Optical Circuit and Optical Connection Structure
20220035100 · 2022-02-03
Inventors
- Yusuke Muranaka (Musashino-shi, Tokyo, JP)
- Kota Shikama (Musashino-shi, Tokyo, JP)
- Hidetaka Nishi (Musashino-shi, Tokyo, JP)
- Ai Yanagihara (Musashino-shi, Tokyo, JP)
Cpc classification
G02B6/422
PHYSICS
G02B6/4221
PHYSICS
G02B6/4214
PHYSICS
International classification
Abstract
Optical alignment between an optical waveguide device and an optical connection part is realized easily and at low cost. An optical circuit in which optical waveguides to be connected to optical fibers are formed includes: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to the optical axis direction of the core of the alignment optical waveguide.
Claims
1. An optical circuit in which optical waveguides to be connected to optical fibers are formed, comprising: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to an optical axis direction of a core of the alignment optical waveguide.
2. The optical circuit according to claim 1, wherein the light path changing member is an inclined surface of 45 degrees with respect to the optical axis direction of the core of the alignment optical waveguide.
3. The optical circuit according to claim 1, wherein the light path changing member is a scattering substance connected to the core of the alignment optical waveguide.
4. An optical connection structure for connecting an optical waveguide device and optical fibers, comprising: an optical connection part that has guide holes for insertion of core wires of the optical fibers; and an optical circuit including an alignment optical waveguide that connects an optical waveguide edge face to which the optical connection part is fixed, and a light path changing member configured to change a path of light to a vertical direction with respect to an optical axis direction of a core of the alignment optical waveguide, wherein the alignment optical waveguide is opposed to a guide hole into which an alignment optical fiber is to be inserted, and optical alignment of the optical connection part is performed.
5. An optical connection structure for connecting an optical waveguide device and optical fibers, wherein, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is fixed, an alignment optical waveguide that connects the optical waveguide edge face and a light path changing member configured to change a path of light to a vertical direction with respect to an optical axis direction of a core of the alignment optical waveguide is opposed to a guide hole into which an alignment optical fiber is to be inserted, and optical alignment of the optical connection part is performed, and thereby the optical connection part is fixed to the optical waveguide device.
6. The optical connection structure according to claim 4, wherein the light path changing member is an inclined surface of 45 degrees with respect to the optical axis direction of the core of the alignment optical waveguide.
7. The optical connection structure according to claim 4, wherein the light path changing member is a scattering substance connected to the core of the alignment optical waveguide.
8. The optical connection structure according to claim 5, wherein the light path changing member is an inclined surface of 45 degrees with respect to the optical axis direction of the core of the alignment optical waveguide.
9. The optical connection structure according to claim 5, wherein the light path changing member is a scattering substance connected to the core of the alignment optical waveguide.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0016]
[0017]
[0018]
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
DESCRIPTION OF EMBODIMENTS
[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments, as the optical connection part, an optical connection part as shown in
[0028] The optical waveguide device is not limited to the above-described optical waveguide device as long as it includes a one-dimensional waveguide array. For example, as an light emitting element, an integrated light emitting element may be used in which a plurality of distributed-feedback laser diodes (DFB-LD) made of InP are mounted, and are optically connected to each other by an optical circuit such as a Si waveguide or a glass waveguide. Also, a light emitting element may be used in which a DFB-LD array is bonded to an optical circuit formed on a Si substrate, and is integrated with Si waveguides. Furthermore, an integrated light emitting element may also be used in which an InP material or the like is bonded to a Si substrate to form a laser layer, and waveguides made of Si waveguides, a Si oxide (such as oxide silicon or a silicon oxynitride film), or the like are integrated therewith. Similarly, as a light receiving element, an integrated light receiving element may be used in which a PD made of InGaAs, Ge, or the like is bonded to a substrate, and is optically connected to and integrated with another optical waveguide device.
[0029] Also, an external modulation element or the like may be connected to the light emitting element, or may be made of the same material and integrated on the same substrate, as appropriate. For example, Si waveguides and a modulation element constituted by a thermo-optic switch or an electro-optic switch may also be integrated, or InP waveguides, a modulation element constituted by a thermo-optic switch or an electro-optic switch, and a modulation element made of a ferroelectric such as LN may also be integrated. A structure that has a modulation function due to the electroabsorption effect may also be directly integrated with or formed on the light emitting element. In the embodiments, the modulation elements are omitted. A specific layout of the optical waveguides is also omitted because the present invention is not limited to this.
[0030] The material of the V groove substrate and the lid substrate has no limitation with regard to the material quality as long as the V grooves can be formed therein with accuracy. As a representative example, a glass material can be subjected to cutting work or the like, so that the V grooves are formed. Also, the V groove substrate may also be formed by subjecting a Si substrate or the like to anisotropic etching. Similarly, the V grooves can also be formed by an imprint technique using polymer, or sintering of ceramic, for example.
EMBODIMENT 1
[0031]
[0032] An optical connection part 110 is adhered and fixed to the optical waveguide edge face of the optical waveguide device 120, the optical connection part 110 including a V groove substrate 111 with a plurality of V grooves and a plate lid substrate 112 that are joined to each other. Dummy fibers 115a and 115b are inserted into some of the V grooves. Note that illustration of a reinforcing plate arranged on the optical waveguide device 120 is omitted. After the optical connection structure in which the optical waveguide device 120 and the optical connection part 110 are fixed to each other is mounted inside a package or on a printed circuit board, an implementer of the present invention can insert optical fiber core wires of an optical fiber array into guide holes of the optical connection part 110, thereby optically coupling the optical fiber array and the optical waveguide array 125 of the optical waveguide device 120.
