DEVICE AND METHOD FOR PERSONALIZING SECURITY OR IDENTIFICATION OBJECTS

Abstract

A device for personalizing security or identification objects including a laser processing station having a laser unit that personalizes an object located in a laser processing area. The laser processing station comprises a turntable with a first receiving area for receiving a first object and a second receiving area for receiving a second object. The turntable is mounted rotatably relative to the laser unit so that it can be rotated from a first rotational position into a second rotational position. In the first rotational position, the first object and in the second rotational position the second object are at least partially located in the laser processing area.

Claims

1. Device for personalising security or identification objects, in short SI objects (11, 12), with at least a first laser processing station (20), wherein the laser processing station (20) comprises: a laser unit (30) adapted to personalise an SI article (11, 12) located in a laser processing area (40) by laser irradiation, a turntable (50) having a first receiving area (51) for receiving a first SI object (11) and having a second receiving area (52) for receiving a second SI object (12); wherein the turntable (50) is rotatably supported relative to the laser unit (30) about an axis of rotation (D) so that it can be rotated from a first rotational position to a second rotational position; wherein in the first rotational position of the turntable (50), the first SI object (11) arranged in the first receiving area (51) is at least partially located in the laser processing area (40); and wherein in the second rotational position of the turntable (50), the second SI object (12) arranged in the second receiving area (52) is at least partially located in the laser processing area (40).

2. The apparatus of claim 1, further comprising: a laser irradiation preparation unit (60) for preparing laser irradiation, wherein the laser irradiation preparation unit (60) is arranged to detect a position of the second SI object (12) received in the second receiving area (52) in the first rotational position of the turntable (50) and to transmit information about the detected position to the laser unit (30); and wherein the laser unit (30) is arranged to use the transmitted information as an input quantity in a subsequent laser irradiation of the second SI object (12).

3. The apparatus according to any one of the preceding claims, in which the turntable (50) can be rotated from the first rotational position to the second rotational position by a rotation of 180°±10° about the axis of rotation (D).

4. The apparatus according to any one of the preceding claims, wherein the turntable (50) has a first support region (81) and a first cover region (82) to form the first receiving region (51), such that the first SI article (11) received in the first receiving region (51) is located between the first support region (81) and the first cover region (82), a second support portion (83) and a second cover portion (84) to form the second receiving portion (52), such that the second SI object (12) received in the second receiving portion (52) is located between the second support portion (83) and the second cover portion (84).

5. The apparatus according to claim 4, wherein the first cover area (82) comprises a window area (85) and the second cover area (84) comprises a window area (86), wherein in the first rotational position of the turntable (50), the first window area (85) at least partially encloses the laser processing area (40).

6. The apparatus of claim 5, wherein the turntable (50) further comprises a first clamping member (91) reciprocally movable between a clamping position and an open position, wherein in the clamping position of the first clamping member (91), the first SI article (11) received in the first receiving portion (51) is pressed by the first clamping member (91) against an edge portion of the window portion (85) of the first cover portion (82), so that the first SI object (11) is thereby fixed in the first receiving area (51) and in the open position of the first clamping element (91) the first SI object (11) is movable between the first support area (81) and the first cover area (82), as well as a second clamping member (92) reciprocally movable between a clamping position and an open position, wherein in the clamping position of the second clamping member (92) the second SI article (12) received in the second receiving portion (52) is pressed against an edge portion of the window portion (86) of the second cover portion (84) by the second clamping member (92), so that the second SI object (12) is—fixed in the second receiving area (52) and in the open position of the second clamping element (92) the second SI object (12) is movable between the second support area (83) and the second cover area (84).

7. The apparatus according to claim 6, wherein the laser processing station (20) comprises a gripping member (100) adapted to reciprocate the second clamping member (92) between the open position and the clamping position when the turntable (50) is in the first rotational position.

