SENSOR

Abstract

A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

Claims

1. A sensor, wherein the sensor comprises a housing having an accommodating room, a flexible plate that is accommodated in the accommodating room and is moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component configured for sensing the medium pressure change, wherein the pressure sensing component and the flexible plate are assembled together and can move together; and the sensor further comprises a disturbance concentrator accommodated in the accommodating room and configured for concentrating medium disturbances around it such that the pressure sensing component performs a pressure detection by collecting the medium pressure changes around the disturbance concentrator.

2. The sensor according to claim 1, wherein the pressure sensing component is electrically connected to the flexible plate; or the sensor is any one of a force sensor, a vibration sensor, a pressure gauge and an underwater sound sensor.

3. The sensor according to claim 1, wherein the housing comprises a base and an outer cover covered onto the base to define the accommodating room together, the flexible plate divides the accommodating room into a first room and a second room, such that the first room and the second room are located at opposite sides of the flexible plate.

4. The sensor according to claim 3, wherein the pressure sensing component is arranged in the first room, the disturbance concentrator is arranged in the second room, and the flexible plate is provided with a through-hole between the pressure sensing component and the disturbance concentrators to allow the pressure sensing component to collect the air pressure changes around the disturbance concentrator through the through-hole.

5. The sensor according to claim 1, wherein the disturbance concentrator has a columnar shape or block shape.

6. The sensor according to claim 1, wherein the flexible plate is cantilevered in the accommodating room, such that one end of the flexible plate connects to an inner sidewall of the housing and the other end thereof is a cantilever end.

7. The sensor according to claim 6, wherein the sensor further comprises a limiter provided in the accommodating room for limiting amount of deformation of the flexible plate, and the limiter is disposed close to the cantilever end of the flexible plate and spaced from the cantilever end of the flexible plate.

8. The sensor according to claim 1, wherein both ends of the flexible plate connect to an inner sidewall of the housing; or, the flexible plate comprises a mounting portion provided in the accommodating room, a fixing portion connecting with the inner sidewall of the housing, and an elastic connecting portion elastically connected between the fixing portion and the mounting portion, the pressure sensing component being mounted on the mounting portion.

9. The sensor according to claim 8, wherein the sensor further comprises a limiter provided in the accommodating room to limit amount of deformation of the flexible plate, the mounting portion of the flexible plate is provided with a through-hole corresponding to the pressure sensing component to allow the pressure sensing component to collect the pressure changes through the through-hole, and the limiter is disposed close to an edge of the through-hole and is spaced from the edge of the through-hole.

10. (canceled)

11. The sensor according to claim 3, wherein the sensor further comprises a conductive pillar provided in the accommodating room and configured for transmitting signal to the flexible plate, one end of the conductive pillar connects to an inner wall of the outer cover, and the other end thereof connects to the flexible plate.

12. The sensor according to claim 1, wherein the sensor further comprises an inner cover provided in the accommodating room, and the inner cover is mounted on the flexible plate and is covered outside the pressure sensing component.

13. The sensor according to claim 12, wherein the sensor further comprises a conductive pillar provided in the accommodating room and configured for transmitting signal from the housing to the flexible plate, one end of the conductive pillar connects to an inner wall of the housing and the other end thereof connects to the inner cover or extends through the inner cover to connect to the flexible plate.

14. (canceled)

15. (canceled)

16. (canceled)

17. The sensor according to claim 3, wherein the sensor further comprises an inner cover and a conductive pillar arranged in the accommodating room, the inner cover is mounted on the flexible plate and covered outside the pressure sensing component, the inner cover, outer cover and flexible plate form a filling cavity together, the outer cover of the housing is provided with an opening communicating with the filling cavity, and one end of the conductive pillar is positioned corresponding to the opening, the other end of the conductive pillar connects to the flexible plate or the inner cover or extends through the inner cover to connect to the flexible plate, and the filling cavity is filled with a soft material.

18. The sensor according to claim 17, wherein the sensor further comprises a force-bearing bump which protrudes outside the housing at a position corresponding to the opening, and the conductive pillar extends into the accommodating room from the force-bearing bump.

