MEMS Automatic Alignment High-And-Low Comb Tooth and Manufacturing Method Thereof

Abstract

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

Claims

1. MEMS self-aligning high/low comb teeth, comprising movable comb teeth, fixed comb teeth, and a lifting structure with one end fixed to a substrate and the other end connected to the movable comb teeth or the fixed comb teeth, wherein, the lifting structure comprises at least one bent beam section and at least one straight beam section, the bent beam and the straight beam together form at least one bent folded beam structure, the bent beam makes the folded beam structure displace in the vertical direction, and thereby drives the movable comb teeth/fixed comb teeth connected to the lifting structure to displace out of the plane of the fixed comb teeth/movable comb teeth, forming high/low comb teeth.

2. The MEMS self-aligning high/low comb teeth according to claim 1, wherein, in the lifting structure, at least one bent beam is located in front of the bend, while at least one bent beam is located behind the bend.

3. The MEMS self-aligning high/low comb teeth according to claim 1, wherein, the lifting structure comprises a uniform and continuous first material layer and a non-continuous and sectional second material layer covering the first material layer, the straight beam comprises the first material layer solely, while the bent beam comprises the first material layer and the covering second material layer.

4. The MEMS self-aligning high/low comb teeth according to claim 3, wherein, the first material layer is monocrystalline silicon or polycrystalline silicon.

5. The MEMS self-aligning high/low comb teeth according to claim 3, wherein, the second material layer is a single-layer film or multi-layer film.

6. The MEMS self-aligning high/low comb teeth according to claim 5, wherein, the second material layer is one or more layers of metal films.

7. The MEMS self-aligning high/low comb teeth according to claim 5, wherein, the second material layer is one or more layers of non-metal films.

8. The MEMS self-aligning high/low comb teeth according to claim 5, wherein, the second material layer is a composite film comprising at least one layer of metal film and one layer of non-metal film.

9. A method of manufacturing a MEMS self-aligning high/low comb teeth, comprising the steps of: employing a silicon wafer having a silicon-on-insulator (SOI) substrate including a front side and a back side; depositing a film layer on a monocrystalline silicon component layer on the front side of the SOI substrate, and patterning the film layer to form a second material layer for lifting structure, the second material layer also being a film layer; etching the back side of the SOI substrate by deep silicon etching, to form back cavities; etching the monocrystalline silicon component layer on the front side of the SOI substrate to form fixed or movable comb teeth and a first material layer for the lifting structure; bending locally a folded beam structure by virtue of the internal stress in the film layer, so that the lifting structure composed of the locally bent folded beam structure drives the fixed comb teeth or the movable comb teeth connected to the lifting structure to move in the vertical direction, and thereby forms self-aligning comb teeth.

10. The manufacturing method of the MEMS self-aligning high/low comb teeth according to claim 9, wherein, air pressure, temperature, and deposition rate of the film layer are controlled in the film layer growth process, so as to control the internal stress in the film layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIGS. 1(a) and 1(b) are front view and side view of a 2-section folded beam lifting structure respectively;

[0027] FIGS. 1(c) and 1(d) are front view and side view of a 3-section folded beam lifting structure respectively;

[0028] FIG. 2 is a structure diagram of self-aligning high/low comb teeth;

[0029] FIGS. 3(a) and 3(b) show a MEMS electrostatic actuator and a MEMS capacitive displacement transducer respectively, which employs self-aligning high/low comb teeth.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Hereunder the technical solution of the present invention will be detailed, with reference to the accompanying drawings.

[0031] A 2-section folded beam lifting structure is shown in FIG. 1. One end of the lifting structure is fixed to a substrate. As shown in the front view in FIG. 1(a), the two sections of the beam of the lifting structure are not completely same with the rest part of the lifting structure in material composition; in addition, one beam section is located in front of the bend (position A), and the other beam section is located behind the bend (position B). A side view of the lifting structure is shown in FIG. 1(b). The lifting structure mainly consists of a thick layer of material (e.g., silicon); the structural beam sections at the positions A and B have an additional film layer when compared with the rest structural beam sections, and the film layer (e.g., metallic material such as aluminum, semiconductor material such as polycrystalline silicon, or dielectric material such as silicon nitride, etc.) is relatively thin. Owing to a Bimorph effect, the entire structure will be bent under stress after the film material layer is deposited on the thick material layer under certain conditions. By controlling the film growth process, including air pressure, temperature, and deposition rate, etc., the curvatures of the structural beam at positions A and B can be controlled. The two bent beam sections is the basis for vertical lifting of the entire structure. Suppose the beam is bent upwards at the position A, then the beam section (a straight beam, because it is made of a single material M1) will be displaced upward; at that section, lifting is formed, but tilting exists. In view of that, a horizontal beam section, followed by a beam section folded in the reversed direction, are added there. The initial segment of the folded beam (i.e., at the position B) also tilts upwards, but in a direction reversed to the tilting direction of the section A. Thus, vertical displacement is formed at the ends. In addition, the first material layer M1 is utilized as a displacement amplification of the folded beam. After the structure is completely released, vertical displacement in relation to the substrate surface will be obtained at the ends.

