METHOD OF DIAGNOSING THE LIFETIME OF STRUCTURES AND SYSTEM FOR DIAGNOSING THE SAME
20220034831 · 2022-02-03
Inventors
Cpc classification
G01N25/20
PHYSICS
G01M99/00
PHYSICS
International classification
Abstract
The present invention relates to a method of diagnosing the lifetime of a structure and a system for diagnosing the same, the method comprises a step for preparing a structure to be measured; a step for measuring an amount of exothermic or endothermic heat of the structure; a step for measuring an amount of entropy decrease of the structure by using the measured amount of exothermic or endothermic heat; and a step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease.
Claims
1. A method of diagnosing the lifetime of a structure comprising; a step for preparing a structure to be measured; a step for measuring an amount of exothermic or endothermic heat of the structure; a step for determining an amount of entropy decrease of the structure from the measured amount of exothermic or endothermic heat; and a step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease.
2. The method of diagnosing the lifetime of the structure of claim 1, wherein the step for diagnosing the remaining lifetime of the structure utilizes a relationship between the amount of entropy decrease or the amount of exothermic or endothermic heat at the end of life and the amount of entropy decrease or the amount of exothermic or endothermic heat at an arbitrary time.
3. The method of diagnosing the lifetime of the structure of claim 2, wherein the relationship is defined as
t.sub.L=k(H.sub.L/Hi)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R(1/T−1/T.sub.P)], wherein, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, H.sub.L is an amount of exothermic or endothermic heat at the end of life, and H.sub.i is an amount of exothermic or endothermic heat at an arbitrary time.
4. The method of diagnosing the lifetime of the structure of claim 3, wherein, the activation energy for entropy decrease Q.sub.ΔS is determined by the Kissinger method where the peak temperature where the maximum amount of heat is released is plotted as a function of heating rate.
5. The method of diagnosing the lifetime of the structure of claim 1, further comprising, a step for measuring an actual compressive stress value of the structure; and a step for correcting the predicted remaining lifetime based on the difference between the measured compressive stress value, and the predicted compressive stress value obtaining from the measured amount of exothermic or endothermic heat.
6. The method of diagnosing the lifetime of the structure of claim 1, wherein measurements of the amount of exothermic or endothermic heat are performed by Differential Scanning calorimetry (DSC), Differential Thermal Analysis (DTA), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), Dynamic Mechanical Analysis (DMA), or a combination thereof.
7. A method of diagnosing the lifetime of a structure comprising; a step for preparing a structure to be measured; a step for measuring the magnitude of compressive stress of the structure; a step for measuring an amount of entropy decrease of the structure by using the measured magnitude of compressive stress; and a step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease.
8. The method of diagnosing the lifetime of the structure of claim 7, wherein the step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease utilizes the relationship between the amount of entropy decrease or the magnitude of compressive stress at the end of life of the structure and the amount of entropy decrease or the magnitude of compressive stress of the structure at an arbitrary time, which is defined as:
t.sub.L=k(σ.sub.L/σ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], wherein, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature of exothermic heat, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, σ.sub.L is a magnitude of compressive stress at the end of life, and σ.sub.i is a magnitude of compressive stress at an arbitrary time.
9. A method of diagnosing the lifetime of a structure comprising; a step for preparing a structure to be measured; a step for measuring an amount of lattice contraction of the structure; a step for measuring an amount of entropy decrease of the structure by using the measured amount of lattice contraction; and a step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease.
10. The method of diagnosing the lifetime of the structure of claim 9, wherein the step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease utilizes the relationship between the amount of entropy decrease or the amount of lattice contraction at the end of life of the structure and the amount of entropy decrease or the amount of lattice contraction of the structure at an arbitrary time, which is defined as:
t.sub.L=k(Δa.sub.L/Δa.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], wherein, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, Δa.sub.L is an amount of lattice contraction of the structure at the end of life, and Δa.sub.i is an amount of lattice contraction of the structure at an arbitrary time.
