Laser welding machine and laser welding method using the same

Abstract

A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

Claims

1. A laser welding machine for welding, with laser light, a device in which a conductive lower terminal is overlapped by a conductive upper terminal, the laser welding machine comprising; an elevator having a mechanism that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing the conductive upper terminal toward the conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the position information received from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

2. The laser welding machine according to claim 1, wherein the control circuit comprises: a pressing regulation circuit that makes the elevating platform slide until a change of an input signal from the counter corresponding to an amount of sliding of the elevating platform reaches a threshold value in order to obtain a stabilized close contact condition between the conductive upper terminal and the conductive lower terminal by sliding the elevating platform of the elevator; a laser focal distance signal output circuit that delivers a signal for adjusting a laser focal distance to the machining optical device based on a vertical position of an upper surface of the conductive upper terminal after the stabilized close contact condition is established; and a laser irradiation signal output circuit that commands the laser oscillator to irradiate laser light.

3. The laser welding machine according to claim 1, wherein a power source of the pressing actuator is supplied by compressed air or a voltage.

4. The laser welding machine according to claim 1, wherein the tip has such a configuration that does not shade the laser light and allows contact with a vicinity of a laser irradiation point.

5. The laser welding machine according to claim 1, further comprising a suction nozzle having a suction port that is fixed to the elevating platform and disposed at a vicinity of a laser irradiation point.

6. The laser welding machine according to claim 2, wherein a power source of the pressing actuator is supplied by compressed air or a voltage.

7. The laser welding machine according to claim 2, wherein the tip has such a configuration that does not shade the laser light and allows contact with a vicinity of a laser irradiation point.

8. The laser welding machine according to claim 2, further comprising a suction nozzle having a suction port that is fixed to the elevating platform and disposed at a vicinity of a laser irradiation point.

9. A laser welding method using the laser welding machine as defined by claim 1, the method comprising: repeatedly performing pressing regulated by the control circuit; performing arithmetic operation of a focal distance of the laser light based on a vertical position of a laser irradiation point and delivering results of the arithmetic operation to the elevator and the machining optical device; and commanding the machining optical device to irradiate the laser light; in which the control circuit in the pressing makes the pressing actuator move to press an upper surface of the conductive upper terminal at a pressure of P.sub.0 with the tip of the pressing actuator, and to press again at an increased pressure until a difference in a displacement of the pressing actuator measured according to an output signal from the counter between a value at the pressure P.sub.0 and a value at a pressure larger than P.sub.0 exerted by further moving the pressing actuator becomes within a predetermined range of a.sub.2.

10. A laser welding method using the laser welding machine as defined by claim 2, the method comprising: repeatedly performing pressing regulated by the control circuit; performing arithmetic operation of a focal distance of the laser light based on a vertical position of a laser irradiation point and delivering results of the arithmetic operation to the elevator and the machining optical device; and commanding the machining optical device to irradiate the laser light; in which the control circuit in the pressing makes the pressing actuator move to press an upper surface of the conductive upper terminal at a pressure of P.sub.0 with the tip of the pressing actuator, and to press again at an increased pressure until a difference in a displacement of the pressing actuator measured according to an output signal from the counter between a value at the pressure P.sub.0 and a value at a pressure larger than P.sub.0 exerted by further moving the pressing actuator becomes within a predetermined range of a.sub.2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) These and/or other aspects and advantages will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

(2) FIG. 1 is a schematic construction of a laser welding machine according to an embodiment of the present invention showing a situation in welding an upper and lower emitter terminals of a semiconductor module at an opposing place;

(3) FIG. 2 is a sectional view of a part of a semiconductor module in a laser welding method of embodiments of the present invention showing a place of laser welding

(4) FIG. 3 is a flow diagram of the process of laser welding in a laser welding method of embodiments of the present invention:

(5) FIG. 4 is a sectional view of a part of a conventional semiconductor module installing an IGBT chip;

(6) FIG. 5 is a schematic sectional view of a conventional semiconductor module that uses an upper terminal plate of a lead frame made of high thermal conductivity copper; and

(7) FIG. 6 is a schematic circuit diagram of an inverter circuit.