8. The apparatus according to any one of the preceding claims, further comprising a loading unit (70) which, in the first rotational position of the turntable (50), is arranged to push the second SI object (12) along a first direction (R1) into the second receiving region (52) in order to load the second receiving region (52), and/or to push the second SI object (12) along a second direction (R2), opposite to the first direction (R1), out of the second receiving region (52) in order to unload the second receiving region (52).

9. The apparatus according to any one of the preceding claims, further comprising at least one further laser processing station (20′) which is designed analogously to the first laser processing station (20); a transport device (110) which is set up to feed SI objects (11, 12) alternately to the first and the at least one further laser processing station (20, 20′).

10. The apparatus having the features mentioned in claims 9 and 8, wherein the transport device (110) is arranged to feed the SI objects (11, 12) respectively to the loading unit (70) of the relevant laser processing station (20, 20′).

11. The apparatus according to claim 9 or 10, wherein the transport device (110) comprises a main transport path (111) and two-distribution transport paths (112) extending perpendicularly to the main transport path (111), the transport device (110) being arranged to feed the SI objects (11, 12) to the laser processing stations (20, 20′) via the main transport path (111) and the two distribution transport paths (112) and to—transport the SI objects (11, 12) from the laser processing stations (20, 20′) back to the main transport path (111).

12. The apparatus according to claim 11, wherein the distribution transport paths (112) each lead to at least two laser processing stations (20, 20′).

13. The apparatus according to claim 11 or 12, wherein the transport apparatus (110) further comprises a separating unit (113), arranged between the main transport path (111) and the distribution transport paths (112), via which the SI objects (11, 12) are transported from the main transport path (111) alternately to the two distribution transport paths (112).

14. A method for personalising security or identification objects, in short SI objects (11, 12) with at least one first laser processing station (20), comprising the following steps: (a) placing a first SI article (11) in a first receiving area (51) of a turntable (50) of the laser processing station (20); (b) placing a second SI article (12) in a second receiving area (52) of the turntable (50); (c) laser irradiating the first SI item (11) received in the first receiving area (51) for personalisation when the turntable (50) is in a first rotational position by means of a laser unit (30) of the laser processing station (20); (d) rotating the turntable (50) from the first rotational position to a second rotational position; (e) laser irradiating the second SI object (12) received in the second receiving area (52) for personalisation when the turntable (50) is in the second rotational position by means of the laser unit (30).

15. The method of claim 14, further comprising the step of: (f) detecting a position of the second SI object (12) received in the second receiving area (52) when the turntable (50) is in the first rotational position and using information about the position in step (e).

16. The method according to claim 14 or 15, wherein in step (d) the turntable (50) is rotated by 180°±10°.

17. The method according to any one of claims 14 to 16, wherein— in step (b), in the first rotational position of the turntable (50), the second SI object (12) is pushed along a first direction (R1) into the second receiving region (52), and/or— a further step (g), in the first rotational position of the turntable (50), the second SI object (12) is pushed along a second direction (R2) opposite to the first direction (R1) out of the second receiving region (52).

18. The method of any one of claims 14 to 17, further comprising the step of: (h) transporting SI items and distributing the SI items to several laser processing stations (20, 20′).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Further features, characteristics, advantages and possible variations will become clear to a person skilled in the art from the following description, in which reference is made to the accompanying drawings.

[0062] FIG. 1 shows a perspective sketch of a laser processing station;

[0063] FIG. 2 shows a perspective sketch of the rotary table of the laser processing station;

[0064] FIG. 3 shows a schematic side view of the turntable and a loading unit for loading and unloading the turntable with SI items; and

[0065] FIG. 4 shows a schematic representation of a device with several laser processing stations.

[0066] The accompanying drawings, technical content and detailed description refer to preferred embodiments, but this is not to be construed as limiting the subject-matter of the application. All equivalent variations and modifications made in accordance with the appended claims of the present application are disclosed herein.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0067] FIG. 1 schematically shows a laser processing station 20 of a device for personalizing SI items 11, 12. The SI items may in particular be booklets such as passports.