11. A method of diagnosing the lifetime of a structure comprising; a step for preparing a structure to be measured; a step for measuring the physical properties of the structure; a step for measuring an amount of entropy decrease of the structure from the measured changes in physical properties; and a step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease, wherein the physical properties include hardness, thermoelectric power, electrical resistance, Barkuhausen noise amplitude, shear modulus, elastic modulus or Young's modulus, or a combination thereof of the structure.
12. The method of diagnosing the lifetime of the structure of claim 11, wherein the step for diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease utilizes the relationship between the amount of entropy decrease or the amount of changes in physical properties at the end of life of the structure and the amount of entropy decrease or the amount of changes in physical properties at an arbitrary time, which is defined as:
t.sub.L=k(ΔΠ.sub.L/ΔΠ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], wherein, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, ΔΠ.sub.L is an amount of changes in physical properties of the structure at the end of life, and ΔΠ.sub.i is an amount of changes in physical properties of the structure at an arbitrary time.
13. A system for diagnosing the lifetime of a structure comprising: a measuring device which measures an amount of exothermic or endothermic heat of the structure, a magnitude of compressive stress of the structure, an amount of lattice contraction of the structure, or the physical properties of the structure; and an electronic device for measuring an amount of entropy decrease of the structure by using the measured amount of exothermic or endothermic heat, the measured magnitude of compressive stress, the measured amount of lattice contraction, or the measured changes in physical properties provided from the measuring device, and diagnosing the remaining lifetime of the structure from the measured amount of entropy decrease, wherein the physical properties include hardness, thermoelectric power, electrical resistance, Barkuhausen noise amplitude, shear modulus, elastic modulus or Young's modulus, or a combination thereof of the structure.
14. The system for diagnosing the lifetime of the structure of claim 13, wherein the electronic device uses relationships between entropy decrease, an amount of exothermic or endothermic heat, an amount of lattice contraction, an amount of changes in physical properties or a magnitude of compressive stress at the end of life of the structure, and an amount of entropy decrease, an amount of exothermic or endothermic heat, an amount of lattice contraction, an amount of changes in physical properties or a magnitude of compressive stress of the structure at an arbitrary time.
15. The system for diagnosing the lifetime of the structure of claim 13, wherein the above relationships are defined as t.sub.L=k(H.sub.L/Hi)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R(1/T−1/T.sub.P)], t.sub.L=k(σ.sub.L/σ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], t.sub.L=k(Δa.sub.L/Δa.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], or t.sub.L=k(ΔΠ.sub.L/ΔΠ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)], wherein k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, H.sub.L is an amount of exothermic or endothermic heat at the end of life of the structure, and H.sub.i is an amount of exothermic or endothermic heat at an arbitrary time, σ.sub.L is a magnitude of compressive stress at the end of life of the structure, σ.sub.i is a magnitude of compressive stress at an arbitrary time, Δa.sub.L is an amount of lattice contraction at the end of life of the structure, Δa.sub.i is an amount of lattice contraction of the structure at an arbitrary time, ΔΠ.sub.L is an amount of changes in physical properties of the structure at the end of life, and ΔΠ.sub.i is an amount of changes in physical properties of the structure at an arbitrary time.
16. The system for diagnosing the lifetime of the structure of claim 13, wherein the activation energy for entropy decrease, Q.sub.ΔS is determined by the Kissinger method where the peak temperature where the maximum amount of heat is evolved is plotted as a function of heating rate.
17. The system for diagnosing the lifetime of the structure of claim 13, wherein the electronic device measures the actual compressive stress of the structure, and corrects the predicted remaining lifetime from a difference between the measured compressive stress value and the predicted compressive stress value obtaining from the measured amount of exothermic or endothermic heat.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and other features and advantages will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments with reference to the attached drawings, in which:
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[0039] In the following description, the same or similar elements are labeled with the same or similar reference numbers.
DETAILED DESCRIPTION
[0040] The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0041] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “includes”, “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. In addition, a term such as a “unit”, a “module”, a “block” or like, when used in the specification, represents a unit that processes at least one function or operation, and the unit or the like may be implemented by hardware or software or a combination of hardware and software.
[0042] Reference herein to a layer formed “on” a substrate or other layer refers to a layer formed directly on top of the substrate or other layer or to an intermediate layer or intermediate layers formed on the substrate or other layer. It will also be understood by those skilled in the art that structures or shapes that are “adjacent” to other structures or shapes may have portions that overlap or are disposed below the adjacent features.