19. The sensor according to claim 1, wherein the sensor further comprises a rigid member, such that: the rigid member is provided between the pressure sensing component and the flexible plate; or the rigid member is provided on a side of the flexible plate facing away from the pressure sensing component; or the rigid member is provided between the pressure sensing component and the flexible plate and on the side of the flexible plate facing away from the pressure sensing component, respectively.

20. The sensor according to claim 1, wherein the pressure sensing component comprises an integrated circuit chip and a pressure detecting component electrically connected to the integrated circuit chip, such that the pressure detecting component and the integrated circuit chip are mounted on the flexible plate at a distance, and the pressure detecting component and the integrated circuit chip electrically connect to the flexible plate respectively.

21. (canceled)

22. (canceled)

23. (canceled)

24. (canceled)

25. The sensor according to claim 3, wherein when a pressure applied on the pressure detecting component by the first room is increased by dP, the pressure applied on the pressure detecting component by the second room is decreased by dP and therefore the pressure detecting component will obtain a pressure change of 2dP.

26. (canceled)

27. A sensor comprising: a housing having an accommodating room; a flexible plate that is provided in the accommodating room and is moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component configured for sensing the pressure change, wherein the pressure sensing component and the flexible plate are assembled together and moveable together; and the sensor further comprises a conductive pillar provided in the accommodating room and configured for transmitting signal from the housing to the flexible plate.

28. The sensor according to claim 18, wherein the sensor further comprises an inner cover mounted on the flexible plate and covered outside the pressure sensing component, the inner cover, housing, and flexible plate cooperatively form a filling cavity, the housing is provided with an opening communicating with the filling cavity, one end of the conductive pillar is positioned corresponding to the opening, the other end of the conductive pillar connects to the inner cover or extends through the inner cover to connect to the flexible plate, and the filling cavity is filled with a soft material.

29. A sensor comprising: a housing having an accommodating room; a flexible plate that is accommodated in the accommodating room and is moveable to induce a medium pressure change in the accommodating room; a pressure sensing component configured for sensing the medium pressure change; and an inner cover mounted on the flexible plate with a space formed therebetween, the pressure sensing component being accommodated within the space; wherein the pressure sensing component and the flexible plate are assembled together and can move together.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG. 1 is a schematic cross-sectional view of a sensor according to Embodiment 1 of the present invention;

[0041] FIG. 2 is a schematic working principle diagram of the sensor according to Embodiment 1 of the present invention;

[0042] FIG. 3 is a schematic cross-sectional view of a sensor according to Embodiment 2 of the present invention;

[0043] FIG. 4 is a schematic working principle diagram of the sensor according to Embodiment 2 of the present invention;

[0044] FIG. 5 is a schematic cross-sectional view of a sensor according to Embodiment 3 of the present invention;

[0045] FIG. 6 is a schematic structural view of a flexible plate in the sensor according to Embodiment 3 of the present invention;

[0046] FIG. 7 is a schematic cross-sectional view of a sensor according to Embodiment 4 of the present invention;

[0047] FIG. 8 is a schematic cross-sectional view of a sensor according to Embodiment 5 of the present invention;

[0048] FIG. 9 is a schematic cross-sectional view of a sensor according to Embodiment 6 of the present invention;

[0049] FIG. 10 is a schematic cross-sectional view of a sensor according to Embodiment 7 of the present invention;

[0050] FIG. 11 is a schematic cross-sectional view of a sensor according to Embodiment 8 of the present invention;

[0051] FIG. 12 is a schematic cross-sectional view of a sensor according to Embodiment 9 of the present invention;

[0052] FIG. 13 is a schematic cross-sectional view of a sensor according to Embodiment 10 of the present invention;

[0053] FIG. 14 is a schematic cross-sectional view of a sensor according to Embodiment 11 of the present invention;

[0054] FIG. 15 is a schematic cross-sectional view of a sensor according to Embodiment 12 of the present invention;

[0055] FIG. 16 is a schematic cross-sectional view of a sensor according to Embodiment 13 of the present invention;

[0056] FIG. 17 is a schematic cross-sectional view of a sensor according to Embodiment 14 of the present invention;

[0057] FIG. 18 is a schematic cross-sectional view of a sensor according to Embodiment 15 of the present invention;

[0058] FIG. 19 is a schematic cross-sectional view of a sensor according to Embodiment 16 of the present invention.