[0068] The laser processing station 20 has a laser unit 30 which is set up to personalise an SI object located in a laser processing area 40 by means of laser irradiation. The laser irradiation creates a laser engraving in the SI object.

[0069] Further, the laser processing station 20 has a turntable 50 with a first receiving area 51 for receiving a first SI object 11 and with a second receiving area 52 for receiving a second SI object 12.

[0070] The turntable 50 is mounted so that it can rotate about an axis of rotation D relative to the laser unit 30, so that it can be rotated from a first rotational position—shown in FIG. 1—into a second rotational position. The turntable 50 can be rotated from the first rotational position to the second rotational position by a rotation of 180°. In other words, the two rotational positions differ by 180°.

[0071] The laser processing station has a housing 21, which is only indicated in FIG. 1, in which the laser unit 30 is arranged in a fixed position. The turntable 50 is mounted relative to the housing 21 in such a way that the axis of rotation D is invariably oriented, in particular vertically. The laser unit 30 is arranged above the turntable 50 so that a laser beam directed downwards from the laser unit 30 reaches the laser processing area 40.

[0072] The laser processing area 40 only extends over a part of the turntable 50. In the first rotational position of the turntable 50, the second pick-up area 52 is arranged outside the laser processing area 40.

[0073] The two receiving areas 51, 52 are designed symmetrically with respect to the axis of rotation D.

[0074] In the first rotational position of the turntable 50, the first SI object 11 disposed in the first receiving area 51 is at least partially within the laser processing area 40 and the second SI object 12 disposed in the second receiving area 52 is outside the laser processing area 40.

[0075] In the second rotational position of the turntable 50, the second SI object 12 disposed in the second receiving area 52 is at least partially within the laser processing area 40 and the first SI object 11 disposed in the first receiving area 51 is outside the laser processing area 40.

[0076] Further, the laser processing station 20 has a laser irradiation preparation unit 60 for preparing a laser irradiation, wherein the laser irradiation preparation unit 60 is arranged to detect a position of the second SI object 12 received in the second receiving area 52 in the first rotational position of the turntable 50 and to transmit information about the detected position to the laser unit 30. The laser unit 30 is configured to use the transmitted information as an input variable for a subsequent laser irradiation of the second SI object 12.

[0077] In this way, an automatic layout adjustment to the detected position of the SI object in question can be achieved. This is also helpful if the SI object, e.g. a passport, should slightly rotate or slip in the pick-up area, because the SI object can be lasered without having to adjust the laser unit. In this way, rejects can be reduced overall.

[0078] In one embodiment, the laser irradiation preparation unit 60 has a camera with which an image of the second SI object 12 recorded in the second recording area 52 can be recorded for position detection. The camera is also arranged fixed in position relative to the housing 21.

[0079] FIG. 2 shows a perspective sketch of the turntable 50 in a separated form, FIG. 3 shows the turntable 50 viewed from one side. In FIG. 2, the first SI object 11 and the second SI object 12 are indicated by dashed lines.

[0080] The turntable 50 has a first support area 81 and a first cover area 82 to form the first receiving area 51, such that the first SI object 11 received in the first receiving area 51 is located between the first support area 81 and the first cover area 82. The first support area 81 and the first cover area 82 are arranged substantially parallel to each other, so that a kind of pocket for receiving an SI object is formed between them.

[0081] Furthermore, the turntable 50 has a second support area 83 and a second cover area 84 to form the second receiving area 52, such that the second SI object 12 received in the second receiving area 52 is located between the second support area 83 and the second cover area 84. The design is symmetrical with respect to the first support region 81 and the first cover region 82.

[0082] The design is further such that an SI object can be pushed from outside into the second receiving area 52 by a rectilinear movement along a first direction R1 when the turntable 50 is in the first rotational position shown in the figures. Since the design is symmetrical with respect to the axis of rotation D, in the second rotational position of the turntable 50, an SI object can be pushed from outside into the first receiving area 51 by a rectilinear movement along the first direction R1.

