Process of manufacturing a waterproof enclosure

Abstract

A process of manufacturing a waterproof enclosure and sealing the waterproof enclosure includes the steps of forming a rectangular waterproof upper member and a rectangular waterproof lower member; forming four rectangular adhesive members; securing the adhesive members to the lower member by pressing and heating; securing three edges of the upper member to the lower member by pressing and heating to form a partially open enclosure having an open edge; punching a plurality of positioning holes on a periphery of the partially open enclosure; placing an article in the partially open enclosure by inserting the article through the open edge of the partially open enclosure; sealing the open edge of the partially open enclosure by pressing and heating to form a sealed enclosure; and cutting the periphery having the positioning holes to finish a waterproof enclosure.

Claims

1. A process of manufacturing a waterproof enclosure and sealing the waterproof enclosure comprising the steps of: forming a rectangular waterproof upper member and a rectangular waterproof lower member; forming four rectangular adhesive members; securing the adhesive members to the lower member by pressing and heating; securing three edges of the upper member to the lower member by pressing and heating to form a partially open enclosure having an open edge; punching a plurality of positioning holes on a periphery of the partially open enclosure; placing an article in the partially open enclosure by inserting the article through the open edge of the partially open enclosure; sealing the open edge of the partially open enclosure by pressing and heating to form a sealed enclosure; and cutting the periphery having the positioning holes to finish a waterproof enclosure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a flow chart of a process of manufacturing a waterproof enclosure and sealing an electronic device with the waterproof enclosure according to the invention;

(2) FIG. 2 is an exploded view showing a rectangular waterproof upper member, a rectangular waterproof lower member, and four rectangular adhesive members;

(3) FIG. 3 is an exploded view showing pressing the adhesive members on the lower member and pressing the upper member on the lower member;

(4) FIG. 4 is a top plan view showing positioning holes formed on four edges of the open enclosure by punching;

(5) FIG. 5 is a perspective view showing placing an electronic device in the open enclosure by inserting the electronic device through the opening; and

(6) FIG. 6 is a perspective view of a waterproof enclosure formed by cutting the edges of a sealed enclosure.

DETAILED DESCRIPTION OF THE INVENTION

(7) Referring to FIGS. 1 to 6, a process of manufacturing a waterproof enclosure and sealing an electronic device with the waterproof enclosure in accordance with the invention is illustrated. The process comprises the following steps:

(8) Forming a rectangular waterproof upper member 2 made of flexible material (e.g., plastic) and a rectangular waterproof lower member 3 made of flexible material (e.g., plastic) is shown in FIG. 2.

(9) Forming four rectangular adhesive members 4 made of PU (polyurethane) is shown in FIG. 2.

(10) Securing the adhesive members 4 to the lower member 3 by pressing and heating and securing three edges of the upper member 2 to the lower member 3 by pressing and heating to form a partially open enclosure 1 having an opening 11 at one edge is shown in FIGS. 3 and 4.

(11) Punching a plurality of positioning holes 5 on four edges of the partially open enclosure 1 is shown in FIG. 4.

(12) Placing an electronic device 6 in the partially open enclosure 1 by inserting the electronic device 6 through the opening 11 is shown in FIG. 5.

(13) Sealing the open edge 11 of the partially open enclosure 1 by pressing and heating to form a sealed enclosure 1 is described.

(14) Finally, cutting the four edges containing the positioning holes 5 to finish a waterproof enclosure 7 is shown in FIG. 6.

(15) While the invention has been described in terms of preferred embodiments, those skilled in the art will recognize that the invention can be practiced with modifications within the spirit and scope of the appended claims.