ANTI-GRAVITY HEAT PIPE DEVICE
20170241717 ยท 2017-08-24
Inventors
Cpc classification
F28D15/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/046
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D2015/0225
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
Abstract
A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
Claims
1. A heat pipe device, comprising: an outer pipe, being a hollow pipe and having a defined lengthwise direction; and at least one first capillary structure, accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel being formed between the at least one first capillary structure and the outer pipe.
2. The heat pipe device of claim 1, wherein the outer pipe has a first inner end and a second inner end disposed opposite to each other, and both ends of the at least one first capillary structure are abutted against the first inner end and the second inner end of the outer pipe respectively and fixed.
3. The heat pipe device of claim 2, further comprising at least one inner pipe wound around the at least one first capillary structure, and both ends of the at least one first capillary structure being exposed from both ends of the at least one inner pipe respectively, and both ends of the at least one first capillary structure being communicated to the at least one steam channel.
4. The heat pipe device of claim 3, wherein each of the two ends of the at least one inner pipe has at least one notch, and both ends of the at least one first capillary structure are exposed from the at least one notch of the two ends of the at least one inner pipe respectively and communicated to the at least one steam channel.
5. The heat pipe device of claim 1, wherein the at least one steam channel is formed along the lengthwise direction and between the at least one first capillary structure and the outer pipe.
6. The heat pipe device of claim 1, wherein the external periphery of the at least one first capillary structure and the inner wall of the outer pipe are spaced apart from each other.
7. The heat pipe device of claim 1, wherein the external periphery of the at least one first capillary structure is partially contacted with the inner wall of the outer pipe.
8. The heat pipe device of claim 1, wherein the at least one first capillary structure is a solid capillary structure.
9. The heat pipe device of claim 8, wherein the at least one first capillary structure is a powder sintered capillary structure or a tightly bundled metal mesh capillary structure.
10. The heat pipe device of claim 1, wherein the first capillary structure comes with a plural quantity.
11. A heat pipe device, comprising: an outer pipe, being a hollow pipe, and having a defined lengthwise direction; at least one first capillary structure, accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel being formed along the lengthwise direction and between the at least one first capillary structure and the outer pipe; and at least one inner pipe, wound around the at least one first capillary structure, and both ends of the at least one first capillary structure being exposed from both ends of the at least one inner pipe respectively and communicated to the at least one steam channel.
12. The heat pipe device of claim 11, further comprising two second capillary structures, and the outer pipe having a first inner end and a second inner end opposite to each other, and the two second capillary structures being disposed in the first inner end and the second inner end respectively, and the two ends of the at least one first capillary structure being coupled to and positioned at the two second capillary structures respectively.
13. The heat pipe device of claim 12, wherein each of the second capillary structures has at least one recession, and the two ends of the at least one first capillary structure are plugged into the at least one recession of each second capillary structure for positioning.
14. The heat pipe device of claim 12, wherein the two second capillary structures and the at least one first capillary structure are the same or different capillary structures.
15. The heat pipe device of claim 12, further comprising a third capillary structure disposed on an inner wall of the outer pipe and coupled between the two second capillary structures.
16. The heat pipe device of claim 12, wherein the at least one steam channel is formed between the outer pipe, the at least one inner pipe, and the two second capillary structures.
17. The heat pipe device of claim 11, wherein the external periphery of the at least one first capillary structure and the inner wall of the outer pipe are spaced apart from each other.
18. The heat pipe device of claim 11, wherein the external periphery of the at least one first capillary structure is partially contacted with the inner wall of the outer pipe.
19. The heat pipe device of claim 11, wherein the at least one first capillary structure is a solid capillary structure.
20. The heat pipe device of claim 19, wherein the at least one first capillary structure is a powder sintered capillary structure or a tightly bundled metal mesh capillary structure.
21. The heat pipe device of claim 11, wherein the first capillary structure and the inner pipe installed therein come with a plural quantity, and each of the inner pipes is wound around each the first capillary structure.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] The technical contents of the present invention will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is noteworthy that the preferred embodiments are provided for illustrating this disclosure rather than restricting the scope of the disclosure.