DESCRIPTION OF THE EMBODIMENTS

[0059] Hereinafter, the present invention will be further described with reference to the drawings and specific embodiments.

[0060] As shown in FIGS. 1 to 10, a sensor according to some embodiments of the present invention is preferably a vibration sensor, which includes a housing 10 having an accommodating room 11, a flexible plate 20 that is arranged in the accommodating room 11 and moveable to induce a medium (e.g., air) pressure change within the accommodating room 11, and a pressure sensing component 30 mounted on the flexible plate 20 and configured to sense the pressure change induced by disturbances of the medium within the accommodating room 11. The pressure sensing component 30 is mounted on the flexible plate 20 and can move together with the flexible plate 20. In the sensor according to these embodiments of the present invention, the flexible plate 20 moves after receives a signal to be sensed such as a vibration, which results in medium disturbances (e.g., air disturbances) within the accommodating room 11. The pressure sensing component 30 receives pressure change induced by the air disturbances and then performs signal sensing. Compared with the conventional sound sensor, the sensor according to the present invention provides no opening communicated with the external environment for transmitting a sound pressure to sense a sound signal. Therefore, the impact of foreign objects, noise and the other environmental factors on the sensor can be avoided, and thus the influence of signals generated by the objects not to be sensed can be effectively reduced. The flexible plate 20, which acts as a pressure generating element, and the pressure sensing component 30, which acts as a pressure receiving element, are combined together to form an integral structure and may move together. The pressure sensing component 30 is capable of sensing the pressure changes on opposite sides of the flexible plate 20. Compared with the pressure sensing component of the conventional sensor, in which the pressure sensing component may sense the pressure change on only one side of the pressure generating component, the sensor of the present invention can effectively improve sensitivity of the sensor.

[0061] In some embodiments, e.g., in inertial force sensors shown in FIGS. 1 to 10, the pressure sensing component 30 may serve as a mass, and of course, an external mass may also be provided to increase sensitivity of the sensor. When external vibration is transmitted to the sensor, due to inertial force, the mass leads to a reciprocation motion of the flexible plate 20, which results in air disturbances. The pressure sensing component 30 receives the pressure change induced by the air disturbances.

[0062] It is understandable that the pressure sensing component 30 and the flexible plate 20 are combined together to form an integral structure and can move together, which may be achieved/implemented by the pressure sensing component 30 being directly mounted on the flexible plate 20 or the pressure sensing component 30 being assembled with the flexible plate 20 via other intermediates.

[0063] As a preferred embodiment, the flexible plate 20 is electrically connected to the pressure sensing component 30. The flexible plate 20 is a flexible material with electrical wiring, such as a flexible PCB board, a polymer material, a thin film material, or a metal material, etc. The pressure sensing component 30 may output a corresponding electrical signal through the circuit provided on the flexible plate 20 after sensing the pressure change.

[0064] It is understandable that the flexible plate 20 may not be provided with electrical wiring, but a circuit board is additionally provided. The pressure sensing component 30 is electrically connected to the additionally provided circuit board and outputs the corresponding electrical signal through the circuit provided on this circuit board.

[0065] In a preferred embodiment, the housing 10 includes a base 12 and an outer cover 13. The outer cover 13 is covered onto the base 12 to cooperatively form the aforementioned accommodating room 11, and the flexible plate 20 is connected to an inner sidewall of the base 12. In this embodiment, the outer cover 13 is preferably made of metal material, or it may be made of PCB material.