[0033] As described above, the light emitting element, the light receiving element, the light modulation element, the optical functional element, and the light amplification element of the optical waveguide device 120 may have any number of channels, any configuration, and any material, and any method such as an integration method may be used for them.
[0034] Conventionally, an alignment optical waveguide for use in optical alignment is a through-type optical waveguide that extends from the optical waveguide edge face of an optical waveguide device to the opposite edge face, so that a monitoring optical fiber for monitoring exiting light can be connected thereto. However, as shown in
[0035]
[0036] As a result of the alignment optical waveguides 126 being provided with the flip-up reflection mirrors 127, it is possible to reflect light upward at appropriate positions on the surface of the optical waveguide device 120, and thus it is not necessary to route the alignment waveguides 126 across the inner area of the PLC 122. Also, there is no need of forming an exit edge face as is common for a through-type optical waveguide, and thus it is possible to realize a reduction in the implementation cost and downsizing of the device.
[0037] The following will describe procedure for optically coupling the optical waveguide device and optical fibers with reference to
[0038] Then, as shown in
[0039] At a position at which the light intensities detected by the light-receiving devices 128a and 128b are the highest, the optical waveguide device 120 and the optical connection part 110 are adhered and fixed to each other, and the optical alignment is ended. The implementer pulls out or cuts off the alignment optical fibers 131a and 131b, and removes the fiber fixing base 130, as shown in
[0040] Then, by mounting the optical connection structure inside the package or on the printed circuit board, and then inserting the optical fiber core wires of the optical fiber array into the guide holes of the optical connection part 110, it is possible to optically couple the optical fiber array to the optical waveguide array 125 of the optical waveguide device 120.
[0041] According to the present embodiment, since light from the alignment optical waveguides 126a and 126b has been detected from the surface of the optical waveguide device 120, positioning needs only to be performed on the side on which light is incident, that is, on the optical connection part 110 side. Accordingly, the present embodiment can realize the optical alignment easily and at low cost. Also, as a result of the alignment optical waveguides 126a and 126 being arranged at both ends of the optical waveguide device 120 with the waveguide array 125 interposed therebetween, it is possible to accurately position the optical connection part 110. Furthermore, because, for detection of light from the alignment optical waveguides 126a and 126b, it is sufficient to observe relative light intensities, the flip-up mirrors 127 and the light receiving elements 128 do not need to be positioned with accuracy, and thus it is possible to easily measure the light intensities.
[0042] Note that in the present embodiment, light from the alignment optical waveguides 126a and 126b are detected from the surface of the optical waveguide device 120, but depending on the package structure of the optical transmitter or the optical receiver, the light may also be detected from the reverse side of the optical waveguide device 120 via the substrate 121.
EMBODIMENT 2
[0043]
[0044] The implementer can monitor the light intensities of light exiting from the alignment optical waveguides 126a and 126b via the flip-up reflection mirrors 127a and 27b, and at the same time, the implementer can view the positions of the guide holes of the optical connection part 110 and the positions of the waveguide array 125 of the optical waveguide device 120. This makes the positioning easy. Furthermore, a reduction in the implementation cost can be expected. Also, even a microscope that can receive only visible light can be used to perform positioning with infrared light, if a fluorescent coating or the like is applied to the surface of the optical waveguide device 120 or the lens of the visible light microscope.
EMBODIMENT 3
[0045]
[0046] The scattering substances 141 need only to emit, from the surface of the optical waveguide device 120, an amount of light such that a change in the light intensity of the light exiting from the alignment optical waveguides 126 can be detected by the light receiving elements 128. As a simplified method for forming the scattering substances 141, it is conceivable to form a hole or a slit in the surface of the optical waveguide device 120 in the vertical direction so that it crosses the core of the alignment optical waveguides 126.
[0047] Therefore, instead of the mirrors or the scattering substances, any light path changing members may be used as long as they can change the path of light from the alignment optical fibers 131 to the vertical direction with respect to the optical axis direction of the cores of the alignment optical waveguides 126.
EMBODIMENT 4
[0048]
REFERENCE SIGNS LIST
[0049] 1, 110 Optical connection part [0050] 2, 120 Optical waveguide device [0051] 3 Guide hole [0052] 4 Optical waveguide [0053] 11, 111 V groove substrate [0054] 12, 112 Lid substrate [0055] 13 V groove [0056] 14 Adhesive [0057] 15, 115 Dummy fiber [0058] 21 Substrate [0059] 22 Optical waveguide [0060] 23 Core [0061] 24 Cladding [0062] 25 Reinforcing plate [0063] 31, 131 Alignment optical fiber [0064] 32 Plug [0065] 121 Si substrate [0066] 122 PLC [0067] 123 Transmitter array [0068] 124 Receiver array [0069] 125 Optical waveguide array [0070] 126 Alignment optical waveguide [0071] 127 Flip-up reflection mirror [0072] 128 Light receiving element [0073] 129 Light emitting element [0074] 130 Fiber fixing base [0075] 140 Microscope [0076] 141 Scattering substance