[0083] As indicated in FIG. 3, for loading the receiving areas 51, 52, the laser processing station 20 has a loading unit 70 which is arranged, in the first rotational position of the turntable 50, to push the second SI object 12 into the second receiving area 52 along the first direction R1 for loading the second receiving area 52, and to push the second SI object 12 out of the second receiving area 52 along a second direction R2 opposite to the first direction R1 for unloading the second receiving area 52. In one embodiment, the loading unit 70 has a first pusher 71 for pushing an SI object in along the first direction R1 and/or a second pusher 72 for pushing an SI object out along the second direction R2. The sliders 71, 72 have at least partially a linear and/or an angled structure. In the example shown, the first slider 71 has a linear structure extending along the first direction R1. The second slider 72 has an angled, L-shaped structure so that a vertical section 722 and a horizontal section 723 of the second slider 72 are formed. Thereby, the horizontal section extends along the second direction R2. With its vertical section 722, the second slider 72 engages, in an initial rest position (sketched in FIG. 3), a free area 505 formed around the rotation axis D of the turntable 50 by the support areas 81, 83 and the cover areas 82, 84. The free area 505 has, for example, a rectangular or circular horizontal cross-section.

[0084] The design is such that during rotation of the turntable 50 from the first rotational position to the second rotational position, the vertical portion 722 of the second slider 72 can remain engaged in the clearance area 505 when the second slider 72 is in the initial rest position. The horizontal section 723 of the second slider 72 is arranged above the turntable 50, as indicated in FIG. 3.

[0085] In one embodiment, a linear drive and/or a rack-and-pinion drive is provided to drive the sliders 71, 72.

[0086] In one variant (not shown in the figures), the loading unit 70 is configured to turn an SI object 180° about an axis of rotation parallel to the first direction R1, so that the other side of the SI object can also be lasered.

[0087] For receiving a waistband area of an SI object in the form of a booklet, in the embodiment shown, a groove 88 is formed on each of the support areas 81, 83, which extends parallel to the first direction R1 (and thus also parallel to the second direction R2). Alternatively or, as is the case in the example shown, in addition, a recess 87 is formed for this purpose on each of the cover areas 82, 84, which extends parallel to the first direction R1. The grooves 88 or recesses 87 extend continuously from the edge of the turntable 50 to the free area 505.

[0088] According to one embodiment, the grooves 88 or recesses 87 are formed offset transversely to the first direction R1 in the two support areas 81, 83 or cover areas 82, 84, depending on the design of the SI objects concerned, as indicated in FIG. 2; alternatively, they are formed aligned in one line.

[0089] The grooves 88 or recesses 87 are also designed as a preferably contactless guide for the first slider 71 and/or the second slider 72. For this purpose, the grooves 88 or recesses 87—viewed transversely to the first direction R1—are at least as wide or slightly wider than the slides 71, 72. The grooves 88 or recesses 87 open into the free area 505 in the centre of the turntable 50 in such a way that the second slide 72 can engage with its vertical section 722 in the free area 505 during the rotation of the turntable 50 without hindering the rotation. For an unloading operation, the second slider 72 can be moved, starting from its initial rest position, with its vertical section 722 along the respective groove 88 or the respective recess 87 and in this way push the corresponding SI object out of the turntable 50. This design in particular eliminates the need for vertical movement of the second slider 72.

[0090] The first slider 71 can be moved along the first direction R1 for a loading operation from an initial rest position (outlined in FIG. 3), in which it does not engage in the movement space of the turntable 50, in order to convey an SI object into the turntable 50. During this movement, the first pusher 71 can engage the respective groove 88 or the respective recess 87.

[0091] This design of the interaction between the turntable 50 and the two sliders 71, 72 enables a particularly fast and at the same time gentle transport of the SI objects into and out of the turntable 50 with a compact arrangement, especially because the movement of the sliders 71, 72 partly takes place directly in the turntable 50.

[0092] In an alternative not shown, the grooves 88 or recesses 87 can be formed to merge directly into one another, i.e. without the clearance area 505.

