PACKAGING UNIT FOR SUBSTRATES

Abstract

The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.

Claims

1. A packaging unit for substrates, comprising: a first substrate, a spacer, and a second substrate, wherein the spacer is placed onto the first substrate and the second substrate is placed onto the spacer, wherein a first metal deposit is placed onto a surface of the first substrate and a second metal deposit is placed onto a surface of the second substrate in each case and one adhesive dot is arranged on each of the two metal deposits, and wherein the spacer is placed onto the first substrate in such a manner that the spacer is only in contact with the first substrate outside of the adhesive dot, wherein the spacer is web-like, and wherein at least the first substrate comprises a multiplicity of individual substrates arranged next to one another and the spacer edges the individual substrates.

2. The packaging unit according to claim 1, wherein the first substrate is a first metal-ceramic substrate and the second substrate is a second metal-ceramic substrate.

3. The packaging unit according to claim 2, wherein the first and the second metal-ceramic substrate comprise a ceramic layer and at least one metallization layer in each case and the metallization layer has the surface onto which the metal deposit is applied.

4. The packaging unit according to claim 1, wherein the metal deposits comprise a metal that can be soldered or sintered or an alloy that can be soldered or sintered.

5. The packaging unit according to claim 1, wherein the spacer has a thickness between 200 and 1000 μm.

6. The packaging unit according to claim 1, wherein the spacer is produced from plastic or cardboard.

7. The packaging unit according to claim 1, furthermore comprising a second spacer, which is placed onto the second substrate.

8. The packaging unit according to claim 7, wherein the spacer and the second spacer are identical in terms of design.

9. The packaging unit according to claim 1, wherein the adhesive dots are smearable at room temperature.

10. The packaging unit according to claim 1, wherein the adhesive dots are configured in order to fix one electronic component on the first substrate and on the second substrate in each case.

11. The packaging unit according to claim 1, wherein the first substrate and/or the second substrate is a direct copper bonding substrate or a direct aluminium bonding substrate.

12. A packaging stack comprising a multiplicity of packaging units according to claim 1 stacked on top of one another.

13. A method for packaging substrates, comprising the following steps: providing a first substrate, placing a spacer onto the first substrate, and placing a second substrate onto the spacer, wherein a first metal deposit is placed onto a surface of the first substrate and a second metal deposit is placed onto a surface of the second substrate in each case and one adhesive dot is arranged on each of the two metal deposits, wherein the spacer is placed onto the first substrate in such a manner that the spacer is only in contact with the first substrate outside of the adhesive dot, wherein the spacer is web-like, and wherein at least the first substrate comprises a multiplicity of individual substrates arranged next to one another and the spacer edges the individual substrates.

14. The packaging unit according to claim 1, wherein the spacer has a thickness between 300 and 800 μm.

Description

SHORT DESCRIPTION OF THE FIGURES

[0041] FIG. 1 shows a packaging unit according to an embodiment.

[0042] FIG. 2 shows a packaging unit according to an embodiment.

[0043] FIG. 3 shows a metal-ceramic substrate according to an embodiment.

[0044] FIG. 4 shows a packaging stack according to an embodiment.

DETAILED DESCRIPTION OF EXEMPALRY EMBODIMENTS

[0045] FIG. 1 and FIG. 2 show a packaging unit 10 for metal-ceramic substrates 1, 1′. The packaging unit 10 comprises a first substrate 1, a spacer 4 and a second substrate 1′. The spacer 4 is placed onto the first substrate 1 and the second substrate 1′ is placed onto the spacer 4.

[0046] The metal-ceramic substrate 1, 1′ can be produced by a direct copper bonding (DCB) method or direct aluminium bonding (DAB) method and comprise a multiplicity of individual substrates arranged next to one another. The metal-ceramic substrate 1, 1′ has a ceramic layer 11, 11′ and at least one metallization layer 12, 12′. The metal-ceramic substrate 1, 1′ preferably has two metallization layers in all, namely the metallization layer 12, 12′ and a further metallization layer, which is not shown, on the other side of the ceramic layer 11, 11′. As also shown in FIG. 3, one metal deposit 2, 2′ is applied onto an upper side of the metallization layer 12 of the two substrates 1, 1′ in each case and one adhesive dot 3, 3′ is arranged on each of the two metal deposits 2, 2′. The metal deposit 2, 2′ comprises a metal that can be soldered or sintered or an alloy that can be soldered or sintered. The adhesive dots 3, 3′ are tacky and smearable at room temperature or in air. The adhesive dots 3, 3′ face in the same direction, upwards here, i.e. the two adhesive dots 3, 3′ are both constructed on the upper sides of the respective substrates 1, 1′. An electronic component, for example a chip, lamp, resistor, capacitor, etc. can be applied on the respective adhesive dots 3, 3′.

