SOLAR CELL
20170243999 · 2017-08-24
Assignee
Inventors
- Jae-hyung WI (Daejeon, KR)
- Yong-Duck CHUNG (Daejeon, KR)
- Woo Jung LEE (Seoul, KR)
- Daehyung CHO (Daejeon, KR)
- Won Seok Han (Daejeon, KR)
Cpc classification
H01L31/18
ELECTRICITY
H01L31/0749
ELECTRICITY
Y02E10/541
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01L31/022466
ELECTRICITY
International classification
H01L31/18
ELECTRICITY
Abstract
A solar cell according to embodiments of the inventive concept includes a back electrode on a substrate, a first light absorbing layer including gallium (Ga) and indium (In) on the back electrode, a first buffer layer on the first light absorbing layer, a first window layer on the first buffer layer, a second light absorbing layer including
Ga on the first window layer, a second buffer layer on the second light absorbing layer, and a second window layer on the second buffer layer, wherein a composition ratio of (Ga)/(Ga+In) of the first light absorbing layer is lower than that of the second light absorbing layer.
Claims
1. A solar cell comprising: a back electrode on a substrate; a first light absorbing layer including gallium (Ga) and indium (In) on the back electrode; a first buffer layer on the first light absorbing layer; a first window layer on the first buffer layer; a second light absorbing layer including Ga on the first window layer; a second buffer layer on the second light absorbing layer; and a second window layer on the second buffer layer, wherein a composition ratio of (Ga)/(Ga+In) of the first light absorbing layer is lower than that of the second light absorbing layer.
2. The solar cell of claim 1, wherein the composition ratio of (Ga)/(Ga+In) of the first light absorbing layer is in a range of about 0.23 or more to about 0.25 or less.
3. The solar cell of claim 1, wherein the first buffer layer comprises zinc.
4. The solar cell of claim 1, wherein the first light absorbing layer comprises a copper indium gallium selenide (CIGS) absorbing layer, and the second light absorbing layer comprises a copper gallium selenide (CGS) absorbing layer.
5. The solar cell of claim 1, wherein the second window layer comprises: a first sub-window layer configured to have high resistance; and a second sub-window layer configured to have high transparency.
6. A solar cell comprising: a bottom cell having a first light absorbing layer; and a top cell which is stacked on the bottom cell and has a second light absorbing layer, wherein the first light absorbing layer comprises gallium (Ga) and indium (In), and a composition ratio of (Ga)/(Ga+In) of the first light absorbing layer is in a range of about 0.23 or more to about 0.25 or less.
7. The solar cell of claim 6, wherein the first light absorbing layer comprises a copper indium gallium selenide (CIGS) absorbing layer, and the second light absorbing layer comprises a copper gallium selenide (CGS) absorbing layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:
[0017]
[0018]
[0019]
[0020]
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0021] Advantages and features of the present disclosure, and implementation methods thereof will be clarified through following embodiments described with reference to the accompanying drawings. The present disclosure may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Further, the present invention is only defined by scopes of claims. Like numbers refer to like elements throughout.
[0022] In the following description, the technical terms are used only for explaining a specific exemplary embodiment while not limiting the inventive concept. The terms of a singular form may include plural forms unless referred to the contrary. It will be understood that the terms “comprises” and/or “comprising”, when used in this specification, specify the presence of stated elements, steps, operations, and/or components, but do not preclude the presence or addition of one or more other elements, steps, operations, and/or components.
[0023] Additionally, the embodiments in the detailed description will be described with sectional and/or plan views as ideal exemplary views of the inventive concept. In the figures, the thicknesses of layers and regions are exaggerated for clarity of illustration. Accordingly, shapes of the exemplary views may be modified according to manufacturing techniques and/or allowable errors. Therefore, the embodiments of the inventive concept are not limited to the specific shape illustrated in the exemplary views, but may include other shapes that may be created according to manufacturing processes. Areas exemplified in the drawings have general properties, and are used to illustrate a specific shape of a device region. Thus, this should not be construed as limited to the scope of the inventive concept.
