METHOD FOR SMOOTHING AND POLISHING METALS VIA ION TRANSPORT VIA FREE SOLID BODIES AND SOLID BODIES FOR PERFORMING THE METHOD

Abstract

A method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a pole of a current generator and subjecting the part to friction with a set of particles that includes electrically charged and electrically conductive free solid bodies in a gaseous environment.

Claims

1. A method for smoothing and polishing a surface of a metal part via ion transport by free solid bodies, the method comprising: connecting a part to be treated to a first pole of a power supply; and subjecting the surface of the metal part to friction with a plurality of particles comprising electrically conductive free solid bodies electrically connected to a second pole of the power supply, the second pole having an opposite polarity of the first pole.

2. The method according to claim 1, wherein the first pole is a positive pole of the power supply and the second pole is a negative pole of the power supply.

3. The method according to claim 1, wherein the plurality of particles are in a gaseous environment.

4. The method according to claim 1, wherein the metal part and plurality of particles are disposed inside a receptacle, the electrically conductive free solid bodies being electrically connected to the second pole of the power supply through an electrically conductive apparatus located inside the receptacle.

5. The method according to claim 1, wherein the metal part and plurality of particles are disposed inside a receptacle, the electrically conductive free solid bodies being electrically connected to the second pole of the power supply through the receptacle.

6. The method according to claim 1, wherein the metal part is coupled to a securing element that moves the metal part relative to the plurality of particles.

7. The method according to claim 6, wherein the securing element is electrically conductive and is electrically coupled to the first pole of the power supply.

8. The method according to claim 6, wherein the securing element moves the metal part in an orbital motion about an axis and on a plane.

9. The method according to claim 8, wherein the securing element simultaneously moves the metal part in a plane perpendicular to the plane of the orbital motion.

10. The method according to claim 3, wherein the gaseous environment comprises air.

11. The method according to claim 1, wherein each of the free solid bodies comprises a non-electrically conductive structure containing an amount of electrolyte liquid to cause the free solid bodies to be electrically conductive and configured to polish the surface of the meta part via ion transport.

12. The method according to claim 11, wherein each of the free solid bodies has an outer surface, the amount of electrolyte liquid contained in the non-electrically conductive structure being below a saturation level such that the electrolyte liquid does not reside on the outer surface as a free liquid.

13. The method according to claim 11, wherein the electrolyte liquid comprises 90% to 99% H.sub.2O.

14. The method according to claim 1, wherein the plurality of particles comprises free solid bodies of different shapes.

15. The method according to claim 1, wherein the plurality of particles comprises free solid bodies having a spherical shape of different sizes.

16. The method according to claim 1, wherein the free solid bodies have diameters ranging from 0.3 to 0.8 mm.

17. The method according to claim 11, wherein the non-electrically conductive structure comprises sulfonated styrene-divinylbenzene copolymer.

18. The method according to claim 11, wherein the non-electrically conductive structure is a porous structure.

19. The method according to claim 1, wherein the second pole is a negative pole.

20. The method according to claim 4, wherein the electrically conductive apparatus is in the form of a ring.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To complement the description that is been done and in order to assist to best understand the characteristics of the invention, to this specification is attached as an integral part thereof a sheet of drawing in which for illustration and no limiting purpose the following has been depicted:

[0030] FIG. 1 shows a schematic depiction of the main elements intervening in the method for smoothing and polishing metals via ion transport by free solid bodies, object of the invention.

[0031] FIG. 2 shows a schematic depiction of a particle forming the solid bodies that the method presents, according to the invention, its porous configuration and capacity for retaining electrolyte liquid that makes it electrically conductive can be seen.

[0032] FIG. 3 shows a schematic depiction of a portion of rough surface of the part to be treated and several examples of the possible shapes the particles used in the method can have, and the difference of size between them and the size of the roughness can be symbolically seen; and last.

[0033] FIGS. 4 and 5 each show sketches similar to the one depicted in the FIG. 1, that draw respective moments of the method, the one of the FIG. 4 being the case in which a group of particles forms an electric bridge of direct contact between the anode and the cathode, and the FIG. 5, another case in which the particles separately brush the surface of the part.

DETAILED DESCRIPTION

[0034] Seen the mentioned figures and in accordance with the numbering adopted in them, it can be seen how, in a preferred embodiment of the method of the invention, the metal parts (1) to be treated are secured by a securing element (2), also of metal, comprising hooks, clips, jaws or others, on a moving arm (not shown) of a device that can perform an orbital motion about an axis and on a plane and, at same time, it can perform a rectilinear and alternative displacement motion on the plane perpendicular to the orbital, depicted by arrow lines in the FIG. 1.

[0035] The parts (1) thus secured and with the mentioned orbital and of alternative linear displacement motion disabled, are introduced, by the top, in a receptacle (3) of the device that contains a set of electrically conductive particles (4) and the air or any other gas occupying the space (5) of its interstitial environment existing between them, so that the parts (1) remain fully covered by the set of particles (4).

[0036] Preferably, the shape of the receptacle (3) is that of a cylinder with the lower end or bottom, closed and the top end open.

[0037] In any case, the securing element (2) is connected to the anode or positive pole of an electrical current generator (not shown) provided in the device while the receptacle (3), either directly because of being of metal or through a ring provided to that effect, is connected to the negative pole of the generator acting as cathode.

[0038] Logically, the device firmly secures the cylinder forming the receptacle (3) so that it avoids its displacement when activating the orbital motion and the alternative linear displacement of the securing element (2) of the parts (1).

[0039] Last, it shall be pointed out that the amplitude of the motion of the securing element (2) provided by the arm of the device, not shown, and the sizes of the receptacle (3) that contains the particles (4) is such that, in no case it is possible that the parts (1) to be treated or any conductive part of the securing element (2) directly contacts the walls of the receptacle or, where appropriate, the ring acting as cathode.

[0040] Considering FIG. 2, it can be seen how the particles (4) that constitute the free electrically conductive solid bodies of the method according to the invention, are solid bodies with porosity and affinity to retain an amount of electrolyte liquid in order that they have electric conductivity, the amount of electrolyte liquid being retained by the particles (4) always below the saturation level, so that the existence of free liquid is expressly avoided on the surface of the particles.

[0041] Preferably, the composition of the electrolyte liquid for polishing, for example stainless steels, is H.sub.2O: 90-99% HF: 10-1%.

[0042] On the other hand, as shown by the examples of the FIG. 3, the particles (4) are bodies that have variable shape and size, suitable to smooth the roughness of the parts (1) to be treated and being preferably bigger than the roughness to be removed from the surface.

[0043] Last, in FIGS. 4 and 5, two examples have been depicted of extreme case of the method by which smoothing and polishing the parts (1) is achieved through the contact between the electrically conductive particles (4) and the surface of the part (1) to be treated, FIG. 4 showing the case in which a group of particles (4) constitute an electric bridge of direct contact between the anode, through the securing element (2) in contact with the metal part (1) and the cathode, through the receptacle (3) and FIG. 5, the case in which the particles (4) separately brush the surface of the part (1), as it was explained in the preceding paragraphs.

[0044] The nature of this invention having been sufficiently disclosed, as well as the manner for implementing it, it is not deemed necessary to extend any longer its explanation in order that any person skilled in the art understands its extent and the advantages arising from it, and it is stated that, within it essence, it can be implemented in other embodiments differing in detail of that indicated for example purpose and to which the protection sought shall extend, provided that its fundamental principle is not altered, changed or modified.