DESCRIPTION OF EMBODIMENTS

(8) Some embodiments of a laser welding machine and a laser welding method using the laser welding machine of the present invention will be described in detail in the following with reference to the accompanying drawings. In the following description of the embodiment examples and the accompanying drawings, similar constructions are given the same symbols and repeated description is omitted. The accompanying drawings illustrated for the embodiment examples are not depicted in an accurate scale and a relative dimension for the sake of ease of observation or understanding. The present invention is not limited to the embodiment examples described in the following, but can be modified or varied within the spirit and scope of the invention.

(9) FIG. 2 is a sectional view of an essential part of a semiconductor module 20 that comprises a direct copper bonding (DCB) circuit board consisting of a DCB back surface copper foil 3, a DCB ceramics 4, and a DCB front surface copper foil 5, semiconductor chips of an IGBT 7a and a diode 7b, a vertically divided lead frame composed of a lower terminal 10 and an upper terminal 12 and another vertically divided lead frame composed of a lower terminal 11 and an upper terminal 13, the both lead frames being disposed above the DCB circuit board and the semiconductor chips.

(10) Laser light 17 is irradiated to the closely opposing surfaces of the lead frame to weld and integrate the lead frame. FIG. 2 indicates welded zones 16 of laser welding by regions of slanted lines. The sectional view of the semiconductor module 20 of FIG. 2 shows an assembled construction of the antiparallel-connected section of the IGBT 7a and the diode 7b indicated by the dotted circle 18 in the inverter circuit shown in FIG. 6, which will be described later. The sectional view of FIG. 2 shows that the emitter electrode of the IGBT 7a and the anode electrode of the diode 7b are commonly connected through the lower emitter terminal 10 to the upper emitter terminal 12 above the front surfaces of the chips, and that the collector electrode of the IGBT 7a and the cathode of the diode 7b are commonly connected to the DCB front surface copper foil 5 under the chips.

(11) In assembling the semiconductor module shown in FIG. 2, a solder 2 is first put on an upper surface of a heat sink base 1. Then, a DCB circuit board is mounted so that the solder 2 becomes in contact with a DCB back surface copper foil 3. The DCB circuit board is composed of a DCB ceramics 4, a DCB back surface copper foil 3 disposed beneath the DCB ceramics 4, and a DCB front surface copper foil 5 disposed on the upper surface of the DCB ceramics 4. On the upper surface of the DCB front surface copper foil 5, solder 6a, 6b and solder 9 are arranged. On the solder 6a mounted is a chip of the IGBT 7a and on the solder 6b mounted is a chip of the diode 7b that is a free-wheeling diode (FWD).

(12) A solder 8a is placed on the upper surface of the IGBT 7a and a solder 8b is placed on the upper surface of the diode 7b that is a FWD. Both ends of the emitter lower terminal 10 are mounted on the solders 8a and 8b, respectively, and a collector lower terminal 11 is mounted on the solder 9. The solders are heated and melted, and then cooled and solidified.

(13) A resin case 14 is formed by molding monolithically an emitter upper terminal 12 and a collector upper terminal 13. Silicone adhesive 15 is applied to a bottom adhesion surface of the resin case 14, which is then fitted and adhered to the periphery of the heat sink base 1. The resin case 14 and the heat sink base 1 are joined firmly by heating and hardening the silicone adhesive 15.

(14) It is desired that the upper surface of the emitter lower terminal 10 and the lower surface of the emitter upper terminal 12 are disposed in close contact with each other because the two terminals are to be laser-welded. Likewise, it is desired that the upper surface of the collector lower terminal 11 and the lower surface of the collector upper terminal 13 are disposed in close contact with each other because the two terminals are to be laser-welded. After the laser welding described previously, insulating sealing resin (not shown in FIG. 2) is poured into the inside of the resin case 14 until the parts exposing in the air of the upper terminals 12 and 13 are covered with the resin. Thus, a semiconductor module 20 is constructed.

(15) A semiconductor module that is manufactured by applying the laser welding method of embodiments of the invention is provided with two types of bus bars of a P bus bar, which is a P-side common wiring after rectification, and an N bus bar, which is an N-side common wiring, as described earlier referring to FIG. 6. The P bus bar and the N bus bar are preferably arranged in parallel with different vertical positions in view of down-sizing of the module and reduction of circuit inductance. Consequently, laser welding points are positioned at different vertical places.