[0043] In this specification, the relative terms, such as “below”, “above”, “upper”, “lower”, “horizontal”, and “vertical”, may be used to describe the relationship of one component, layer, or region to another component, layer, or region, as shown in the accompanying drawings. It is to be understood that these terms are intended to encompass not only the directions indicated in the figures, but also the other directions of the elements.
[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
[0045] Preferred embodiments will now be described more fully hereinafter with reference to the accompanying drawings. However, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0046] In order to explain the embodiments of the present invention, the second law of thermodynamics may need to be considered. According to the second law of thermodynamics, the amount of entropy change ΔS is defined as the amount of heat ΔH (or Q) released from or absorbed into a system divided by a temperature T of the system by the following <Equation 1>.
ΔS=ΔH/T (J/gK) [Equation 1]
[0047] Here, J represents energy in joule and K is the unit of absolute temperature.
[0048] When heat is released from the system, the entropy of the system decreases by −ΔH/T, and when heat is absorbed into the system, the entropy of the system increases by +ΔH/T. For example, if heat transfers from a high temperature object to a cold surrounding by ΔH, the entropy of the object decreases by −ΔH/T.sub.hot, but the entropy of the surrounding increases by +ΔH/T.sub.cold. The sum of entropy changes in the object and its surroundings is expressed by <Equation 2> as below.
ΔS=−ΔH/T.sub.hot+ΔH/T.sub.cold [Equation 2]
[0049] In <Equation 2>, the sum of entropy changes ΔS of <Equation 2> is greater than 0 because of T.sub.hot>T.sub.cold. Therefore, the transfer of heat from a hot object to a cold environment may be considered as an entropy increase.
[0050] Similarly, the entropy of a structure may decrease or increase due to heat transfer between the structure and the surrounding, leading to a physical change in the structure. Specifically, an entropy decrease may induce a compressive stress in the structure, causing a volume shrinkage of the structure. Conversely, an entropy increase may induce a tensile stress in the structure, resulting in a volume expansion of the structure. A typical example in which the tensile stress is generated by the entropy increase is a volume expansion by around 2400 times occurring upon the transformation of water to water vapor. Conversely, a representative example in which a compressive stress is generated by the entropy decrease is a solidification shrinkage occurring when a liquid metal is solidified. For a liquid metal to become solid, heat must be released from the liquid metal, leading it to be cooled. Accordingly, the entropy of the liquid metal decreases by an amount of heat released as shown in Eq. 1, causing a compressive stress to be induced in the liquid metal, and thereby a solidification shrinkage.
[0051] The present invention, as described above, includes embodiments of a method and a system for diagnosing the lifetime of a structure by measuring changes in the amount of exothermic or endothermic heat of the structure and thereby an amount of entropy decrease of the structure, regardless of whether it consists of organic or inorganic or composite materials. Hereinafter, the embodiments of the present invention describe a method of diagnosing the remaining lifetime of a structure by measuring an amount of entropy decrease of the structure.
[0052]
[0053] Referring to
[0054] In one embodiment, the step S4 for diagnosing the remaining lifetime of the structure to be measured may include a relationship describing changes in an amount of entropy decrease or in a magnitude of compressive stress between the end of life and an arbitrary time. Specifically, as the unit of heat expressed in J/mol or J/g represents an energy density, it may be converted into J/m.sup.3 by multiplying the energy density expressed in J/g with the density of the structure (g/m.sup.3), which corresponds to a stress in MPa. Therefore, the measured amount of heat (J/g or J/mol) may represent the stress generated in the structure. If an amount of exothermic or endothermic heat is measured at the end of life of the structure to be measured, it is possible to know a magnitude or level of compressive stress σ.sub.L, more specifically the level of compressive stress accumulated in the structure that corresponds to the amount of exothermic or endothermic heat. Therefore, assuming that the amount of heat measured at an arbitrary time is defined as H.sub.i, the compressive stress built inside the structure, termed σ.sub.i, can be determined from H.sub.i. The time required for the internally compressive stress σ.sub.i of the structure to increase to σ.sub.L may be determined by a rate of entropy decrease or an ordering rate OR. The rate of entropy decrease or OR (ordering rate) may be defined by <Equation 3> below.