[0093] The turntable 50 has an alignment element 89 on one side of each receiving area 51, 52, which is used to align an SI item in a defined manner on this side during the loading process. In one variant, the alignment element 89 is adjustable in its position so that it can be set to a desired width/dimension of the SI items or passports. According to another variant, the alignment element 89 is perpendicular to the first direction R1 and thereby horizontally biased, for example by a return spring. In this way, the alignment element 89 can be pushed back when loading an SI item and thus automatically adapts to the SI item or fixes it.

[0094] In one embodiment, the alignment element 89 and/or the support areas 81, 83 have at least one tapering or sloping edge area in the form of a run-up slope, by means of which loading of an SI object is facilitated and at the same time the corresponding corners and/or edges of the SI object are protected.

[0095] Furthermore, the first cover area 82 has a window area 85 and the second cover area 84 has a window area 86, wherein in the first rotational position of the turntable 50 the window area 85 of the first cover area 82 at least partially encloses the laser processing area 40. The design is thus such that—in the first rotational position of the turntable 50—the laser irradiation can take place through the window area 85 of the first cover area 82. This allows the laser radiation to reach the SI object located there unhindered or unattenuated.

[0096] In one embodiment, the cover areas 82, 84 are reversibly detachably arranged on the remaining turntable 50. In this way, the cover areas 82, 84 can be easily exchanged for corresponding further cover areas (not shown in the figures) which differ in their window areas from the cover areas 82, 84. In this way, if necessary, a suitable adaptation to a certain type and/or size of SI objects or to a certain laser layout can be achieved.

[0097] Furthermore, the turntable 50 further has a first clamping element 91 movable back and forth between a clamping position and an open position. In this case, the first clamping element 91 is mounted in such a way that it can be moved back and forth parallel to the axis of rotation D, so that it can be moved from the open position into the clamping position by a movement along this direction, for example, according to the illustration in FIG. 3, by an upwardly directed movement, and from the clamping position into the open position by a movement in the opposite direction, for example, a downwardly directed movement.

[0098] The first SI object 11 received in the first receiving area 51 in the clamping position of the first clamping element 91 is pressed by the first clamping element 91—here from below—against an edge area of the window area 85 of the first cover area 82. This fixes the first SI object 11 in the first receiving area 51. Through this fixation, the first SI object 11 can be held in position in a suitably defined manner for laser irradiation. In the open position of the first clamping element 91, on the other hand, the first SI object 11 is movable between the first support area 81 and the first cover area 82.

[0099] Further, the turntable 50 has a second clamping member 92 movable back and forth between a clamping position and an open position, wherein in the clamping position of the second clamping member 92, the second SI article 12 received in the second support portion 52 is pressed against an edge portion of the window portion 86 of the second deck portion 84 by the second clamping member 92. This fixes the second SI object 12 in the second receiving area 52, and in the open position of the second clamping element 92, the second SI object 12 is movable between the second support area 83 and the second cover area 84. In the open position of the second clamping element 92, the second SI object 12 can thus be pushed out of the second receiving area 52 in the second direction R2, for example by the second slider 72.

[0100] The laser processing station 20 further has a gripping element 100 arranged below the turntable 50, which is set up to move the second clamping element 92 back and forth between the open position and the clamping position in the first rotational position of the turntable 50. For this purpose, the gripping element 100 is mounted parallel to the axis of rotation or vertically displaceable relative to the housing 21 of the laser processing station 20. The second clamping element 92 has a downwardly directed projection 101 on its underside, which can be gripped by the gripping element 100. For this purpose, the extension 101 projects through a through-opening provided for this purpose in the second support area 83.

[0101] The design at the location of the first clamping element 91 is analogous in this respect, so that in the second rotational position of the turntable 50, the first clamping element 91 can be moved accordingly by the gripping element 100.

