Flexible printed circuit (FPC) board and method for manufacturing the same and OLED display device

Abstract

A FPC board and a method for manufacturing the same and an OLED display device are provided. The FPC board includes a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer. The thickness of the circuit board terminal is larger than the sum of the thicknesses of the first wire layer and the first protective layer. When the FPC board is connected to the OLED panel, one side of the base substrate on which the panel terminal is provided is opposite to one side of the substrate on which the circuit board terminal is provided, such that the base substrate overlaps with the substrate to connect the circuit board terminal and the panel terminal.

Claims

1. A flexible printed circuit (FPC) board, comprising a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on the one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer, wherein the thickness of the circuit board terminal is larger than the sum of the thickness of the first wire layer and the thickness of the first protective layer.

2. The FPC board of claim 1, further comprising a second wire layer disposed on the other side of the substrate and a second protective layer covering the second wire layer.

3. The FPC board of claim 2, wherein the first wire layer and the second wire layer comprise copper; and the first protective layer and the second protective layer comprise polyimide (PI).

4. The FPC board of claim 1, wherein the circuit board terminal comprises a conductive bump disposed at an edge on the one side of the substrate and connected to the first wire layer, and a conductive film disposed on the conductive bump.

5. The FPC board of claim 4, wherein the thickness of the conductive bump is larger than the sum of the thickness of the first wire layer and the thickness of the first protective layer; and the conductive bump and the first wire layer include the same material.

6. The FPC board of claim 4, wherein the conductive film is formed by electroplating on the conductive bump.

7. An organic light-emitting diode (OLED) display device, comprising an OLED panel and a flexible printed circuit (FPC) board electrically connected to the OLED panel, wherein the FPC board is the FPC board of claim 1; and the OLED panel comprises a base substrate and a panel terminal disposed at an edge on one side of the base substrate, the one side of the base substrate on which the panel terminal is provided is opposite to the one side of the substrate on which the circuit board terminal is provided, the base substrate overlaps with the substrate such that the circuit board terminal is connected to the panel terminal, and the projection of an edge of a portion of the base substrate overlapping the substrate away from the center of the base substrate on the FPC board overlaps with the first protective layer.

8. A method for manufacturing a flexible printed circuit (FPC) board, comprising the steps of: Step S1, providing a substrate; Step S2, forming and patterning a first conductive material film on one side of the substrate to form a first wire layer and a terminal pattern connected to the first wire layer and disposed at an edge on the one side of the substrate; Step S3, manufacturing a conductive material pattern on the terminal pattern to form a conductive bump connected to the first wire layer and disposed at an edge on the one side of the substrate; Step S4, covering the first protective layer on the first wire layer; and Step S5, manufacturing a conductive film on the conductive bump to form a circuit board terminal comprising the conductive bump and the conductive film; wherein in Step S2, the first conductive material film is formed on the one side of the substrate by hot pressing; in Step S3, the conductive material pattern is manufactured on the terminal pattern by hot pressing to form the conductive bump; and in Step S5, the conductive film is manufactured on the conductive bump by electroplating.

9. The method for manufacturing a FPC board of claim 8, wherein Step S2 further forms and patterns a second conductive material film on the other side of the substrate to form a second wire layer; and Step S4 further covers the second protective layer on the second wire layer.

Description

DESCRIPTION OF DRAWINGS

(1) For a better understanding of the features and technical aspects of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only for reference and description, and are not intended to limit the present invention. Among the accompanying drawings,

(2) FIG. 1 is a schematic structural diagram of a conventional FPC board;

(3) FIG. 2 is a schematic diagram showing the connection between the FPC board in FIG. 1 and an OLED panel;

(4) FIG. 3 is a schematic structural diagram of a FPC board according to the present invention;

(5) FIG. 4 is a flowchart of a method for manufacturing a FPC board according to the present invention;

(6) FIG. 5 is a schematic diagram of Step S2 of a method for manufacturing a FPC board according to the present invention;

(7) FIG. 6 is a schematic diagram of Step S3 of a method for manufacturing a FPC board according to the present invention;

(8) FIG. 7 is a schematic diagram of Step S4 of a method for manufacturing a FPC board according to the present invention; and

(9) FIG. 8 is a schematic structural diagram of an OLED display device according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(10) In order to further clarify the technical means adopted by the present invention and its effects, the following is a detailed description in conjunction with preferred embodiments of the present invention and the accompanying drawings.