OR=k[T.sub.P/(T.sub.P−T)].sup.2 exp [−Q.sub.ΔS/R*(1/T−1/T.sub.P)] [Equation 3]
[0055] Here, T.sub.P is the peak temperature where the maximum amount of heat is released, R is the gas constant, T is an operating temperature, Q.sub.ΔS is an activation energy for entropy decrease, and k is a constant.
[0056] Referring to the following <Equation 4> the time until the internally compressive stress σ.sub.i increases to σ.sub.L at a rate of entropy decrease may be defined as the lifetime t.sub.L of the structure, which can be described in <Equation 5> or <Equation 6> listed below.
σ.sub.L=k[T.sub.P/(T.sub.P−T)].sup.2 exp [−Q.sub.ΔS/R*(1/T−1/T.sub.P)]t.sub.L*σ.sub.i [Equation 4]
t.sub.L=k(σ.sub.L/σ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)] [Equation 5]
t.sub.L=k(H.sub.L/Hi)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R(1/T−1/T.sub.P)] [Equation 6]
[0057] Here, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, H.sub.L is an amount of exothermic or endothermic heat at the end of life, and σ.sub.L is a magnitude of compressive stress at the end of life, H.sub.i is an amount of exothermic or endothermic heat at an arbitrary time, and σ.sub.i is a magnitude of compressive stress at an arbitrary time. The activation energy for entropy decrease, Q.sub.ΔS may be determined by the Kissinger method where the peak temperature where the maximum amount of heat is released is plotted as a function of heating rate.
[0058] Referring to <Equation 5> and <Equation 6>, the remaining lifetime of a structure may be determined according to the peak temperature T.sub.P where the maximum amount of heat is released, an activation energy for entropy decrease, Q.sub.ΔS, a difference between T.sub.P and T, the amount of exothermic or endothermic heat H.sub.L or a magnitude of compressive stress σ.sub.L at the end of life. Specifically, the higher the H.sub.L or σ.sub.L measured at the end of life, the longer the lifetime of the aged structure. Conversely, the higher the operating temperature (T) and the lower the peak temperature (T.sub.P), the activation energy for entropy decrease (Q.sub.ΔS), and the amount of exothermic or endothermic heat at the end of life (H.sub.L), the shorter the lifetime of the structure.
[0059] The increasing amount of entropy decrease leads to an increase in compressive stress of a structure which triggers lattice contractions in the structure. An amount of lattice contraction in the structure may be analyzed using X-ray and neutron diffraction, from which the compressive stress of the structure may be determined. The lifetime of the structure t.sub.L may be defined as <Equation 7>, based on an amount of lattice contraction determined by X-ray or neutron diffraction.
t.sub.L=k(Δa.sub.L/Δa.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)] [Equation 7]
[0060] Here, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, Δa.sub.L is an amount of lattice contraction at the end of life of the structure, and Δa.sub.i is an amount of lattice contraction at an arbitrary time.
[0061] The method may further comprise a step for actually measuring the compressive stress of the structure, and a step for correcting a predicted remaining lifetime based on a difference between the measured compressive stress value and the predicted compressive value from the measured amount of exothermic or endothermic heat. Through the correction of the predicted remaining lifetime by using the measured and predicted values of compressive stress, it is possible to more accurately diagnose the remaining lifetime of the structure.
[0062] In one embodiment, the amount of exothermic or endothermic heat may be measured by DSC, DTA, TGA, TMA, DMA, or combination thereof. However, the present invention is not limited to these measurement methods of an exothermic or endothermic heat. Preferably, the measurement of the exothermic or endothermic heat may be performed by the DSC.