[0102] In one embodiment, the clamping elements 91, 92 are each biased into the clamping position by at least one spring element (not shown in the figures), so that without any action of the gripping element 100 the respective SI object is fixed by the respective clamping element 91, 92. In particular, the design may be such that during the start of rotation of the turntable 50 from the first rotational position to the second rotational position, the extension 101 is moved laterally out of the gripping element 100 so that the respective clamping element remains in the clamping position. This enables suitable fixation of the SI objects during laser irradiation.

[0103] To prevent the first SI object 11 from bulging out in the window area 85 of the first cover area 82, the turntable 50 has a bracket 99 that is attached to the edge area of the window area 85 and presses the SI object towards the first clamping element 91. The bracket 99 is designed in such a way that it does not protrude into an area intended for laser engraving. The bracket 99 ensures a particularly high accuracy for the layout of the laser engraving.

[0104] A corresponding further bracket 99 is provided on the second deck area 84.

[0105] FIG. 4 shows an example of a device that has at least one further laser processing station 20′ in addition to the laser processing station 20. As an example, a case with a total of eight laser processing stations 20, 20′ is sketched here. The at least one further laser processing station 20′ is designed analogously to the first laser processing station 20.

[0106] The apparatus comprises a transport device 110 arranged to—alternately feed SI objects to the first and the at least one further laser processing station 20, 20′.

[0107] The transport device 110 is arranged to feed the SI objects—respectively to the loading unit 70 of the respective laser processing station 20, 20′, so that the SI objects can be loaded into the two receiving areas 51, 52 of the respective turntable 50, as described above. After a rotation of the turntable 50, the laser irradiation takes place, by which the SI objects are personalised. After a further rotation of the turntable 50, the SI objects are unloaded again from the turntable 50 by the loading unit 70. In FIG. 4, loading and unloading are each indicated by a double arrow, and the rotation of the respective turntable 50 is indicated by an arc-shaped arrow.

[0108] The transport device 110 has a main transport path 111, as well as two distribution transport paths 112 running at least transversely or perpendicularly to the main transport path 111. The transport device 110 is set up to feed the SI objects to the laser processing stations 20, 20′ or their loading units 70 via the main transport path 111 and the two distribution transport paths 112, and to transport the SI objects from the laser processing stations 20, 20′ back to the main transport path 111. In a variant for high throughput, the two distribution transport paths 112 each lead to at least two laser processing stations 20, 20′. In FIG. 1, the corresponding distribution transport path 112 leading to the first laser processing station 20 is indicated by a dashed line.

[0109] For a particularly suitable distribution of the SI items to the two distribution transport paths 112, the device also has a separating unit 113 arranged between the main transport path 111 and the distribution transport paths 112, via which the SI items are transported from the main transport path 111 alternately via parallel transport paths 117 to the two distribution transport paths 112. In this case, a connecting unit 114 is also provided, via which the finished personalised SI items are directed from the distribution transport paths 112 back onto the main transport path 111.

[0110] The transport device 110 may have guides that are used to hold SI items in the form of booklets in an open state during transport.

[0111] In one variant, the transport paths 111, 112, 117 have endless toothed belts. In one embodiment, the belts on the transport paths 111 and 117 have drivers for moving the SI objects, whereby for transport it is provided in particular that the SI objects are located in each case between the drivers. In one variant, a pneumatic element is provided for changing a transport direction, for example at a transition from one of the parallel transport paths 117 to the subsequent distribution transport path 112.

[0112] In one variant, the apparatus further has at least one further processing unit for further processing of the SI objects or at least one control unit for control of the SI objects arranged along the main transport path 111 before or after the laser processing stations 20, 20′.

[0113] A method for personalizing SI articles with at least a first laser processing station comprises the following steps:

[0114] (a) placing a first SI object 11 in a first receiving area 51 of a turntable 50 of the laser processing station 20;

[0115] (b) arranging a second SI object 12 in a second receiving area 52 of the turntable 50;

[0116] (c) laser irradiating the first SI object 11 received in the first receiving area 51 for personalisation when the turntable 50 is in a first rotational position, by means of a laser unit 30 of the laser processing station 20;

[0117] (d) rotating the turntable 50 from the first rotational position to a second rotational position;

[0118] (e) laser irradiating the second SI object 12 received in the second receiving area 52 for personalisation when the turntable 50 is in the second rotational position, by means of the laser unit 30.