(11) Referring to FIG. 3, the present invention provides a FPC board including a substrate 10, a first wire layer 20 disposed on one side of the substrate 10, a circuit board terminal 30 disposed at an edge on the one side of the substrate 10 and connected to the first wire layer 20, and a first protective layer 40 covering the first wire layer 20. The thickness of the circuit board terminal 30 is larger than the sum of the thickness of the first wire layer 20 and the thickness of the first protective layer 40.

(12) Specifically, the circuit board terminal 30 includes a conductive bump 31 disposed at an edge on the one side of the substrate 10 and connected to the first wire layer 20, and a conductive film 32 disposed on the conductive bump 31. The thickness of the conductive bump 31 is larger than the sum of the thickness of the first wire layer 20 and the thickness of the first protective layer 40.

(13) Furthermore, the conductive bump 31 and the first wire layer 20 can include the same material.

(14) Specifically, the conductive film 32 may be formed by electroplating on the conductive bump 31.

(15) Specifically, the FPC board further includes a second wire layer 50 disposed on the other side of the substrate 10 and a second protective layer 60 covering the second wire layer 50.

(16) Specifically, the first wire layer 20 and the second wire layer 50 may include copper or other low-resistance wire material.

(17) Specifically, the first protective layer 40 and the second protective layer 60 may include polyimide (PI).

(18) Specifically, with reference to FIG. 8, the FPC board of the present invention is configured to electrically connect the OLED panel 1 to transmit a test signal thereto. The OLED panel 1 includes a base substrate 101 and a panel terminal 102 disposed at an edge on one side of the base substrate 101. The one side of the base substrate 101 on which the panel terminal 102 is provided is opposite to the one side of the substrate 10 on which the circuit board terminal 30 is provided. The base substrate 101 overlaps with the substrate 10 such that the circuit board terminal 30 is connected to the panel terminal 102 to electrically connect the FPC board and the OLED panel 1. The projection of an edge of a portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 on the FPC board overlaps with the first protective layer 40. The base substrate 101 includes a rigid substrate and a flexible substrate (not shown) which are sequentially disposed. The panel terminal 102 is disposed on the flexible substrate. The OLED panel 1 is manufactured by laser cutting, such that the flexible substrate material at the edge of the substrate 101 is carbonized.

(19) It should be noted that, on the FPC board according to the present invention, the thickness of the circuit board terminal 30 for contacting the panel terminal of the OLED panel 1 is larger than the sum of the thickness of the first wire layer 20 connected to the circuit board terminal 30 and the thickness of the first protective layer 40. By designing the size of the first protective layer 40 such that the FPC board is electrically connected to the OLED panel 1, the projection of an edge of a portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 on the FPC board overlaps with the first protective layer 40. As a result, when the FPC board is deformed by the connection fixture, the edge of the portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 is in contact with the first protective layer 40, instead of the circuit board terminal 30. Moreover, the connection between the circuit board terminal 30 and the panel terminal 102 is not affected by the deformation of the FPC board even if the flexible substrate material at the edge of the base substrate 101 is made conductive due to carbonization. Since the edge of the base substrate 101 is not in contact with the circuit board terminal 30, there will not be any short circuit between the base substrate 101 and the circuit board terminal 30, and the product quality is improved.

(20) Referring to FIG. 4, the present invention further provides a method for manufacturing the FPC board described above, which includes the following steps:

(21) In Step S1, referring to FIG. 5, a substrate 10 is provided.

(22) In Step S2, referring to FIG. 5, a first conductive material film is formed and patterned on one side of the substrate 10 to form a first wire layer 20 and a terminal pattern 39 connected to the first wire layer 20 and disposed at an edge on the one side of the substrate 10.

(23) Specifically, in Step S2, the first conductive material film is formed on the one side of the substrate 10 by hot pressing.

(24) Specifically, Step S2 further forms and patterns a second conductive material film on the other side of the substrate 10 to form a second wire layer 50.

(25) In Step S3, referring to FIG. 6, a conductive material pattern is manufactured on the terminal pattern 39 to form a conductive bump 31 connected to the first wire layer 20 and disposed at an edge on the one side of the substrate 10.

(26) Specifically, in Step S3, the conductive material pattern is manufactured on the terminal pattern 39 by hot pressing to form the conductive bump 31.

(27) In Step S4, referring to FIG. 7, the first protective layer 40 is covered on the first wire layer 20.

(28) Specifically, the Step S4 further covers the second protective layer 60 on the second wire layer 50.

(29) In Step S5, referring to FIG. 8, a conductive film 32 is manufactured on the conductive bump 31 to form a circuit board terminal 30 including the conductive bump 31 and the conductive film 32.