(16) When all the IGBTs and FWDs composing the inverter circuit of FIG. 6 are assembled in a single semiconductor module, a total of 21 welding points are needed for welding the P-side common wiring and the N-side common wiring, and for welding to middle terminals. It is extremely difficult for so many welding points to arrange the terminals closely with a uniform gap between the opposing terminals at the laser welding points. In addition, it is desired for the laser welding machine to be capable of easy focus adjustment in laser irradiation process in order to perform the laser welding in a short time.

(17) As shown in FIG. 1, a laser welding machine 100 of embodiments of the invention is a laser welding machine conducting welding, with laser light, a device in which a conductive lower terminal is overlapped by a conductive upper terminal, the laser welding machine 100 comprising; an elevator 29 having a mechanism that is capable of sliding an elevating platform 23; a pressing actuator 26 that is fixed to the elevating platform 23 at a base part of the pressing actuator 26 and has a tip 27 slidably connected to the base part and pressing the conductive upper terminal toward the conductive lower terminal; a laser oscillator 24; a machining optical device 25 that is fixed to the elevating platform 23 and has a lens to focus the laser light emitted from the laser oscillator 24; a position detector 28 that detects a vertical positioning of the pressing actuator 26; a counter 21 that receives an output signal of the position detector 28 and delivers position information; and a control circuit 22 that controls, based on the position information received from the counter, the elevator 29, the pressing actuator 26, and the machining optical device 25, and controls operation of the laser oscillator 24.

(18) The control circuit 22 comprises a pressing regulation circuit 33, a laser focal distance signal output circuit 34, and a laser irradiation signal output circuit 35. The pressing regulation circuit 33 makes the elevating platform 23 slide until a change of an input signal from the counter 21 corresponding to the amount of sliding of the elevating platform 23 reaches a threshold value in order to obtain a stabilized close contact condition between the conductive upper terminal and the conductive lower terminal by sliding the elevating platform 23 of the elevator 29. The laser focal distance signal output circuit 34 delivers a signal for adjusting the laser focal distance to the machining optical device 25 based on the vertical position of the upper surface of the conductive upper terminal after a stabilized close contact condition is established. The laser irradiation signal output circuit 35 commands the laser oscillator to irradiate laser light. The laser oscillator 24 sends laser light through a transmission fiber 30 to the machining optical device 25, which irradiates the conductive upper terminal with laser light to weld the conductive upper terminal and the conductive lower terminal.

(19) Therefore, a laser welding machine of embodiments of the present invention allows to readily conduct laser welding at opposing surfaces of the lower surfaces of the conductive upper terminals 12 and 13 positioned at different height and the upper surfaces of the conductive lower terminals 10 and 11 in a package of a semiconductor module 20.

(20) The output signal from the position detector 28 is delivered to the counter 21 through a fourth signal wiring L4. The output of the counter 21 is given to the control circuit 22 through a fifth signal wiring L5.

(21) The control circuit 22 controls the sliding movement of the elevating platform 23 of the elevator 29 through a first signal wiring L1, controls the pressing force of the pressing actuator 26 through a second signal wiring L2, controls the machining optical device 25 through a third signal wiring L3, and controls the laser oscillator 24 through a sixth signal wiring L6.

(22) A laser welding machine of embodiments of the invention is provided with the pressing actuator 26, which not only detects vertical position information of the laser welding point, but also presses the emitter upper terminal 12 with the tip 27 thereof by downward movement of the pressing actuator 26, thereby making the upper and lower terminals in a stably compressed state despite the variation in adhering degree or a gap between the opposing surfaces of the upper and lower terminals at the welding point. Because laser welding is conducted after this stable adhered state has been established, any defective laser welding point is not generated. After a laser welding process, the pressing actuator 26 is raised and moved to the next laser welding point without changing the position of the elevating platform 23, thereby reducing the processing time. A laser welding machine of embodiments of the invention is preferably provided with a suction nozzle 31 for absorbing fumes such as smoke containing fine dusts generated in the laser welding process. A laser welding machine is also favorably provided with an imaging camera 32 for observing an enlarged image of the laser welding point.