[0119] In one variant, the following step is also provided for:

[0120] (f) detecting a position of the second SI object 12 received in the second receiving area 52 when the turntable 50 is in the first rotational position and using information about the position in step (e).

[0121] For the temporal sequence, the following sequence is provided in a variant. The dots each stand for a temporal phase, whereby the sequence of the dots corresponds to the temporal sequence of the phases. [0122] setting the turntable 50 to the second rotational position [0123] loading a first SI object into the first pick-up area 51 (in step (a)) [0124] detecting the position of the first SI object in the first recording area 51 by means of the laser irradiation preparation unit 60 and generating corresponding position information [0125] rotating the turntable from the second rotational position to the first rotational position (FIGS. 1 to 3 show the first rotational position) [0126] laser irradiating the first SI object using the position information (in step (c)) and

[0127] loading a second SI object into the second receiving area 52 (in step (b)) and

[0128] detecting the position of the second SI object in the second receiving area 52 by means of the laser irradiation preparation unit 60 and generating corresponding position information (in step (f)) [0129] rotating the turntable 50 from the first rotational position to the second rotational position (in step (d)) [0130] laser irradiating the second SI object using the position information (in step (e)) and

[0131] unloading the first SI object from the first receiving area 51 and

[0132] loading a third SI object into the first receiving area 51 and

[0133] detecting the position of the third SI object in the first receiving area 51 by means of the laser irradiation preparation unit 60 and producing corresponding position information [0134] rotating the turntable 50 from the second rotational position to the first rotational position etc.

[0135] In one embodiment, the turntable 50 is rotated in opposite directions so that the turntable 50 rotates back and forth between the two rotational positions. Alternatively, the rotations take place in the same direction of rotation, so that the turntable 50 is rotated further with each rotation.

[0136] In one embodiment, the transmission of the corresponding position information takes place in each case during the rotation of the turntable 50.

[0137] Furthermore, in a variant for loading, in step (b), in the first rotational position of the turntable 50, the second SI object 12 is pushed along the first direction R1 into the second receiving area 52 and, in a further step (g), in the first rotational position of the turntable 50, the second SI object 12 is pushed along a second direction R2,—opposite to the first direction R1, out of the second receiving area 52. In one embodiment, the above-mentioned sliders 71, 72 are used for this purpose.

[0138] In a device with several laser processing stations 20, 20′, the following step is also provided in a variant:

[0139] (h) transporting SI items and distributing the SI items to several laser processing stations 20, 20′.

[0140] With the device described, it is possible to keep the number of laser processing stations used in parallel particularly low. By using several laser processing stations working in parallel, the limiting influence of non-productive times on the throughput can be kept particularly small or practically eliminated.

[0141] At the same time, the device can be designed comparatively compactly, especially with a compact floor plan.

[0142] The variants of the device described above, as well as their construction and operating aspects, are merely intended to provide a better understanding of the structure, the mode of operation and the properties; they do not limit the disclosure to the embodiments. The figures are schematic, with essential features and effects shown, in some cases significantly enlarged, to illustrate the functions, operating principles, technical embodiments and features. In this context, each mode of operation, principle, technical embodiment and feature disclosed in the figures or in the text can be freely and arbitrarily combined with all claims, each feature in the text and in the other figures, other modes of operation, principles, technical embodiments and features contained in this disclosure or resulting therefrom, so that all conceivable combinations of the described system can be assigned. Combinations between all individual embodiments in the text, i.e. in each section of the description, in the claims and also combinations between different variants in the text, in the claims and in the figures are included. The claims also do not limit the disclosure and thus the possible combinations of all disclosed features with each other. All disclosed features are also explicitly disclosed here individually and in combination with all other features.