(30) Specifically, in Step S5, the conductive film 32 is manufactured on the conductive bump 31 by electroplating.

(31) It should be noted that, on the FPC board manufactured by the method for manufacturing a FPC board according to the present invention, the thickness of the circuit board terminal 30 for contacting the panel terminal of the OLED panel 1 is larger than the sum of the thickness of the first wire layer 20 connected to the circuit board terminal 30 and the thickness of the first protective layer 40. By designing the size of the first protective layer 40 such that the FPC board is electrically connected to the OLED panel 1, the projection of an edge of a portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 on the FPC board overlaps with the first protective layer 40. As a result, when the FPC board is deformed by the connection fixture, the edge of the portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 is in contact with the first protective layer 40, instead of the circuit board terminal 30. Moreover, the connection between the circuit board terminal 30 and the panel terminal 102 is not affected by the deformation of the FPC board even if the flexible substrate material at the edge of the base substrate 101 is made conductive due to carbonization. Since the edge of the base substrate 101 is not in contact with the circuit board terminal 30, there will not be any short circuit between the base substrate 101 and the circuit board terminal 30, and the product quality is improved.

(32) Based on the same inventive concept, referring to FIG. 8, the present invention further provides an OLED display device, including an OLED panel 1 and a FPC board electrically connected to the OLED panel 1.

(33) The FPC board is the FPC board described above, and the structure of the FPC board is not repeatedly described herein.

(34) The OLED panel 1 includes a base substrate 101 and a panel terminal 102 disposed at an edge on one side of the base substrate 101. The one side of the base substrate 101 on which the panel terminal 102 is provided is opposite to the one side of the substrate 10 on which the circuit board terminal 30 is provided. The OLED panel 1 is fabricated by laser cutting, which causes carbonization of the flexible substrate material at the edge of the substrate 101. The base substrate 101 overlaps with the substrate 10 such that the circuit board terminal 30 is connected to the panel terminal 102. The projection of an edge of a portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 on the FPC board overlaps with the first protective layer 40.

(35) Specifically, the base substrate 101 includes a terminal region 1011 disposed at an edge. The panel terminal 102 is disposed in the terminal region 1011. The thickness of the base substrate 101 in the terminal region 1011 is smaller than the thickness of the base substrate 101 outside the terminal region 1011. A portion of the base substrate 101 overlapping the substrate 10 is disposed in the terminal region 1011.

(36) It should be noted that, on the FPC board in the OLED display device according to the present invention, the thickness of the circuit board terminal 30 for contacting the panel terminal of the OLED panel 1 is larger than the sum of the thickness of the first wire layer 20 connected to the circuit board terminal 30 and the thickness of the first protective layer 40. By designing the size of the first protective layer 40, the projection of an edge of a portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 on the FPC board overlaps with the first protective layer 40. As a result, when the FPC board is deformed by the connection fixture, the edge of the portion of the base substrate 101 overlapping the substrate 10 away from the center of the base substrate 101 is in contact with the first protective layer 40, instead of the circuit board terminal 30. Moreover, the connection between the circuit board terminal 30 and the panel terminal 102 is not affected by the deformation of the FPC board even if the flexible substrate material at the edge of the base substrate 101 is made conductive due to carbonization. Since the edge of the base substrate 101 is not in contact with the circuit board terminal 30, there will not be any short circuit between the base substrate 101 and the circuit board terminal 30, and the product quality is improved.

(37) In summary, the FPC board according to the present invention includes a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on the one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer, wherein the thickness of the circuit board terminal is larger than the sum of the thickness of the first wire layer and the thickness of the first protective layer. When the FPC board is connected to the OLED panel, the one side of the base substrate on which the panel terminal is provided is opposite to the one side of the substrate on which the circuit board terminal is provided, such that the base substrate overlaps with the substrate to connect the circuit board terminal and the panel terminal. The projection of an edge of a portion of the base substrate overlapping the substrate away from the center of the base substrate on the FPC board overlaps with the first protective layer, which can effectively prevent the edge of the base substrate from being in contact with the circuit board terminal to cause a short circuit, thereby improving the product quality. The method for manufacturing the FPC board according to the present invention can prevent a short circuit between the circuit board terminal and the OLED panel when the manufactured FPC board is connected with the OLED panel, thereby improving the product quality. The OLED display device according to the present invention can prevent a short circuit between the circuit board terminal of the FPC board and the OLED panel, thereby improving the product quality.

(38) In the above, for those with ordinary skill in the art, various other changes and modifications can be made according to the technical solutions and technical concept of the present invention, and all such changes and modifications are within the scope of the claims of the present invention.