[0066] In a preferred embodiment, the sensor further includes a disturbance concentrator 40 configured to concentrate the air pressure change induced by the air disturbance around the disturbance concentrator 40. The disturbance concentrator 40 is provided in the accommodating room 11 and spaced oppositely from the pressure sensing component 30. The pressure sensing component 30 collects air pressure changes around the disturbance concentrator 40 to perform pressure detection. In a preferred embodiment, the disturbance concentrator 40 has a columnar shape or a block shape. Of course, it is possible not to provide any disturbance concentrator.

[0067] In a preferred embodiment, at least one end of the flexible plate 20 is fixed to the housing 10, e.g., one end of the flexible plate 20 is connected to the inner sidewall of the housing 10, and the flexible plate 20 divides the accommodating room 11 into a first room 111 and a second room 112, such that the first room 111 and the second room 112 are respectively located at opposite sides of the flexible plate 20, the pressure sensing component 30 is provided in the first room 111, and the disturbance concentrator 40 is provided in the second room 112. The flexible plate 20 defines a through-hole 21 located between the pressure sensing component 30 and the disturbance concentrator 40. The disturbance concentrator 40 is preferably cylindrical and is arranged facing and aligned with the through-hole 21. The pressure sensing component 30 collects the air pressure changes around the disturbance concentrator 40 through the through-hole 21.

[0068] In some embodiments, the sensor further includes a limiter 50 provided in the second room 112 to limit deformation of the flexible plate 20. The flexible plate 20 includes a fixed end 25 connected to the inner sidewall of the housing 10 and a free end 26 opposite to the fixed end 25. The free end 26 is an end of the flexible plate 20 with the largest amount of deformation of the flexible plate 20. Preferably, the limiter 50 is arranged at a position corresponding to the free end 27 of the flexible plate 20. Of course, in some embodiments, the limiter 50 may also be arranged at other positions deviating from the free end 27 of the flexible plate 20.

[0069] In some embodiments, the pressure sensing component 30 includes an Application Specific Integrated Circuit (ASIC) chip 31 and a pressure detecting component 32 electrically connected to the ASIC chip 31. The pressure detecting component 32 and the ASIC chip 31 are mounted on the flexible plate 20 at a distance, and electrically connected to the flexible plate 20 respectively. The movement of the flexible plate 20 induce an air disturbance, and the pressure detecting component 32 receives the air pressure change induced by the air disturbance and performs signal sensing. Preferably, the pressure detecting component 32 is a MEMS (Micro Electro Mechanical System) microphone or a MEMS pressure sensor, and the through-hole 21 of the flexible plate 20 may be used as a sound inlet facing a front sound cavity of the MEMS structure.

[0070] Based on the above technical features, the present invention exemplarily provides the following specific implementations of various sensors, which are described as follows:

Embodiment 1 of Sensor

[0071] FIG. 1 is a schematic view of a sensor according to Embodiment 1.

[0072] Referring to FIG. 1, in this embodiment, one end of the flexible plate 20 extends and connects to the inner sidewall of the housing 10, and the other end of the flexible plate 20 is a cantilever end. The flexible plate 20 is arranged in the accommodating room 11 in a cantilever form. The sensor further includes an inner cover 60 provided in the accommodating room 11. The inner cover 60 is mounted on the flexible plate 20 and is covered outside the pressure sensing component 30. The limiter 50 is disposed close to the free end i.e., the cantilever end 26, of the flexible plate 20, and faces the cantilever end 26 of the flexible plate 20 with a space formed therebetween.

[0073] FIG. 2 is a schematic working principle diagram of the sensor according to Embodiment 1, in which a double arrow line indicates that the flexible plate 20 may vibrate up and down, and dashed lines indicate up and down vibration range of the flexible plate 20.

[0074] Referring to FIG. 2, in this embodiment, when external vibration is transmitted to the sensor, the flexible plate 20 does reciprocating motion under an action of inertial force of the inner cover 60 and the pressure sensing component 30, which causes air disturbances around the flexible plate 20, especially around the cantilever end 26 of the cantilever flexible plate 20. The air disturbance induces air pressure changes which are concentrated by the disturbance concentrator 40, and then the air pressure change is received by the pressure detecting component 32.