[0032] Here, the bending angle θ of the flexible Bimorph structural connection part is

[00001]$\theta =\frac{l_h}{\rho },\frac{1}{\rho }=\frac{{\beta }_b}{t_1+t_2}.Math.\mathrm{\Delta .Math.},$

wherein, ρ is the radius of curvature of the flexible Bimorph structural connection part; Δε; t.sub.1 and t.sub.2 are the thickness of the material M1 and the film material M2 of the flexible Bimorph structure respectively; β.sub.b is the curvature coefficient of the flexible Bimorph structural connection part, and can be obtained from the following formula:

[00002]${\beta }_b=6*\frac{{\left(1+\frac{t_1}{t_2}\right)}^2}{\frac{E_1^{\prime }}{E_2^{\prime }}*{\left(\frac{t_1}{t_2}\right)}^3+4*{\left(\frac{t_1}{t_2}\right)}^2+6*\frac{t_1}{t_2}+4+{\left(\frac{E_1^{\prime }}{E_2^{\prime }}\right)}^{-1}*{\left(\frac{t_1}{t_2}\right)}^{-1}}$

[0033] Wherein, E′.sub.1 and E′.sub.2 are biaxial elastic moduli of the material 1 and material 2 of the flexible Bimorph structural connection part, and the values of E′.sub.1, and E′.sub.2 are determined by the elastic modulus and the Poisson ratio of the film material, as follows:

[00003]$E_i^{\prime }=\frac{E_i}{1-v_i},i=1,2.Math.\text{:}$

[0034] Wherein, E′.sub.i, is the elastic modulus of the i.sup.th film material layer, and v.sub.i is the Poisson ratio of the i.sup.th film material layer.

[0035] Multi-layer stacked lifting structures can reach different lifting heights. The front view and side view of a 3-section folded beam lifting structure are shown in FIGS. 1(c) and 1(d).

[0036] As shown in FIG. 2, the self-aligning high/low comb teeth comprise movable comb teeth, fixed comb teeth, and a lifting structure with one end fixed to a substrate and the other end connected to the movable comb teeth or the fixed comb teeth, the lifting structure comprises at least one bent beam section and at least one straight beam section, the bent beam and the straight beam together form at least one bent folded beam structure, the bent beam makes the folded beam structure displace in the vertical direction, and thereby drives the movable comb teeth/fixed comb teeth connected to the lifting structure to displace out of the plane of the fixed comb teeth/movable comb teeth, forming high/low comb teeth. The silicon wafer to be processed is a SOI (Silicon-On-Insulator) silicon wafer. A second material layer is deposited and patterned on a monocrystalline silicon component layer on the front side of the SOI, the folded beam structure is bent locally under the internal stress in the second material layer, and the lifting structure formed by the locally bent folded beam structure (i.e., the Bimorph deformation beam in the FIG. 2) drives the fixed comb teeth or the movable comb teeth connected to the lifting structure to displace in the vertical direction, and thereby forms self-aligning comb teeth.

[0037] FIG. 3(a) shows a MEMS electrostatic actuator that is manufactured utilizing the MEMS self-aligning high/low comb teeth and can make out-of-plane movement. The mechanical structural layers include: a mass block (reflective mirror surface), anchor points for fixing the mass block, anchor points for fixing self-aligning high/low comb teeth, and a connection beam that flexibly connects the mass block with the anchor points. The driving comb teeth are the above-mentioned MEMS self-aligning high/low comb teeth, including fixed comb teeth attached to the edges of the mass block, movable comb teeth corresponding to the fixed comb teeth, and the movable end of a lifting mechanism connected with the movable comb teeth; a deformation film layer is deposited on the mechanical structural layer at the joints between adjacent folded beams; the folded beams are bent locally under the stress of the deformation film layer and thereby form a Bimorph deformation beam.

[0038] FIG. 3(b) shows a MEMS capacitive displacement transducer that is manufactured utilizing the MEMS self-aligning high/low comb teeth and can measure out-of-plane movement, comprising a lifting structure, a flexible deformation beam, a comb teeth-type capacitor, and electrical connection points. After the comb teeth are lifted by the lifting structure, a high/low comb teeth-type capacitor can be formed. Any variation of the height of the lifting structure can be detected by detecting the variation of the capacitance between the comb teeth structures. In addition, by changing the flexible beam structure, physical quantities such as height variation and rotation angle variation, etc., can be detected.

[0039] In summary, in the present invention, high/low comb teeth are formed in a single deep silicon etching procedure, a lifting mechanism is introduced and is formed together with the comb teeth on a mechanical structure layer sequentially; thus, self-aligning high/low comb teeth are formed, without processing through a repeated etching process; compared with MEMS of a multi-layer mechanism, which is formed through a repeated bonding process, the manufacturing process is simplified, and thereby the processing cost and processing difficulties are greatly reduced, and the yield ratio is improved.

[0040] It will be understood that changes in the details, materials, steps and arrangements of parts which have been described and illustrated to explain the nature of the invention will occur to and may be made by those skilled in the art upon a reading of this disclosure within the principles and scope of the invention. The foregoing description illustrates the preferred embodiments of the invention; however, concepts, as based upon the description, may be employed in other embodiments without departing from the scope of the invention. The invention is not otherwise limited, except for the recitation of the claims set forth below.