Light module for a vehicle headlamp

Abstract

The invention relates to a light module for a vehicle headlamp, having at least one semiconductor light source and having at least one mounting plate. The semiconductor light source is accommodated on a receiving side of the mounting plate. The mounting plate is disposed on the heat sink with a cooling side lying opposite the receiving side, At least one semiconductor light source can be cooled. The heat sink has air guidance grooves on its side bordering the cooling side of the mounting plate, by means of which air guidance channels are formed over the cooling side of the mounting plate.

Claims

1. A light module for a vehicle headlamp comprising: at least one semiconductor light source; at least one mounting plate including each of a receiving side and a cooling side, the cooling side positioned opposite the receiving side, wherein the semiconductor light source is accommodated on the receiving side of the mounting plate, and a heat sink for cooling the at least one semiconductor light source, wherein said mounting plate is disposed on the heat sink, wherein the heat sink includes air guidance grooves formed in a first side of the heat sink that borders the cooling side of the mounting plate, wherein when the cooling side of the mounting plate and said air guidance grooves of said heat sink abut one another, the cooling side of the mounting plate covers the air guidance grooves to form air guidance channels, and wherein at least one air guidance channel is enclosed on three sides by the heat sink and on a fourth side by the mounting plate, thereby fully enclosing said at least one air guidance channel in cross-section.

2. The light module according to claim 1, wherein the heat sink has contact regions formed intermittently between the air guidance grooves in which a thermal conductive contact to the mounting plate is formed.

3. The light module according to claim 2, wherein one or more semiconductor light sources are disposed on the mounting plate in the contact regions on the receiving side.

4. The light module according to claim 1 wherein the mounting plate is made at least in part of metal, or in that the mounting plate has at least one planar metallic coating comprising aluminum, copper or brass.

5. The light module according to claim 1 wherein the light module includes a ventilator positioned and located such that an air current generated by the ventilator can be guided through the air guidance channels.

6. The light module according to claim 1 wherein the heat sink has a cooling structure on a cooling side lying opposite the side for accommodating the mounting plate, which comprises cooling fins.

7. The light module according to claim 1 wherein the heat sink has a first side, on which a first mounting plate is disposed, and wherein the heat sink has a second side lying opposite the first side, on which a second mounting plate is disposed, wherein both sides have air guidance grooves, by means of which the air guidance channels are formed over the adjacent cooling sides of the mounting plates.

8. The light module according to claim 7, wherein the heat sink has a meandering shape, formed by air guidance grooves formed on opposing sides of the heat sink, offset to one another.

9. The light module according to claim 1 wherein a reflector is located on one or both sides of the heat sink, wherein light can be generated by the semiconductor light source so that it can be irradiated into the reflector, and wherein the light is emitted in a light axis after reflection at the reflector.

10. The light module according to claim 9, wherein the air guidance grooves face in the direction of the light axis.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

(2) FIG. 1 shows a first exemplary embodiment of a light module having a heat sink, wherein a mounting plate is disposed on one side of the heat sink,

(3) FIG. 2 shows another exemplary embodiment of a light module having a heat sink and having a first mounting plate on a first side of the heat sink and having a second mounting plate on a second side of the heat sink, and

(4) FIG. 3 shows a perspective view of a light module for a vehicle headlamp having the features of the present invention.

DETAILED DESCRIPTION OF THE DRAWINGS

(5) FIG. 1 shows a light module 1 for a vehicle headlamp, having numerous semiconductor light sources 10 and having a mounting plate 11, wherein the semiconductor light sources 10 are accommodated on a receiving side 12 of the mounting plate 11. The semiconductor light sources 10 can serve, for example, for fulfilling a main lighting function, i.e. a low beam or a high beam of the headlamp.

(6) The heat sink 13 is disposed on a cooling side 14 of the mounting plate 11, lying opposite the receiving side 12, wherein the manner in which the heat sink 13 is attached to the cooling side 14 is not shown in detail. By way of example, it can be attached to the heat sink 13 via a thermal conductive paste or some other material bonding joining process. The mounting plate 11, however, can also border on the heat sink without a material bonding.