[0075] Preferably, the inner cover 60 is made of metal material, or it may be made of PCB material.

Embodiment 2 of Sensor

[0076] As shown in FIGS. 3-4, FIG. 3 is a schematic view of a sensor according to Embodiment 2, and FIG. 4 shows a working principle of the sensor according to Embodiment 2, in which a double arrow line indicates that the flexible plate 20 may vibrate up and down, and dashed lines indicate an up and down vibration range of the flexible plate 20. The difference between Embodiment 1 and Embodiment 2 lies in that both outer ends of the flexible plate 20 in Embodiment 2 fixedly connect to the inner side wall of the housing 10, and at the same time, the limiter 50 in Embodiment 2 is disposed close to an edge of the through-hole 21 and spaced from the edge of the through-hole 21 at a distance in a vibration direction of the flexible plate 20, wherein the end of the flexible plate 20 defining the through-hole 21 acts as the free end 26.

[0077] In this embodiment, the flexible plate 20 does reciprocation motion due to vibration under an action of inertial force of the inner cover 60 and the pressure sensing component 30, which causes air disturbances around the flexible plate 20, especially changes in the air near the through-hole 21 of the flexible plate 20. The disturbance concentrator 40 concentrates pressure change induced by the air disturbance around the pressure detecting component 32, and then the pressure detecting component 32 receives the pressure change.

Embodiment 3 of Sensor

[0078] As shown in FIGS. 5 and 6, the difference between Embodiment 3 and Embodiment 2 lies in that the structure of the flexible plate 20 is different. The flexible plate 20 in this embodiment has a diaphragm spring structure, and includes a mounting portion 22 provided in the accommodating room 11, two fixing portions 23 both fixedly connected to the inner sidewall of the housing 10, and at least two elastic connecting portions 24 elastically connected between the two fixing portions 23 and the mounting portion 22 respectively. The fixing portion 23 acts as the fixed end 25 of the flexible plate 20, while the mounting portion 22 and the elastic connecting portions 24 acts as the free end 26 of the flexible plate 20. The pressure detecting component 30 is mounted on the mounting portion 22.

[0079] It can be understood that the sensor of the present invention may be provided with an inner cover 60, or the inner cover may be omitted.

Embodiment 4 of Sensor

[0080] As shown in FIG. 7, the difference of Embodiment 4 from Embodiment 2 lies in that the sensor according to Embodiment 4 has no inner cover 60, and the flexible plate 20 does reciprocation motion due to vibration under an action of inertial force of the pressure sensing component 30, which causes air disturbances around the flexible plate 20, especially change in the air near the through-hole 21 of the flexible plate 20. The disturbance concentrator 40 concentrates the air pressure changes induced by the air disturbance around the pressure detecting component 32, and then the pressure detecting component 32 receives the pressure change, which makes assembly process simpler.

[0081] In the sensor of the present invention, a rigid member may be additionally provided to the flexible plate 20.

Embodiment 5 of Sensor

[0082] As shown in FIG. 8, the flexible plate 20 will deform when it resonates with an external vibration source such that stress influence are brought to the pressure detecting component 32, which may change a rigidity of the diaphragm in the pressure detecting component 32 or change a sensing gap and thus cause sensitivity drift, therefore, in Embodiment 5, a rigid member 70 is additionally provided based on Embodiment 2. The rigid member 70 is arranged between the pressure sensing component 30 and the flexible plate 20. The rigid member 70 may relieve the influence of the assembly stress on the pressure detecting component 32 and improve the mass of the flexible plate 20 to increase the sensitivity.

[0083] In this embodiment, the rigid member 70 may be made of stainless steel, FR4 (glass fiber epoxy copper clad laminate fire-resistant material), PI (polyimide), or metal blocks and so on.

