmospheres. It is also possible to fire the dielectric compositions disclosed herein in ambient air. A “base metal” is any metal other than gold, silver, palladium, and platinum. Alloying metals may include Mn, Cr, Co, and/or Al.

[0061] A tape cast from a slurry of dielectric material is cut, and holes known as vias are formed to enable electrical connection between layers. The vias are filled with a conductive paste. Circuit patterns are then printed, along with co-fired resistors as needed. Multiple layers of printed substrates are stacked. Heat and pressure are applied to the stack to bond layers together. Low temperature (<1000° C.) sintering is then undertaken. The sintered stacks are sawn to final dimensions and post fire processing completed as needed.

[0062] Multilayer structures useful in automotive applications may have about 5 ceramic layers, for example 3-7 or 4-6. In RF applications, a structure may have 10-25 ceramic layers. As a wiring substrate, 5-8 ceramic layers may be used.

[0063] Dielectric Pastes. A paste for forming the dielectric layers can be obtained by mixing an organic vehicle with a raw dielectric material, as disclosed herein. Also useful are precursor compounds (carbonates, nitrates, sulfates, phosphates) that convert to such oxides and composite oxides upon firing, as stated hereinabove. The dielectric material is obtained by selecting compounds containing these oxides, or precursors of these oxides, and mixing them in the appropriate proportions. The proportion of such compounds in the raw dielectric material is determined such that after firing, the desired dielectric layer composition may be obtained. The raw dielectric material (as disclosed elsewhere herein) is generally used in powder form having a mean particle size of about 0.1 to about 3 microns, and more preferably about 1 micron or less.

[0064] Organic Vehicle. The pastes herein include an organics portion. The organics portion is or includes an organic vehicle, which is a binder in an organic solvent or a binder in water. The choice of binder used herein is not critical; conventional binders such as ethyl cellulose, polyvinyl butanol, ethyl cellulose, and hydroxypropyl cellulose, and combinations thereof are appropriate together with a solvent. The organic solvent is also not critical and may be selected in accordance with a particular application method (i.e., printing or sheeting), from conventional organic solvents such as butyl carbitol, acetone, toluene, ethanol, diethylene glycol butyl ether; 2,2,4-trimethyl pentanediol monoisobutyrate (Texanol®); alpha-terpineol; beta-terpineol; gamma terpineol; tridecyl alcohol; diethylene glycol ethyl ether (Carbito n, diethylene glycol butyl ether (Butyl Carbitol®) and propylene glycol; and blends thereof, Products sold under the Texanol® trademark are available from Eastman Chemical Company, Kingsport, Tenn.; those sold under the Dowanol® and Carbitol® trademarks are available from Dow Chemical Co., Midland, Mich..

[0065] No particular limit is imposed on the organics portion of the dielectric pastes of the invention. In one embodiment the dielectric pastes of the invention include from about 10 wt % to about 40 wt % of the organic vehicle; in another, from about 10 wt % to about 30 wt %. Often the paste contains about 1 to 5 wt % of the binder and about 10 to 50 wt % of the organic solvent, with the balance being the dielectric component (solids portion). In one embodiment, the dielectric paste of the invention includes from about 60 to about 90 wt % of solids portion elsewhere disclosed, and from about 10 wt % to about 40 wt % of the organics portion described in this and the preceding paragraph. If desired, the pastes of the invention may contain up to about 10 wt % of other additives such as dispersants, plasticizers, dielectric compounds, and insulating compounds.

[0066] Filler. In order to minimize expansion mismatch between tape layers of differing dielectric compositions, fillers such as cordierite, alumina, zircon, fused silica, aluminosilicates and combinations thereof may be added to one or more dielectric pastes herein in an amount of 1-30 wt %, preferably 2-20 wt % and more preferably 2-15 wt %.

[0067] Firing. The dielectric stack (two or more layers) is then fired in an atmosphere, which is determined according to the type of conductor in the internal electrode layer-forming paste. Where the internal electrode layers are formed of a base metal conductor such as nickel and nickel alloys, the firing atmosphere may have an oxygen partial pressure of about 10.sup.−12 to about 10.sup.−8 atm. Sintering at a partial pressure lower than about 10.sup.−12 atm should be avoided, since at such low pressures the conductor can be abnormally sintered and may become disconnected from the dielectric layers. At oxygen partial pressures above about 10.sup.−8 atm, the internal electrode layers may be oxidized. Oxygen partial pressures of about 10.sup.−11 to about 10.sup.−9 atm are most preferred. However, reducing atmospheres (H.sub.2, N.sub.2 or H.sub.2/N.sub.2) can undesirably reduce Bi.sub.2O.sub.3 from a dielectric paste to metallic bismuth.

