DEVICE FOR COOLING A BUS BAR

Abstract

A device for cooling a bus bar includes a heat absorption element, a heat transportation system and a heat output element. The heat absorption element and heat output element rest essentially in a form-fit manner on respective heat sources or heat sinks, with additional contact pressure being applied with the heat absorption element and heat output element by compression springs or contact elements.

Claims

1.-5. (canceled)

6. A device for cooling a bus bar, said device comprising: a heat absorption element configured to rest in a form-fit manner on the bus bar; a heat output element configured to rest in a form-fit manner on a heat sink and aligned in parallel to the heat absorption element; and compression springs or contact elements arranged between the heat absorption element and the heat output element to apply an additional contact force.

7. The device of claim 6, further comprising a heat transfer media connecting the heat absorption element and the heat output element to the bus bar and the heat sink, respectively.

8. The device of claim 7, wherein the heat transfer media is a heat-conducting paste.

9. The device of claim 6, further comprising a thermally-conductive insulation via which the heat absorption element contacts the bus bar.

10. The device of claim 6, further comprising a heat transportation system connecting the heat absorption element to the heat output element in a thermally conductive manner.

11. The device of claim 6, constructed for cooling the bus bar in a compact electrical switching system with bus bar arrangements.

12. The device of claim 11, wherein the electrical switching system includes a control cabinet of converters, a low voltage switching system, or a medium voltage switching system.

Description

[0027] The invention and further advantageous embodiments thereof will now be described in greater detail by reference to basic representations of exemplary embodiments, in the figures:

[0028] FIG. 1 shows the principle of heat source heat sink,

[0029] FIGS. 2, 3 show different views of the heat output or absorption elements,

[0030] FIGS. 4, 5 show these elements with compression springs,

[0031] FIGS. 6, 7 show the device on the bus bar and heat sink,

[0032] FIGS. 8, 9 show the device for cooling within a power electronic apparatus.

[0033] FIG. 1 shows a basic representation of a heat source with a temperature T1 and a heat sink 12 with a temperature T2. Here T1 is larger than T2. Here the heat is to be guided out of the heat source to the heat sink 12.

[0034] This takes place, as shown in FIG. 2 and FIG. 3 in different perspectives, by a heat absorption element 1 being connected in a thermally conducting manner to a heat output element 3 by way of a heat transportation system 2, Here a number of heat absorption elements 1, heat output element 3 and also a number of heat transportation systems 2 can be arranged in a scalable manner on a bus bar 6.

[0035] FIG. 4 shows the arrangement according to FIG. 2 and FIG. 3 with a compression spring 4 between the heat absorption element 1 and heat output element 3, in order to obtain an additional contact pressure on certain heat sources and heat sinks, in order to improve the heat transfer in each case. Here the compression springs 4 are guided through a guiding pin 5. This arrangement permits a compensation with thermal and/or mechanical expansions of the bus bar 6, without negatively affecting the thermally-conducting contact.

[0036] FIG. 6, FIG. 7 show the arrangement with compression springs 4 now in use on a bus bar 6, which is arranged with an insulation layer 7 at a distance from the heat absorption element 1. A heat-conducting paste 9 is provided between the bus bar 6 and heat absorption element 1 and/or between the heat absorption element 3 and heat sink 12, for instance, in order to output the heat from the bus bar 6 via the insulation layer 7 to the heat absorption element 1 or from the heat output element 3 to the heat sink 12. The heat sink 12 is embodied as a heat exchanger, for instance, which is arranged outside of a control cabinet.

[0037] FIG. 8 shows arrangements of this type within a control cabinet, for instance, wherein a number of semiconductor modules 10 are arranged in electrical contact with the bus bar 6, and wherein additionally the bus bar 6 is additionally cooled by the afore-described arrangement.

[0038] The semiconductor modules 10 are advantageously arranged likewise in a heat-conducting manner on a heat sink 12 by taking the insulation requirements into account.

[0039] The semiconductor modules 10 can likewise be arranged in a direct thermally-conducting manner on the bus bar 6 according to FIG. 9 by taking the insulation requirements into account.

[0040] In accordance with the invention, a number of heat absorption elements 1 can also be guided on a heat output element 3. For instance, a three-phase bus bar arrangement with in each case one or more heat absorption elements 1 guide their heat to a heat output element 3, in particular outside of a control cabinet.

[0041] The device for cooling a bus bar 6 is suited in particular to the closed, constricted spatial conditions, in which above all power electronic devices, for instance converters of comparatively high power, are provided in control cabinets.

[0042] The device for cooling a bus bar is likewise also suited to switching systems with particularly constricted spatial conditions, from which the heat is to be discharged. These can be low and medium voltage level switching systems.