Embodiment 6 of Sensor

[0084] As shown in FIG. 9, the difference of Embodiment 6 from Embodiment 5 lies in that the position of the rigid member 70 is different. Specifically, in this embodiment, the rigid member 70 is provided on a side of the flexible plate 20 facing away from the pressure sensing component 30, with the rigid member 70 having the same function as that of Embodiment 5.

Embodiment 7 of Sensor

[0085] As shown in FIG. 10, the difference of Embodiment 7 from Embodiment 5 lies in that the number and position of the rigid members 70 are different. Specifically, in this embodiment, the sensor includes two layers of rigid members 70, and the two layers of rigid members 70 are respectively arranged between the pressure sensing component 30 and the flexible plate 20 and on the side of the flexible plate 20 facing away from the pressure sensing component 30, with the rigid member 70 having the same function as that of Embodiment 5.

[0086] The sensors according to the above Embodiments 1-7 use the flexible plate 20 to resonate with external vibration, thereby generating a larger signal output and linearity, and transmitting the vibration signal to the pressure sensing component 30 for vibration signal sensing applications. This technical solution may be applied to bone conduction voice pick up technology, which may effectively shield the interference of low-frequency environmental noise.

[0087] In the sensor of the present invention, a conductive pillar may also be provided in the accommodating room.

Embodiment 8 of Sensor

[0088] As shown in FIG. 11, in this embodiment, a conductive pillar 80 is additionally provided based on Embodiment 1, that is, the sensor further includes the conductive pillar 80 protrudingly provided in the accommodating room 11. One end of the conductive pillar 80 connects to the inner wall of the accommodating room 11, and the other end of the conductive pillar 80 extends to and connects with the inner cover 60.

[0089] In a preferred embodiment, the conductive pillar 80 is made of metal material, or may be made of PCB (printed circuit board) material, and the conductive pillar 80 and the outer cover 13 may be integrally formed or assembled together.

[0090] In this embodiment, external vibration is transmitted to the flexible plate 20 through the conductive pillar 80, the flexible plate 20 deforms and causes air disturbances, and then the pressure sensing component 30 receives the pressure change induced by the air disturbances, wherein the air pressure change induced by the air disturbance is concentrated by the disturbance concentrator 40.

Embodiment 9 of Sensor

[0091] As shown in FIG. 12, in this embodiment, a conductive pillar 80 is additionally provided based on Embodiment 2, that is, the sensor further includes the conductive pillar 80 protrudingly provided in the accommodating room 11. One end of the conductive pillar 80 connects to the inner wall of the accommodating room 11, and the other end of the pillar 80 extends to and connects with the inner cover 60, such that the vibration is transmitted from the vibration source to the inner cover 60 through the conductive pillar 80, and then transmitted to the flexible plate 20 through the inner cover 60.

[0092] The conductive pillar 80 and the outer cover 13 may be integrally formed or assembled together.

Embodiment 10 of Sensor

[0093] As shown in FIG. 13, the difference of Embodiment 10 from the above-mentioned Embodiment 9 lies in that the conductive pillar 80 does not connect to the inner cover 60, but extends through the inner cover 60 and connects to the flexible plate 20. Specifically, in this embodiment, one end of the conductive pillar 80 connects to the inner wall of the accommodating room 11, and the other end of the conductive pillar 80 extends through the inner cover 60 and connects to the flexible plate 20, such that the vibration is transmitted to the outer cover 13 from the vibration source, and transmitted to the inner cover 60 through the conductive pillar 80, and then transmitted to the flexible plate 20 through the inner cover 60.

[0094] The conductive pillar 80 and the outer cover 13 may be integrally formed, or may be assembled together.

Embodiment 11 of Sensor

[0095] As shown in FIG. 14, in this embodiment, a conductive pillar 80 is additionally provided based on Embodiment 3, that is, the sensor further includes the conductive pillar 80 protrudingly provided in the accommodating room 11. One end of the conductive pillar 80 connects to the inner wall of the accommodating room 11, and the other end of the conductive pillar 80 connects to the inner cover 60, such that the vibration is transmitted to the outer cover 13 from the vibration source, transmitted to the inner cover 60 through the conductive support 80, and then transmitted to the flexible plate 20 through the inner cover 60.