[0068] Applications for the LTCC compositions and devices disclosed herein include band pass filters, (high pass or low pass), electromagnetic interference filters, high Q resonators, wireless packaging systems, wireless transmitters and receivers for telecommunications including cellular applications, power amplifier modules (PAM), RF front end modules (FEM), WiMAX2 modules, LTE-advanced modules, transmission control units (TCU), electronic power steering (EPS), engine management systems (EMS), various sensor modules, radar modules, pressure sensors, camera modules, small outline tuner modules, thin profile modules for devices and components, and IC tester boards. Band-pass filters contain two major parts, one a capacitor and the other an inductor. Low K material is good for designing the inductor, but not suitable for designing a capacitor due the requirement for more active area to generate sufficient capacitance. High K material will result in the opposite.

EXAMPLES

[0069] The following examples are provided to illustrate preferred aspects of the invention and are not intended to limit the scope of the invention.

[0070] As seen in the tables below, appropriate amounts of BaCO.sub.3, SrCO.sub.3, TiO.sub.2, WO.sub.3 and SiO.sub.2, are mixed, then milled together in an aqueous medium to a particle size D.sub.50 of about 0.2 to 1.5 μm. This slurry is dried and calcined at about 800 to 1000° C. for about 1 to 5 hours to form the host material including BaO, SrO, TiO.sub.2, WO.sub.3 and SiO.sub.2. The resultant host material is then mechanically pulverized and mixed with fluxing agents and again milled in an aqueous medium to a particle size D.sub.50 of about 0.5 to 1.0 μm. The milled ceramic powder is dried and pulverized to produce a finely divided powder. The resultant powder is pressed into cylindrical pellets and fired at a temperature of about 880° C., for about 30 minutes. Formulations are given in weight percent.

TABLE-US-00001 TABLE 1 Host Compositions. Host A B BaO 30.85 wt % 34.07 wt % SrO 28.79 wt % 20.58 wt % TiO.sub.2 37.00 wt % 26.44 wt % WO.sub.3 2.98 wt % 16.78 wt % SiO.sub.2 0.38 wt % 2.13 wt %

TABLE-US-00002 TABLE 2 Dielectric Formulations 1-2. Formulation 1 2 Host A 80.81 wt % — Host B — 85.08 wt % Host C — — BaCO.sub.3 7.29 wt % 5.84 wt % ZnO 5.39 wt % 4.06 wt % H.sub.3BO.sub.3 5.46 wt % 4.17 wt % LiF 0.47 wt % 0.42 wt % CuO 0.47 wt % 0.35 wt % MnO.sub.2 0.11 wt % 0.09 wt %

[0071] Table 3 presents electrical properties of sintered disc of formulations 1 & 2 set forth in Tables 2 fired at 880° C. for 30 minutes.

TABLE-US-00003 TABLE 3 K, Q and Df Data for the disc of formulations 1 & 2 sintered at 880° C. for 30 minutes: Sintered Disc of Sintered Disc of Formulation 1 Formulation 2 K @ 1 MHz 407 K @ 1 MHz 204 Q @ 1 MHz 460 Q @ 1 MHz 201 Df % 0.2 Df % 0.5

[0072] Table 4 is the composition of the formulations 1 & 2 after heating at 880° C. for 30 minutes.

TABLE-US-00004 TABLE 4 Composition of formulations 1 & 2 after heating at 880° C. for 30 minutes: Formulation 1 after heating at Formulation 2 after heating at 880° C. for 30 minutes 880° C. for 30 minutes BaO 31.86 wt % 34.60 wt % SrO 24.24 wt % 18.07 wt % TiO.sub.2 31.15 wt % 23.22 wt % WO.sub.3 2.51 wt % 14.74 wt % SiO.sub.2 0.32 wt % 1.88 wt % ZnO 5.62 wt % 4.19 wt % B.sub.2O.sub.3 3.20 wt % 2.42 wt % LiF 0.49 wt % 0.43 wt % CuO 0.49 wt % 0.36 wt % MnO.sub.2 0.12 wt % 0.09 wt %

[0073] The invention is further illustrated by the following items.

[0074] Item 1. A composition comprising a mixture of precursors that, upon firing, forms a dielectric material comprising barium-strontium-titanium-tungsten-silicon oxide.

[0075] Item 2. The composition according to item 1, wherein the mixture further comprises precursors such that, upon firing, the dielectric material further comprises one or more dopants selected from the group consisting of zinc, boron, lithium, fluorine, copper and manganese.

