Heat exchanger plate and a plate heat exchanger with insulated sensor internal to heat exchange area
09739546 · 2017-08-22
Assignee
Inventors
- Klas Bertilsson (Eslöv, SE)
- Anders Nyander (Kristianstad, SE)
- Christer Johansson (Göteborg, SE)
- Anatol Krozer (Göteborg, SE)
Cpc classification
F28F27/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F3/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F1/003
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D9/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2265/16
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G01M3/40
PHYSICS
F28F3/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F3/005
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2265/24
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
B60H1/00
PERFORMING OPERATIONS; TRANSPORTING
F28F3/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G01M3/18
PHYSICS
G01M3/40
PHYSICS
F28F3/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F27/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A plate heat exchanger includes a heat exchanger plate having a heat transfer area and an edge area, extending around the heat transfer area. The heat exchanger plate is a double wall plate formed by two adjoining plates compressed to be in contact with each other. A sensor configured to sense at least one parameter and to produce a signal depending on the parameter includes a sensor probe that is provided between the adjoining plates.
Claims
1. A double wall heat exchanger plate, comprising a heat transfer area, and an edge area, which extends around and outside the heat transfer area, wherein the double wall heat exchanger plate is formed by two adjoining plates compressed to be in contact with each other, wherein the double wall heat exchanger plate comprises a sensor which is located in the heat transfer area and is configured to sense at least one parameter and to produce a signal depending on the parameter and that the sensor comprises a sensor probe that is provided between the adjoining plates of the double wall heat exchanger plate, said parameter comprising the capacitance, wherein the double wall heat exchanger plate is configured to be included in a plate heat exchanger having a plurality of the double wall heat exchanger plates being arranged beside each other to define a plurality of first plate interspaces for a first medium and a plurality of second plate interspaces for a second medium, wherein the sensor comprises an insulation which insulates the sensor probe from electric contact with the adjoining plates, and wherein the sensor is configured to be disposed in one of the first or second interspaces.
2. The double wall heat exchanger plate according to claim 1, wherein the sensor probe is made of an electrically conducting material in the shape of at least a wire, a strip or a foil.
3. The double wall heat exchanger plate according to claim 2, wherein the sensor probe is configured to sense the parameter between the electrically conducting material of the sensor probe and the adjoining plates.
4. The double wall heat exchanger plate according to claim 1, comprising a gasket area, which extends around the heat transfer area between the heat transfer area and the edge area and on which a gasket extends.
5. The double wall heat exchanger plate according to claim 4, wherein at least one of the adjoining plates in the gasket area comprises a depression extending along the gasket area in parallel with the edge area, thereby forming a gap between the adjoining plates along the gasket area, and wherein a further gasket is provided in the gap.
6. The double wall heat exchanger plate according to claim 5, wherein the sensor probe is at least partly located in the gap, and wherein the sensor probe is provided beside the further gasket towards the heat transfer area.
7. The double wall heat exchanger plate according to claim 1, wherein the sensor extends to a connection point provided in the edge area.
8. The double wall heat exchanger plate according to claim 7, comprising a gasket area, which extends around the heat transfer area between the heat transfer area and the edge area and on which a gasket extends, wherein a connection part of the sensor, which extends to the connection point, has a foil shape at least at the gasket area.
9. The double wall heat exchanger plate according to claim 8, wherein one of the adjoining plates has a cut-out in the edge area exposing the connection part.
10. The double wall heat exchanger plate according to claim 7, wherein the sensor extends to a further connection point provided in the edge area.
11. The double wall heat exchanger plate according to claim 1, comprising a communication module, which comprises an electronic circuit and communicates with the sensor.
12. The double wall heat exchanger plate according to claim 11, wherein the sensor extends to a connection point provided in the edge area and wherein the communication module is connected to the sensor at the connection point.
13. The double wall heat exchanger plate according to claim 12, wherein the sensor extends to a further connection point provided in the edge area, wherein the sensor comprises a further connection part and wherein the communication module is connected to the further connection part at the further connection point.
14. A plate heat exchanger comprising a plurality of double wall heat exchanger plates according to claim 1, the double wall heat exchanger plates being arranged beside each other to define a plurality of first plate interspaces for a first medium and a plurality of second plate interspaces for a second medium.
15. A plate heat exchanger according to claim 14, comprising a master unit configured to receive and process the signal from a plurality of sensor probes of all the double wall heat exchanger plates, wherein each double wall heat exchanger plate comprises a communication module, which comprises an electronic circuit and communicates with the sensor, and wherein each communication module is comprised by a communication bus which communicates with the master unit.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The present invention will now be explained more closely by means of a description of various embodiments and with reference to the drawings attached hereto.
(2)
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DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS OF THE INVENTION
(12)
(13) One of the heat exchanger plates 1 is disclosed in
(14) In the embodiments disclosed the plate heat exchanger is thus mounted and held together by means of tie bolts 6 and gaskets 13.
(15) It is to be noted, however, that the invention is applicable also to plate heat exchangers of other kinds. The heat exchanger plates 1 may for instance be permanently connected to each other by means of welding, such as laser welding or electron beam welding, gluing or even brazing. An example of an alternative mounting of the heat exchanger plates 1, is a so called semi-welded plate heat exchanger where the heat exchanger plates 1 are welded to each other in pairs, whereby the pairs of heat exchanger plates 1 may be pressed against each other by means of tie bolts with gasket provided between the pairs. Furthermore, it is to be noted that the plate heat exchanger may lack porthole channels, whereby the sides of the plate heat exchanger present openings to the plate interspaces 2 and 3 for the supply and discharge of the media. Alternatively, one of the plate interspaces 2, 3 may be accessible via porthole channels, whereas the other of the plate interspaces may be accessible via the side of the plate heat exchanger.