[0020] This disclosure provides an anti-gravity heat pipe device capable of forcing the steam to flow from top to bottom and pushing the condensed water formed after the exchange of heat from bottom to top accordingly, so as to fit the application of the electronic devices without being limited by the using direction. Refer to
[0021] The heat pipe device in accordance with the first preferred embodiment of this disclosure as shown in
[0022] The first capillary structure 2 is accommodated along the lengthwise direction D and positioned in the outer pipe 1, but the positioning method is not limited, and the following method is used to illustrate this disclosure. The outer pipe 1 has a first inner end 11 and a second inner end 12 opposite to each other, and both ends of the first capillary structure 2 are abutted against the first inner end 11 and the second inner end 12 respectively, and positioned in the outer pipe 1, so that the first capillary structure 2 can be used for transmitting water between both ends inside the outer pipe 1 quickly.
[0023] At least one steam channel 3 is formed along the lengthwise direction D and between the first capillary structure 2 and the outer pipe 1, so as to constitute the heat pipe device of the first preferred embodiment of this disclosure. Wherein, the quantity of steam channels 3 is not limited. In this preferred embodiment, the external periphery of the first capillary structure 2 and the inner wall of the outer pipe 1 are spaced apart without contact (as shown in
[0024] The first capillary structure 2 is a solid capillary structure, but not limited to any particular solid capillary structure. In this preferred embodiment, a powder sintered capillary structure (as shown in the figures) or a tightly bundled metal mesh capillary structure (not shown in the figure) is used for illustrating this disclosure.
[0025] With reference to
[0026] With reference to
[0027] With reference to
[0028] In
[0029] However, the evaporation end and the condensation end of the heat pipe device of this disclosure are not limited to the configuration as shown in
[0030] With reference to
[0031] The inner pipe 4 is wound around the first capillary structure 2, and both ends of the first capillary structure 2 are exposed from both ends of the inner pipe 4 respectively, and the exposing method is not limited. In this preferred embodiment, both ends 21, 22 of the first capillary structure 2 are protruded and exposed from both ends of the inner pipe 4. In other words, the length of the first capillary structure 2 is greater than the length of the inner pipe 4.
[0032] The two second capillary structures 5 is disposed (or filled) in the first inner end 11 and the second inner end 12 of the outer pipe 1, and both ends of the first capillary structure 2 are coupled and positioned at the two second capillary structures 5, but the positioning method is not limited. In this preferred embodiment, each second capillary structure 5 has a specific thickness to facilitate forming a recession 51, 52 on each end surface, and both ends 21, 22 of the first capillary structure 2 are plugged into the recessions 51, 52 of each second capillary structure 5 and positioned (wherein both ends 21, 22 of the first capillary structure 2 can be fully coupled to the second capillary structure 5), so that the first capillary structure 2 is coupled between and communicated to the two second capillary structures 5 and water can flow from the second capillary structure 5 at one end through the first capillary structure 2 to the second capillary structure 5 at the other end, and the steam channel 3 is formed between the inner pipe 4, the outer pipe 1 and the two second capillary structures 5, and both ends 21, 22 of the first capillary structure 2 are communicated to the steam channel 3 through the two second capillary structures 5 respectively.
[0033] With
[0034] With reference to
[0035] In addition, the fourth to sixth preferred embodiment of this disclosure may have the same effect as the first to third preferred embodiments, wherein the external periphery of the first capillary structure 2 and the inner wall of the outer pipe 1 are spaced from each other without contact (Refer to
[0036] In summation of the description above, this disclosure improves over the prior art, so that the heat pipe device of this disclosure still can resist gravity and flows steam from top to bottom and water from bottom to top even in the upside-down condition, so as to achieve the effect of fitting the application of electronic devices without being limited by the using direction. In other words, the heat pipe device of this disclosure heat pipe device can be used in a forward direction (wherein the heat source H is disposed at the lower end of the heat pipe device, not shown in the figure) or in a reverse direction (wherein the heat source H is disposed at the upper end of the heat pipe device, as shown in
[0037] In summation of the description above, this disclosure achieves the expected effects, overcomes the drawbacks of the prior art, and complies with the patent application requirements, and thus is duly filed for patent application. While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.