[0076] Item 3. The composition according to items 1 or 2, wherein the dielectric material exhibits a dielectric constant greater than 100.

[0077] Item 4. The composition according to item 1 comprising a mixture of precursors that, upon firing, forms a dielectric material comprising:

[0078] from about 20.0 wt % to about 45.0 wt % BaO;

[0079] from about 10.0 wt % to about 38.0 wt % SrO;

[0080] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0081] from about 0.1 wt % to about 25.0 wt % WO.sub.3; and

[0082] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0083] Item 5. The composition according to item 4, wherein the mixture of precursors further comprises precursors such that, upon firing, result in the dielectric material further comprises at least one selected from the group consisting of:

[0084] from about 0.1 to about 15.0 wt % ZnO;

[0085] from about 0.1 to about 10.0 wt % B.sub.2O.sub.3;

[0086] from about 0.01 to about 2.0 wt % LiF;

[0087] from about 0.01 to about 2.0 wt % CuO; and

[0088] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0089] Item 6. The composition according to item 2 comprising a mixture of precursors that, upon firing, forms a dielectric material comprising:

[0090] from about 20.0 wt % to about 45.0 wt % BaO;

[0091] from about 10.0 wt % to about 38.0 wt % SrO;

[0092] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0093] from about 0.1 wt % to about 25.0 wt % WO.sub.3;

[0094] from about 0.01 wt % to about 12.0 wt % SiO.sub.2;

[0095] from about 0.1 to about 15.0 wt % ZnO;

[0096] from about 0.1 to about 10.0 wt % B.sub.2O.sub.3;

[0097] from about 0.01 to about 2.0 wt % LiF;

[0098] from about 0.01 to about 2.0 wt % CuO; and

[0099] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0100] Item 7. A lead-free and cadmium-free dielectric paste comprising a solids portion wherein the solids portion comprises:

[0101] from about 20.0 wt % to about 45.0 wt % BaO;

[0102] from about 10.0 wt % to about 38.0 wt % SrO;

[0103] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0104] from about 0.1 wt % to about 25.0 wt % WO.sub.3; and

[0105] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0106] Item 8. The lead-free and cadmium-free dielectric paste of item 7, further comprising, at least one selected from the group consisting of:

[0107] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0108] from about 0.1 to about 15.0 wt % ZnO;

[0109] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0110] from about 0.01 to about 2.0 wt % LiF;

[0111] from about 0.01 to about 2.0 wt % CuO; and

[0112] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0113] Item 9. A lead-free and cadmium-free dielectric paste comprising a solids portion wherein the solids portion comprises:

[0114] from about 20.0 wt % to about 45.0 wt % BaO;

[0115] from about 10.0 wt % to about 38.0 wt % SrO;

[0116] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0117] from about 0.1 wt % to about 25.0 wt % WO.sub.3;

[0118] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0119] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0120] from about 0.1 to about 15.0 wt % ZnO;

[0121] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0122] from about 0.01 to about 2.0 wt % LIF;

[0123] from about 0.01 to about 2.0 wt % CuO; and

[0124] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0125] Item 10. A method of forming an electronic component comprising: applying any dielectric paste of items 7-9 to a substrate; and firing the substrate at a temperature sufficient to sinter the dielectric paste.

[0126] Item 11. The method of item 10, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

[0127] Item 12. The method of item 10, wherein the firing is conducted in air.

[0128] Item 13. The composition according to item 1 comprising a mixture of precursors that, upon firing, forms a dielectric material comprising:

[0129] from about 20.0 wt % to about 45.0 wt % BaO;

[0130] from about 10.0 wt % to about 38.0 wt % SrO;

[0131] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0132] from about 0.1 wt % to about 25.0 wt % WO.sub.3; and

[0133] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0134] Item 14. The composition according to item 13, wherein the mixture of precursors further comprises at least one selected from the group consisting of:

[0135] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0136] from about 0.1 to about 15.0 wt % ZnO;

[0137] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0138] from about 0.01 to about 2.0 wt % LiF;

[0139] from about 0.01 to about 2.0 wt % CuO; and

[0140] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0141] Item 15. The composition according to item 14 wherein the mixture of precursors comprise:

[0142] from about 20.0 wt % to about 45.0 wt % BaO;

[0143] from about 10.0 wt % to about 38.0 wt % SrO;

[0144] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0145] from about 0.1 wt % to about 25.0 wt % WO.sub.3;

[0146] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0147] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0148] from about 0.1 to about 15.0 wt % ZnO;

[0149] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0150] from about 0.01 to about 2.0 wt % LIF;

[0151] from about 0.01 to about 2.0 wt % CuO; and

[0152] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0153] Item 16. A lead-free and cadmium-free dielectric paste comprising a solids portion wherein the solids portion comprises:

[0154] from about 20.0 wt % to about 45.0 wt % BaO;

[0155] from about 10.0 wt % to about 38.0 wt % SrO;

[0156] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0157] from about 0.1 wt % to about 25.0 wt % WO.sub.3; and

[0158] from about 0.01 wt % to about 12.0 wt % SiO.sub.2.