[0024]
[0025] Referring to
[0026] The substrate 110 may be a sodalime glass substrate, a ceramic substrate, a semiconductor substrate such as a silicon substrate, a metal substrate, a stainless steel substrate, a polyimide substrate, or a polymer substrate. For example, the substrate 110 may be a sodalime glass substrate. The back electrode 120 may be formed of a material having a small thermal expansion coefficient difference from the substrate 110 in order to prevent delamination from the substrate 110. For example, the back electrode 120 may be formed of molybdenum (Mo). Mo may have high electrical conductivity, may have ohmic contact formation characteristics with other thin films, and may have high-temperature stability in a selenium (Se) atmosphere. The first light absorbing layer 130 may be formed of a I-III-VI group compound semiconductor. The first light absorbing layer 130 may include gallium (Ga) and indium (In). For example, the first light absorbing layer 130 may be a CIGS-based absorbing layer. For example, the first light absorbing layer 130 may include a chalcopyrite-based compound semiconductor such as CuInGaSe or CuInGaSe.sub.2. A composition ratio of (Ga)/(Ga+In) of the first light absorbing layer 130 may be in a range of about 0.23 or more to about 0.25 or less. The first buffer layer 140 may alleviate a difference in energy band gaps between the first light absorbing layer 130 and the first window layer 150. The first buffer layer 140 may have a larger energy band gap than the first light absorbing layer 130 and may have a smaller energy band gap than the first window layer 150. The first buffer layer 140, for example, may include zinc (Zn). The first window layer 150 may have excellent electro-optical characteristics. For example, the first window layer 150 may include one of indium tin oxide (ITO), transparent conductive oxide (TCO), or aluminum-doped zinc oxide (AZO) (i-ZnO).
[0027] The first window layer 150 may function as a back electrode of the top cell 200. The second light absorbing layer 210 may be formed of a I-III-IV group compound semiconductor. The second light absorbing layer 210 may include gallium (Ga). For example, the second light absorbing layer 210 may be a CGS-based absorbing layer. The composition ratio of (Ga)/(Ga+In) of the first light absorbing layer 130 may be lower than that of the second light absorbing layer 210. For example, in a case in which the second light absorbing layer 210 is a CGS-based absorbing layer, the (Ga)/(Ga+In) of the second light absorbing layer 210 may be about 1. The second buffer layer 220 may alleviate a difference in energy band gaps between the second light absorbing layer 210 and the second window layer 230. The second buffer layer 220 may have a larger energy band gap than the second light absorbing layer 210 and may have a smaller energy band gap than the second window layer 230. The second window layer 230 may have a multilayer structure. For example, the second window layer 230 may include a first sub-window layer 232 and a second sub-window layer 234 which are sequentially stacked. For example, the first sub-window layer 232 may have high resistance and the second sub-window layer 234 may have high transparency. For example, the first sub-window layer 232 may include TCO and the second sub-window layer 234 may include ITO or AZO (i-ZnO). The grid 240 may be electrically connected to the second window layer 230. The grid 240, for example, may include at least one metal layer, such as gold, silver, aluminum, and indium. Each of the first and second window layers 150 and 230, as a n-type semiconductor, may form a p-n junction with each of the first and second light absorbing layers 130 and 210, as a p-type semiconductor.
[0028] Although not shown in
[0029]
[0030] The first light absorbing layer 130 is disposed on the back electrode 120 (S120). The first light absorbing layer 130 may include gallium (Ga) and indium (In). The first light absorbing layer 130 may be formed of a group compound semiconductor. For example, the group compound semiconductor may be a chalcopyrite-based compound semiconductor such as Cu(In,Ga)Se.sub.2, Cu(In,Ga)(S,Se).sub.2, and (Au,Ag,Cu)(In,Ga,Al)(S,Se).sub.2. The first light absorbing layer 130 may be formed by using a co-evaporation method in which metal elements of copper (Cu), In, Ga, and Se are used as precursors.
[0031] Specifically, the first light absorbing layer 130 may be formed by a deposition process including a first step of evaporating In, Ga, and Se at the same time, a second step of evaporating Cu and Se at the same time, and a third step of evaporating In, Ga, and Se at the same time. For example, the first step may be performed in a temperature range of about 350° C. to about 450° C., the second step may be performed in a temperature range of about 480° C. to about 550° C., and the third step may be performed in a temperature range of about 480° C. to about 550° C. In this case, the composition ratio of (Ga)/(Ga+In) of the first light absorbing layer 130 may be controlled by adjusting an amount of Ga evaporated in the third step to be smaller than an amount of Ga evaporated in the first step. For example, the amount of Ga evaporated in the first step may be about 0.20 angstrom/sec, and the amount of Ga evaporated in the third step may be about 0.07 angstrom/sec. The composition ratio of (Ga)/(Ga+In) of the formed first light absorbing layer 130 may be in a range of about 0.23 or more to about 0.25 or less.