(7) Air guidance grooves 15 are formed in the surface of the heat sink 13, in the side of the heat sink 13 on which the mounting plate 11 is attached, said side normally being planar in design, and the air guidance grooves 15 are covered by the arrangement of the mounting plate 11, thus forming air guidance channels 16, wherein the cooling side 14 of the mounting plate 11 contributes to the formation of the channels 16. If an air flow, generated by a ventilator for example, is guided through the air guidance channels 16, then both the heat sink 13 as well as, directly, the mounting plate 11 over the cooling side 14, are cooled. As a result, a particularly effective cooling of the semiconductor light sources 10 is made possible.

(8) The heat sink 13 has contact regions 17 formed between the air guidance grooves 15, in particular, intermittent with the air guidance grooves 15, in which the heat sink 13 comes in contact with the cooling side 14 of the mounting plate 11, and the semiconductor light sources 10 are disposed, opposing one another, in the contact regions 17. As a result, the semiconductor light sources 10 can be cooled by means of solid state thermal conductance through the mounting plate 11, from the receiving side 12 to the cooling side 14, and into the heat sink 13.

(9) The exemplary embodiment shows only a single mounting plate 11 disposed on one side of the heat sink 13, and there is a cooling structure 19 having cooling fins 20 on an opposite side of the mounting plate. A further improvement of the thermal conductance via the heat sink 13 can be obtained with the cooling structure 19.

(10) FIG. 2 shows a modified exemplary embodiment of a light module 1 having a heat sink 13, wherein a mounting plate 11 is disposed, in each case, on opposing sides of the heat sink 13. The receiving sides 12 of the mounting plates 11 face outward, and numerous semiconductor light sources 10 are disposed on the receiving sides 12. Air guidance grooves 15 are formed in the heat sink 13 on both sides bordering on the mounting plates 11, such that air guidance channels 16 are formed underneath the mounting plates 11, together with both cooling sides 14 of the mounting plates 11 and the air guidance grooves 15. The air guidance grooves 15 are disposed thereby, such that they are offset to one another and intermittent with respective contact regions 17, in which the cooling sides 14 of the mounting plates 11 border on the heat sink 13. The semiconductor light sources 10 are disposed opposite one another in the contact regions 17, such that they can be cooled directly via the heat sink 13.

(11) If, as is shown in FIGS. 1 and 2, an air flow, which can be generated by a ventilator, for example, is guided through the air guidance channels 16, then an additional cooling of the heat sink can be obtained, wherein, in addition to the cooling by the heat sink 13, a heat dissipation is obtained via the cooling sides 15 of the mounting plates 11 bordering the air guidance channels 16. Heat occurring at the location of a semiconductor light source 10 is thus dissipated directly in the heat sink 13 via the contact region 17, as well as in the plane of the mounting plate 11, and thus via a convection of an air flow through the air guidance channel 16. For this, the mounting plate 11 can be formed at least in part of metal, to particular advantage, or the mounting plate 11 has at least one planar metallic coating, made of aluminum, copper or brass, for example.

(12) FIG. 3 shows, lastly, a design for a light module 1 in a perspective view, and a heat sink 13 is shown as a central component thereof, in which air guidance grooves 15 have been formed. A mounting plate 11 is disposed on each side of the heat sink 13, having semiconductor light sources 10 attached to the mounting plate 11. A closure of the air guidance grooves 15 is obtained by the arrangement of the mounting plates 11, such that air guidance channels 16 are formed. If an air flow is generated via the ventilator 18 shown in the Figure, it passes through the air guidance channels 16, and cools the heat sink 13, and also directly cools the mounting plate 11 by means of a convection.

(13) The air guidance channels 16 extend in the direction of a light axis 22, which can face in the same direction in which a light, irradiated by the semiconductor light sources 10 into the reflectors 21 shown in the Figure, exits the light module 1. As a result, heated air can exit the front side of the heat sink 13 shown in the Figure, through the air guidance channels 16, and defrost, for example, a cover lens of the headlamp from the inside.

(14) The invention is not limited in its design to the preferred exemplary embodiments described above. On the contrary, a number of variations are conceivable, which also can be used with the solution depicted here having fundamentally different embodiments. All of the features and/or advantages derived from the Claims, the description or the drawings, including constructive details or spatial configurations, may be essential to the invention, both in and of themselves as well as in the various combinations thereof.

LIST OF REFERENCE SYMBOLS

(15) 1 light module 10 semiconductor light source 11 mounting plate 12 receiving side 13 heat sink 14 cooling side 15 air guidance groove 16 air guidance channel 17 contact region 18 ventilator 19 cooling structure 20 cooling fins 21 reflector 22 light axis