(23) A procedure of laser welding using the laser welding machine will be described in the following with reference to the laser welding flow chart of FIG. 3 and the construction of the laser welding machine of FIG. 1.

(24) First in the laser output inspection process or step S1, the laser welding machine is certified to be in a normal condition with the laser output thereof within a specified range, and the procedure moves to a pressing mechanism inspection process or step S2. If the laser output exceeds the specified range, an alarm of abnormal laser output is given.

(25) Then in the pressing mechanism inspection process or step S2, the tip 27 of the pressing actuator 26 is moved by the control circuit 22 to a position above a height reference plane set at a reference bed (not shown in the figures) and made in contact with the reference bed by downward movement of the pressing actuator 26 at a pressing force P.sub.0. In this process, a position detector 28 attached to the pressing actuator 26 delivers a magnitude of displacement to the counter 21, which in turn gives the position information to the control circuit 22, which measures a reference height δ.sub.1. The initial reference displacement quantity δ.sub.0 in the design of the device is determined from the output of the counter 21 when the tip 27 is made just in contact with the reference bed at a pressure P.sub.0. An initial reference focal distance Ho is preliminarily determined so that the focus of the laser light is coincide with the laser welding point.

(26) A correction displacement quantity Δε.sub.1 is obtained from the initial reference displacement quantity δ.sub.0 and the reference height δ.sub.1 of the reference plane measured at the pressing force P.sub.0 according to the formula δ.sub.1=δ.sub.0+Δε.sub.1. If the Δε.sub.1 is within a predetermined range a.sub.1, it is judged that the tip 27, which become in contact with the emitter upper terminal 12, does not have any wear or deformation, moving to a first laser focus adjusting process or step S3. If the Δε1 exceeds the predetermined range a.sub.1, it is judged that the tip 27 has an abnormality and delivers an alarm.

(27) In the first laser focus adjusting process or step S3, a primary correction reference focal distance H.sub.1 is obtained from the initial reference focal distance H.sub.0 in consideration of the correction displacement quantity Δε.sub.1 for the measured reference height δ.sub.1 as follows:
H.sub.1=H.sub.0−Δε.sub.1/sin θ,

(28) where θ is an angle between the laser light and the upper surface of the emitter upper terminal 12.

(29) In a pressing process or step S4, the control circuit 22 first moves the elevator 29 fixed onto a stage (not depicted in FIG. 1) capable of moving in the directions of horizontal two axes above the semiconductor module, which is a work necessary to be laser welded. After that, the tip 27 of the pressing actuator 26 attached to the elevating platform 23 is lowered just above the welding point at the opposing plane between the emitter lower terminal 10 of the IGBT chip and the emitter upper terminal 12. A pressure P.sub.0 is exerted on the surface of the emitter upper terminal 12 by the tip 27 to measure and record the displacement quantity δ.sub.i+1 of the vertical position of the surface of the emitter upper terminal 12, wherein i is a positive integer with an initial value of 1. The control circuit 22 changes the pressing force to P.sub.0+α.sub.1×i, wherein i is a positive integer with an initial value of 1, and measures and records again the vertical position of the upper surface of the emitter upper terminal 12 to obtain a displacement quantity δ.sub.i+2. Δε.sub.i+1 is obtained from the displacement quantity δ.sub.2 at the pressing force of P.sub.0 and the displacement quantity δ.sub.i+2 at the pressing force of P.sub.0+α.sub.1×i according to the formula δ.sub.i+1=δ.sub.i+2−Δε.sub.i+1. When the absolute value of the Δε.sub.i+1 is within the specified value a.sub.2, it is judged that the gap between the emitter upper terminal 12 and the emitter lower terminal 10 is small and the terminals are adhered in a stable condition, moving to a second laser focus adjusting process or step S5. If the absolute value of the Δε.sub.i+1 is out of the specified range a.sub.2, i is changed to 2 adding 1 and the pressing force is change to P.sub.0+α.sub.1×i, which means that the pressing force is increased by α.sub.1 corresponding to the increment of i by 1. The vertical position of the upper surface of the emitter upper terminal 12 is measured and recorded again as a displacement quantity δ.sub.i+2. This process is repeated until the absolute value of the Δε.sub.i+1 becomes within the range of specified value a.sub.2 up to the predetermined maximum times of n. If the absolute value of the Δε.sub.i+1 does not fall within the specified value a.sub.2, abnormality is determined and an alarm is delivered.