[0032] The first buffer layer 140 is further disposed on the first light absorbing layer 130 (S130). The first buffer layer 140 may alleviate a difference in energy band gaps between the first light absorbing layer 130 and the first window layer 150. The first buffer layer 140 may be formed by a sputtering method. In a case in which the first buffer layer 140 is formed by a dry process, the process may be performed in-line. Thus, the entire process may be simpler than a process in which the first buffer layer 140 is formed by a chemical bath deposition (CBD) method that requires vacuum.
[0033] The first window layer 150 is disposed on the first buffer layer 140 (S140). The first window layer 150 may be formed of a material having high light transmittance and excellent electrical conductivity. The bottom cell 100 may be completed by forming the first window layer 150.
[0034] Subsequently, the second light absorbing layer 210 is disposed on the first window layer 150 (S150). The second light absorbing layer 210 may include Ga. For example, the second light absorbing layer 210 may be a CGS-based absorbing layer. The composition ratio of (Ga)/(Ga+In) of the first light absorbing layer 130 may be lower than that of the second light absorbing layer 210. The second light absorbing layer 210 may be formed by using a co-evaporation method in which metal elements of Cu, Ga, and Se are used as precursors.
[0035] Specifically, the second light absorbing layer 210 may be formed by a deposition process including a first step of evaporating In, Ga, and Se at the same time, a second step of evaporating Cu and Se at the same time, and a third step of evaporating In, Ga, and Se at the same time. For example, the first step may be performed in a temperature range of about 350° C. to about 450° C., the second step may be performed in a temperature range of about 480° C. to about 550° C., and the third step may be performed in a temperature range of about 480° C. to about 550° C. In this case, the bottom cell 100 already formed may be damaged by the high-temperature process. For example, an element of the first buffer layer 140 may be diffused into the first light absorbing layer 130 to reduce efficiency of the bottom cell 100. Since the first buffer layer 140 includes zinc (Zn), a diffusion distance may be reduced in comparison to a case in which the first buffer layer 140 includes cadmium (Cd). Changes in the characteristics of the bottom cell 100 due to the high-temperature process will be described later with reference to
[0036] The second buffer layer 220 is disposed on the second light absorbing layer 210 (S160). The second buffer layer 220 may alleviate a difference in energy band gaps between the second light absorbing layer 210 and the second window layer 230. The second buffer layer 220 may be formed by a sputtering method. When the second buffer layer 220 is formed by a dry process, the process may be performed in-line.
[0037] The second window layer 230 is disposed on the second buffer layer 220 (S170). The second window layer 230 may be formed of a material having high light transmittance and excellent electrical conductivity. For example, the first sub-window layer 232 and the second sub-window layer 234 may be sequentially provided. The first sub-window layer 232 may have high resistance and the second sub-window layer 234 may have high transparency. For example, the first sub-window layer 232 may include TCO and the second sub-window layer 234 may include ITO or AZO (i-ZnO). Thereafter, the grid 240 may be disposed on the second window layer 230 (S180). The grid 240 may collect current on the surface of the solar cell 10. The grid 240 may be formed of a metal such as aluminum (Al) or Nickel (Ni)/Al. The grid 240 may be formed by using a sputtering method. The top cell 200 and the tandem-type solar cell 10 may be completed by forming the grid 240.
[0038]
[0039] Referring to {circle around (1 )} of
[0040] Subsequently, changes in external quantum efficiency according to a wavelength was measured for the case in which the efficiency is relatively high, that is, the case in which the composition ratio of (Ga)/(Ga+In) is equal to or greater than r4 (=0.23).
[0041]
[0042] Referring to
[0043] Thus, referring to
[0044] According to the inventive concept, the tandem-type solar cell 10 having high heat resistance may be provided. In particular, the tandem-type solar cell 10 having high heat resistance may be provided by controlling the composition ratio of (Ga)/(Ga+In) of the first light absorbing layer 130 of the bottom cell 100 to be in a range of about 0.23 or more to about 0.25 or less. For example, the first light absorbing layer 130 having a composition ratio of (Ga)/(Ga+In) of about 0.23 or more to about 0.25 or less may function as a diffusion barrier layer to prevent diffusion of a predetermined concentration of Ga at an interface between the first light absorbing layer 130 and the first buffer layer 140.
[0045] According to embodiments of the inventive concept, a tandem-type solar cell having high heat resistance may be provided.
[0046] Although preferred embodiments of the inventive concept have been shown and described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims. Accordingly, it is to be understood that the inventive concept has been described by way of illustration and not limitation.