[0096] The conductive pillar 80 and the outer cover 13 are integrally formed, or may be assembled together.

Embodiment 12 of Sensor

[0097] As shown in FIG. 15, in Embodiment 12, a conductive pillar 80 is additionally provided based on Embodiment 4, that is, the sensor further includes the conductive pillar 80 protrudingly provided in the accommodating room 11. One end of the conductive pillar 80 connects to the inner wall of the accommodating room 11, and the other end of the conductive pillar 80 extends to and connects to the flexible plate 20, such that the vibration is transmitted to the outer cover 13 from the vibration source, and then transmitted to the flexible plate 20 through the conductive pillar 80.

[0098] In the sensors according to the above Embodiments 8-12, external vibration is finally transmitted to the flexible plate 20 through the conductive support 80, the flexible plate 20 deforms and causes air disturbances, and then the pressure sensing component 30 receives the pressure changes induced by the air disturbances.

[0099] The conductive pillar 80 may directly connect to the outer cover 13 or may form a gap with the outer cover 13.

Embodiment 13 of Sensor

[0100] As shown in FIG. 16, in this embodiment, the outer cover 13 and the conductive pillar 80 are provided separately and then assembled, that is, in Embodiment 13, an opening communicated with the first room 111 is additionally defined in the outer cover 13 of the housing 10 based on Embodiment 9, and the conductive pillar 80 extending from the opening is located in the first room 111. One end of the conductive pillar 80 is positioned in the opening and forms a gap 131 with the outer cover 13, such that the inner cover 60, housing 10, flexible plate 20 and conductive pillar 80 cooperatively form a filling cavity together, and the filling cavity may be filled with a soft material 90 through the gap 131. The soft material 90 is preferably a polymer material, PDMS (polydimethylsiloxane), PI (Polyimide), etc. The soft material 90 filled in the filling cavity is capable of fixing an outer edge of the flexible plate 20 so as to seal the circuit provided on the flexible plate 20 and the pressure sensing component 30.

Embodiment 14 of Sensor

[0101] As shown in FIG. 17, in this embodiment, the outer cover 13 and the conductive pillar 80 are provided separately and then assembled. In Embodiment 14, an opening communicating with the first room 111 is additionally defined in the outer cover 13 of the housing 10 based on Embodiment 10, and the conductive pillar 80 extending from the opening is located in the first room 111. One end of the conductive pillar 80 is positioned in the opening and forms a gap 131 with the outer cover 13, the inner cover 60, outer cover 13, base 12, flexible plate 20 and conductive pillar 80 cooperatively form a filling cavity therebetween, the opening is communicated with the filling cavity, and the filling cavity may be filled with a soft material 90 through the gap 131. The soft material 90 is preferably a polymer material, PDMS (polydimethylsiloxane), PI (Polyimide), etc. The soft material 90 filled in the filling cavity is capable of fixing an outer edge of the flexible plate 20 so as to seal the circuit provided on the flexible plate 20 and the pressure sensing component 30.

[0102] The sensors according to the above Embodiments 13-14 may be used as pressure sensors, which may be used in underwater applications or environments that require waterproofing, such as pressure gauges and underwater microphones. The pressure sensor adopts a new package technology, in which the outer cover 13 is configured to form a valve structure, and the filling cavity is filled with the soft material 90 which is capable of sealing the circuit on the flexible plate 20 and the pressure sensing component 30. The pressure difference between the inner and outer sides of the outer cover 13 will cause the flexible plate 20 to deform upward or downward. According to Bernoulli's law, the air is compressed to the small-area diaphragm in the pressure detecting component 32 by the large-area flexible plate 20, which improves sensitivity of the sensor. When the pressure detecting component 32 adopts a MEMS structure, the front cavity and the back cavity of the MEMS structure can obtain twice signals due to the air compressing the diaphragm of the MEMS structure to deform.