[0159] Item 17. The lead-free and cadmium-free dielectric paste of item 16, further comprising at least one selected from the group consisting of:

[0160] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0161] from about 0.1 to about 15.0 wt % ZnO;

[0162] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0163] from about 0.01 to about 2.0 wt % LIF;

[0164] from about 0.01 to about 2.0 wt % CuO; and

[0165] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0166] Item 18. A lead-free and cadmium-free dielectric paste comprising a solids portion wherein the solids portion comprises:

[0167] from about 20.0 wt % to about 45.0 wt % BaO;

[0168] from about 10.0 wt % to about 38.0 wt % SrO;

[0169] from about 15.0 wt % to about 47.0 wt % TiO.sub.2;

[0170] from about 0.1 wt % to about 25.0 wt % WO.sub.3;

[0171] from about 0.01 wt % to about 12.0 wt % SiO.sub.2;

[0172] from about 0.1 to about 17.0 wt % BaCO.sub.3;

[0173] from about 0.1 to about 15.0 wt % ZnO;

[0174] from about 0.1 to about 15.0 wt % H.sub.3BO.sub.3;

[0175] from about 0.01 to about 2.0 wt % LiF;

[0176] from about 0.01 to about 2.0 wt % CuO; and

[0177] from about 0.01 to about 2.0 wt % of at least one selected from the group consisting of MnO.sub.2, Mn.sub.2O.sub.3, and MnO.

[0178] Item 19. A method of forming an electronic component comprising: applying any of the dielectric paste of items 16-18 to a substrate; and firing the substrate at a temperature sufficient to sinter the dielectric paste.

[0179] Item 20. The method of item 19, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

[0180] Item 21. The method of item 19, wherein the firing is conducted in air.

[0181] Item 22. The lead-free and cadmium-free dielectric material of any of items 1-21, wherein, after firing, the fired composition exhibits a dielectric constant K of 100-500.

[0182] Item 23. An electric or electronic component comprising, prior to firing, the lead-free and cadmium-free dielectric material or paste of any of items 1-21, together with a conductive paste comprising:

[0183] 60-90 wt % Ag+Pd+Pt+Au,

[0184] 1-10 wt % of an additive selected from the group consisting of silicides, carbides, nitrides, and borides of transition metals,

[0185] 0.5-10 wt % of at least one glass frit,

[0186] 10-40 wt % of an organic portion.

[0187] Item 24. The electric or electronic component of item 23, wherein the electric or electronic component is selected from the group consisting of electromagnetic interference filters, high Q resonators, band pass filters, wireless packaging systems, and combinations thereof.

[0188] Item 25. A method of forming an electronic component comprising:

[0189] (a1) applying dielectric composition of any of items 1-21 to a substrate or

[0190] (a2) applying a tape comprising the dielectric composition of any of items 1-21 to a substrate or

[0191] (a3) compacting a plurality of particles of the dielectric composition of any of items 1-21 to form a monolithic composite substrate; and

[0192] (b) firing the substrate at a temperature sufficient to sinter the dielectric composition.

[0193] Item 26. The method of item 25, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

[0194] Item 27. The method of item 25, wherein the firing is conducted at a temperature of from about 840° C. to about 900° C.

[0195] Item 28. The method of any of items 25-27, wherein the firing is conducted in air.

[0196] Item 29. A method of co-firing at least one layer of the dielectric material of any of items 1-21 in combination with at least one alternating separate layer of tape or paste having a dielectric constant of less than 100 to form a multi-layer substrate wherein alternating layers have differing dielectric constants.

[0197] Item 30. The method of item 29, wherein the firing is conducted at a temperature of from about 800° C. to about 1000° C.

[0198] Item 31. The method of item 29, wherein the firing is conducted at a temperature of from about 840° C. to about 900° C.

[0199] Item 32. The method of any of items 29-31, wherein the firing is conducted in air.

[0200] Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and illustrative examples shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.