(16) The heat exchanger plate 1 is a double wall plate, see
(17) The heat exchanger plate 1 comprises a sensor 20, which is configured to sense at least one parameter and to produce a signal depending on the parameter. The sensor 20 comprises a sensor probe 21 that is provided between the adjoining plates 1a, 1b and located in the heat transfer area 10. It is to be noted here that only the parts of the plates located in the proximity of the sensor probe 21 need to be made of an electrically conducting material.
(18) The sensor probe 21 is preferably positioned between the adjoining plates 1a and 1b before they are finally mounted or compressed together. A deformation of the material of the adjoining plates 1a, 1b may take place in connection with the compressing so that there will be a protruding area along the sensor probe 21 on at least one of the adjoining plates 1a and 1b, as can be seen in
(19) The cavity 22 extends along the sensor probe 21 between the sensor probe 21 and the adjoining plates 1a, 1b. The compressing of the adjoining plates 1a, 1b takes place at a high pressure so that the space remaining between the adjoining plates 1a, 1b is very thin, merely permitting transport or distribution of a fluid by means of capillary forces. However, such distribution will ensure that any of the primary and secondary medium entering the space between the adjoining plates 1a, 1b will reach the cavity 22.
(20) In order to achieve a sufficient space between the adjoining plates 1a, 1b for the capillary forces to permit the distribution of the liquid, one or both of the plates 1a, 1b on the surface turned towards the other plate, may have a pattern or other irregular surface structure, for instance a rest pattern from the manufacturing of the sheet material of the plates 1a, 1b. It is to be understood that such a surface structure is very thin in the order of a few microns.
(21) As can be seen in
(22) The sensor probe 21 is in the embodiments disclosed configured to sense the parameter between the electric conducting material of the sensor probe 21 and the adjoining plates 1a, 1b. The parameter is in the embodiments disclosed in the first place the capacitance between the electrically conducting material of the sensor probe 21 and the adjoining plates 1a, 1b. The parameter may also be the impedance between the sensor probe 21 and the adjoining plates 1a, 1b. It can be noted that the sensor 20 may comprise two sensor probes 21 of similar configuration and positioned at a certain distance from each other. In such an arrangement, the parameter, for instance the capacitance, between the two sensor probes 21 may instead be sensed.
(23) In case of a crack leading to a leakage in any one of the adjoining plates 1a, 1b, one of the primary and secondary media will enter the space between the adjoining plates 1a and 1b and be distributed to the cavity, or cavities 22 by means of capillary forces. The medium will change the properties of the dielectric between the sensor probe 21 and the adjoining plates 1a, 1b, or between the two sensor probes 21, as explained above. The proper function of the sensor probe 21 may also be sensed by sensing the resistance between the sensor probe 21 and the adjoining plates 1a, 1b. In case the insulation 23 is broken, the resistance will decrease significantly as an indication thereof.
(24) The sensor 20, in the embodiments disclosed, comprises at least a connection part 26 connected to an end of the sensor probe 21. The connection part 26 extends to a connection point 27 provided in the edge area 11. The connection part 26 may have a foil shape, at least at the gasket area 12. In an embodiment disclosed in
(25) It is possible to make the depression of one 1b of the adjoining plates 1a, 1b deeper than the depression of the other 1a of the adjoining plates 1a, 1b. In such a way, a gap 28 is formed between the adjoining plates 1a, 1b, see
(26) The connecting part 26 may pass the further gasket 29, either through the further gasket 29, see
(27) As an alternative, the sensor probe 21 may, instead of being provided in the heat transfer area 10, be provided or located at least partly in the gap 28, as illustrated in
(28) The sensor 20 may also comprise a further connection part 31 connected to the other end of the sensor probe 21. The further connection part 31 extends, as illustrated in
(29) As can be seen in
(30) According to a further embodiment, each heat exchanger plate comprises a communication module 40, such as a so called bus module, which comprises an electronic circuit and communicates with the sensor 20 or sensors 20. The communication module 40 may for instance be attached to the heat exchanger plate 1 in the edge area 11. The communication module 40 may be connected to the connection part 26 at the connection point 27, and possibly to the further connection part 31 at the further connection point 32.
(31) The communication module 40 has at least one primary contact element 41 located on a primary side of the heat exchanger plate 1, and at least one secondary contact element 42 located on an opposite secondary side of the heat exchanger plate 1. When the heat exchanger plates 1 are compressed to each other the primary contact element 41 will be in electrical contact with the secondary contact element 42, as illustrated in
(32) Each communication module 40 is comprised by a communication bus 45 which communicates with a master unit 43 comprising a processor of any suitable kind, see
(33) Furthermore, it is to be noted that the communication elements 26, 31 may be dispensed with. The sensor probe 21 may be thus be extended to be directly connected to the communication module 40, possibly via a connection point 27, 32.
(34) The present invention is not limited to the embodiments disclosed but may be varied and modified within the scope of the following claims.