[0047] The spacer 4 is of web-like or grid-shaped construction and placed onto the first substrate 1 in such a manner that the spacer 4 is only in contact with the first substrate 1 outside of the adhesive dot 3. The spacer 4 can be produced from rollable plastic or cardboard. A thickness or height of the spacer 4 can be between 200 and 1000 μm, preferably between 300 and 800 μm, so that a sum of metal deposit 2, adhesive dot 3 and, if appropriate, clearance distance does not fall below a lower limit of the thickness of the spacer 4.

[0048] The upper limit of the thickness of the spacer 4 can further be designed such that a starting material for the spacer 4 can be rolled. If at least one substrate 1, 1′ comprises a multiplicity of individual substrates arranged next to one another, the spacer 4 edges the individual substrates, so that the adhesive dots 3 are not contacted (see FIG. 2).

[0049] As shown in FIG. 4, the packaging unit 10 can furthermore have a further spacer 4′, which is placed onto the second substrate 1′. A packaging stack can be realized in this manner, which comprises a multiplicity of packaging units 10 stacked on top of one another.

Preferred Embodiments

[0050] 1. A packaging unit (10) for substrates (1, 1′), comprising: [0051] a first substrate (1), [0052] a spacer (4), and [0053] a second substrate (1′), [0054] wherein the spacer (4) is placed onto the first substrate (1) and the second substrate (1′) is placed onto the spacer (4), [0055] wherein a metal deposit (2, 2′) is placed onto a surface of the first substrate (1) and onto a surface of the second substrate (1′) in each case and one adhesive dot (3, 3′) is arranged on each of the two metal deposits (2, 2′), and [0056] wherein the spacer (4) is placed onto the first substrate (1) in such a manner that the spacer (4) is only in contact with the first substrate (1) outside of the adhesive dot (3).

[0057] 2. The packaging unit (10) according to the preceding embodiment, wherein the first substrate (1) is a first metal-ceramic substrate and the second substrate (1′) is a second metal-ceramic substrate.

[0058] 3. The packaging unit (10) according to the preceding embodiment, wherein the first and the second metal-ceramic substrate (1, 1′) comprise a ceramic layer (11, 11′) and at least one metallization layer (12, 12′) in each case and the metallization layer (12, 12′) has the surface onto which the metal deposit (2, 2′) is applied.

[0059] 4. The packaging unit (10) according to one of the preceding embodiments, wherein the metal deposit (2, 2′) comprises a metal that can be soldered or sintered or an alloy that can be soldered or sintered.

[0060] 5. The packaging unit (10) according to one of the preceding embodiments, wherein the spacer (4) is web-like.

[0061] 6. The packaging unit (10) according to one of the preceding embodiments, wherein the spacer (4) has a thickness between 200 and 1000 μm and preferably a thickness between 300 and 800 μm.

[0062] 7. The packaging unit (10) according to one of the preceding embodiments, wherein the spacer (4) is produced from plastic or cardboard.

[0063] 8. The packaging unit (10) according to one of the preceding embodiments, furthermore comprising a further spacer (4′), which is placed onto the second substrate (1′).

[0064] 9. The packaging unit (10) according to the preceding embodiment, wherein the spacers (4) are identical in terms of design.

[0065] 10. The packaging unit (10) according to one of the preceding embodiments, wherein the adhesive dots (3, 3′) are smearable at room temperature.

[0066] 11. The packaging unit (10) according to one of the preceding embodiments, wherein the adhesive dots (3, 3′) are configured in order to fix one electronic component on the first substrate (1) and on the second substrate (1′) in each case.

[0067] 12. The packaging unit (10) according to one of the preceding embodiments, wherein the first substrate (1) and/or the second substrate (1′) is a direct copper bonding substrate or a direct aluminium bonding substrate.

[0068] 13. The packaging unit (10) according to one of the preceding embodiments, wherein at least the first substrate (1) comprises a multiplicity of individual substrates arranged next to one another and the spacer (4) edges the individual substrates.

[0069] 14. A packaging stack comprising a multiplicity of packaging units (10) according to one of the preceding embodiments stacked on top of one another.

[0070] 15. A method for packaging substrates (1, 1′), comprising the following steps: [0071] providing a first substrate (1), [0072] placing a spacer (4) onto the first substrate (1), and [0073] placing a second substrate (1′) onto the spacer (4), [0074] wherein a metal deposit (2, 2′) is placed onto a surface of the first substrate (1) and onto a surface of the second substrate (1′) in each case and one adhesive dot (3, 3′) is arranged on each of the two metal deposits (2, 2′), and [0075] wherein the spacer (4) is placed onto the first substrate (1) in such a manner that the spacer (4) is only in contact with the first substrate (1) outside of the adhesive dot (3).

[0076] Additionally, it is noted that “comprising” and “having” does not exclude other elements or steps and “a” or “an” do not exclude a multiplicity. Furthermore, it may be pointed out that features or steps, which have been described with reference to one of the above exemplary embodiments, can also be used in combination with other features or steps of other above-described exemplary embodiments. Reference numbers in the claims are not to be seen as limiting.