(30) In a second laser focus adjusting process or step S5, the focal distance of the laser light is precisely adjusted. In consideration of the correction displacement quantity Δε.sub.i+1 of the measured height δ.sub.i+2, a secondary correction reference focal distance H.sub.2 is corrected as follows.

(31) $H_2=H_1-\underset{i=1}{\overset{m}{.Math.}}\left(\frac{{\mathrm{\Delta .Math.}}_{i+1}}{\sin \theta }\right)$

(32) Wherein θ is an angle between the laser light and the upper surface of the emitter upper terminal 12.

(33) Then in a laser irradiating process or step S6, laser welding is conducted. Because laser light irradiates the upper surface of the emitter upper terminal 12 in an oblique direction, the focal position seen from above shifts in the horizontal direction corresponding to a change of focal distance of the laser light. Therefore, it is preferable to perform laser welding after adjusting the focal position of the laser light by moving the elevator 29 mounted on a stage (not depicted) movable in two axial directions in a horizontal plane. This correction operation can be omitted when the amount of shift of the focal position is minute and has no effect on the tip 27.

(34) After completion of the laser welding, the control circuit 22 makes the pressing actuator 26 elevated to release the tip 27 from the emitter upper terminal 12.

(35) Then, the laser welding machine shifts relatively the position of the machining optical device 25 and the position of the semiconductor module to move the focal position of laser light of the machining optical device 25 to the next welding point.

(36) Like the previous case, the welding point at the opposing surface between the collector lower terminal 11 connected to the collector at the back surface of the chip and the collector upper terminal 13 is laser welded. The laser welding region 16 is indicated with an area of slanted lines in FIG. 2. The elevating platform 23 has a suction nozzle 31 that has a suction port disposed near the surface of the laser welding point to remove the fume scattering in the welding process. Useful laser light 17 can be YAG laser light at a wavelength λ=1,064 nm. Alternatively, the laser light 17 can be CO.sub.2 laser light or excimer laser light.

(37) The laser light 17 is absorbed at the uppermost surface of the upper terminals 12 and 13 and converted to thermal energy to proceed melting of the terminals and form a welding region 16. As a result, the upper terminals 12 and 13 are joined with the lower terminals 10 and 11, respectively, to electrically connect and form a main current path. After sequentially moving and laser welding at every welding points required for assembling the semiconductor module, the laser welding procedure is completed.

(38) According to the embodiment described thus far, provided are a laser welding machine and a laser welding method that achieve enough joint strength despite certain amount of variation in the distance between upper and lower metallic plates that are to be welded.

REFERENCE NUMERALS AND ELEMENTS LIST

(39) 1: heat sink base 2: solder 3: DCB back surface copper foil 4: DCB ceramics 5: DCB front surface copper foil 6a: solder 6b: solder 7a: IGBT chip 7b: diode chip 8a: solder 8b: solder 9: solder 10: emitter lower terminal 11: collector lower terminal 12: emitter upper terminal 13: collector upper terminal 14: resin case 15: silicone adhesive 16: welding region 17: laser light 18: dotted circle 20: semiconductor module 21: counter 22: control circuit 23: elevating platform 24: laser oscillator 25: machining optical device 26: pressing actuator 27: tip 28: position detector 29: elevator 30: transmission fiber 31: suction nozzle 32: imaging camera 33: pressing regulation circuit 34: laser focal distance signal output circuit 35: laser irradiation signal output circuit 100: laser welding machine L1: first signal wiring L2: second signal wiring L3: third signal wiring L4: fourth signal wiring L5: fifth signal wiring L6: sixth signal wiring S1: laser output inspection S2: pressing mechanism inspection S3: first laser focus adjusting S4: pressing S5: second laser focus adjusting S6: laser irradiating