Embodiment 15 of Sensor

[0103] As shown in FIG. 18, the working principle of Embodiment 15 is similar to that of the Embodiment 13, except that: in Embodiment 15, a force-bearing bump 100 is additionally provided based on Embodiment 13, that is, the sensor further includes the force-bearing bump 100. The force-bearing bump 100 is provided outside the housing 10 and faces the conductive pillar 80. The conductive pillar 80 is located inside the force-bearing bump 100 and extends from the force-bearing bump 100 into the accommodating room 11. The force exerted on the force-bearing bump 100 may be transferred to the inner cover 60 via the conductive pillar 80 and further transferred to the flexible plate 20. The force-bearing bump 100 may be integrally formed with the soft material 90 in the filling cavity.

Embodiment 16 of Sensor

[0104] As shown in FIG. 19, the working principle of Embodiment 16 is similar to that of Embodiment 14, except that: in Embodiment 16, a force-bearing bump 100 is additionally provided based on Embodiment 14. The arrangement and function of the force-bearing bump 100 in the Embodiment 16 are the same as those in Embodiment 15. The force exerted on the force-bearing bump 100 may be directly transmitted to the flexible plate 20 via the conductive pillar 80.

[0105] The sensors according to the above Embodiments 15-16 may be used as tactile and force sensors for sensing the force exerted on the force-bearing bump 100, and are mainly used in occasions where the pressurized area is limited.

[0106] It should be noted that, on the premise of not conflicting, any combination of the above-described embodiments or technical features may form a new embodiment. For example, the flexible plate 20 may be arranged in a cantilever beam; or, both ends are fixed to the housing 10 with the free end provided between the two fixed ends; or, the flexible plate 20 adopts a diaphragm spring structure with the outer end being fixed to the fixed end of the housing 10 and the inner end acting as the free end.

[0107] An inner cover 60 or no inner cover may be provided inside the sensor.

[0108] The accommodating room may be provided with a disturbance concentrator 40 at a position corresponding to the pressure detecting component 32, for concentrating air disturbance changes surrounding the disturbance concentrator 40. The pressure detecting component 32 performs pressure detection by collecting air pressure changes around the disturbance concentrator 40. The disturbance concentrator 40 is preferably positioned to face the through-hole 21 of the flexible plate 20 corresponding to the pressure detecting component 32. Of course, the disturbance concentrator 40 may also be positioned slightly deviating from the through-hole 21. It can be understood that, in some applications, the disturbance concentrator 40 may also be omitted.

[0109] The flexible plate 20 may be provided without the rigid member, or may be provided with the rigid member 70. The rigid member 70 may be positioned in a variety of ways. For example, the rigid member 70 may be positioned between the pressure sensing component 30 and the flexible plate 20; or the rigid member 70 may be positioned on the side of the flexible plate 20 facing away from the pressure sensing component 30; or the rigid members 70 may be respectively positioned between the pressure sensing component 30 and the flexible plate 20 and on the side of the flexible plate 20 facing away from the pressure sensing component 30.

[0110] There may be no conductive pillar or may be a conductive pillar 80 between the housing 10 and the flexible plate 20. The conductive pillar 80 may be used to transmit vibration and/or force. The conductive pillar 80 may be provided in various ways and positions. For example, the conductive pillar 80 may be provided between the housing 10 and the inner cover 60 which is fixedly connected to the flexible plate 20; or one end of the conductive pillar 80 may connect to the housing 10 and the other end thereof may extend through the inner cover 60 and then connect to the flexible plate 20; or the sensor does not include an inner cover, and the conductive pillar 80 is directly connected between the housing 10 and the flexible plate 20; the conductive pillar 80 may be integrally formed with the housing 10, or the conductive pillar 80 and the housing 10 may be formed separately and then assembled together; the conductive pillar 80 may directly connect to the housing, or a gap may be provided between the conductive pillar 80 and the housing 10, with the gap filled with sealing material.

[0111] The foregoing embodiments are only preferred embodiments of the present invention, and cannot be used to limit the scope of protection of the present invention. Any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention belong to the scope of protection claimed by the present invention.