[0063] As described above, an amount of entropy decrease may be determined from changes in an amount of exothermic or endothermic heat of the structure as well as changes in its physical properties as shown in
[0064] Referring to
[0065] The lifetime of the structure t.sub.1, may be defined as <Equation 8>, based on changes in physical properties of the structure determined by measuring devices.
t.sub.L=k(ΔΠ.sub.L/ΔΠ.sub.i)[(T.sub.P−T)/T.sub.P].sup.2 exp [+Q.sub.ΔS/R*(1/T−1/T.sub.P)] [Equation 8]
[0066] Here, k is an intrinsic constant, R is the gas constant, T.sub.P is the peak temperature where the maximum amount of heat is released, Q.sub.ΔS is an activation energy for entropy decrease, T is an operating temperature, ΔΠ.sub.L is an amount of changes in physical properties at the end of life of the structure, and ΔΠ.sub.i is an amount of changes in physical properties at an arbitrary time.
[0067] In one embodiment, the physical properties may include hardness, thermoelectric power, electrical resistance, Barkuhausen noise amplitude, shear modulus, elastic modulus (Young's modulus) of the structure, or a combination thereof. However, the present invention is not limited to these physical properties. Any physical property that may determine the amount of entropy decrease of the structure may be considered and applied. Specifically, since the entropy decrease may cause changes in physical properties such as hardness, thermoelectric power, electrical resistance, Barkuhausen noise amplitude, shear modulus, and elastic modulus of the structure, the entropy decrease may be measured by tracking the changes in physical properties. For example, bread may be hardened due to water evaporation when it is exposed to ambient temperature for a long time. As a heat of evaporation is released from the bread, the entropy of the bread decreases in proportion to the amount of heat released, generating a compressive stress in the bread, which causes a hardening of the bread. In other words, the reason why the bread becomes hard upon long exposure to ambient temperature is due to the entropy decrease in the bread arising from the evaporation heat released, generating a compressive stress that leads to its hardening. This is similar to the phenomenon of mud cracking, which will be described later. The same phenomenon as the hardening of the bread may occur in all the structures so that the structures become gradually brittle with increasing operating time.
[0068] In another embodiment, an amount of entropy decrease of the structure may be computed using a combination of both the amount of exothermic or endothermic heat of the structure and the measured changes in physical properties.
[0069] As described above, the quick and accurate diagnosis of the lifetime of a structure may be done in a non-destructive manner because the lifetime of the structure is determined from the amount of entropy decrease of the structure that is obtained by directly measuring the amount of exothermic or endothermic heat of the structure to be measured.
[0070]
[0071] Referring to
[0072] In one embodiment, the measuring device 200 may measure the amount of exothermic or endothermic heat or the physical properties of the structure using DSC, DTA, TGA, TMA, DMA, or a combination thereof, and may provide the measured result to the processor 100. Alternatively, the measuring device 200 may measure the physical properties of the structure. In an embodiment, the physical properties may include hardness, thermoelectric power, electrical resistance, Barkuhausen noise amplitude, shear modulus, elastic modulus, or a combination of the structure to be measured. However, the present invention is not limited to these physical properties. Any physical property capable of determining the amount of entropy decrease of the structure may be applied.
[0073] The processor 100, as a CPU, may compute an amount of entropy decrease of the structure from the changes in physical properties or the amount of exothermic or endothermic heat of the structure provided by the measuring device 200, and may diagnose the remaining lifetime of the structure from the measured amount of entropy decrease. Also, the processor 100 may measure a magnitude of compressive stress of the structure. The magnitude of compressive stress may be determined by measuring an amount of entropy decrease during an operation of the structure or stress corrosion cracking (SCC) tests or by measuring the amount of lattice contraction of the structure using neutron or X-ray diffraction before and after an operation of the structure or the SCC tests.
[0074] The input unit 110 is an input device such as a keyboard, a mouse or a sensor, and may provide the input parameters to the processor 100 such as the peak temperature where the maximum heat is released, T.sub.P, an activation energy for entropy decrease, Q.sub.ΔS, a difference between the peak temperature and the operating temperature, T.sub.P−T, an amount of exothermic or endothermic heat at the end of life, H.sub.L, an magnitude of compressive stress at the end of life, σ.sub.L, and an amount of changes in physical properties at the end of life, ΔΠ.sub.L, which are needed to determine the remaining lifetime of a structure to be measured.
[0075] The output unit 120 may be any suitable type of displays such as a liquid crystal display (LCD), a plasma display, or an organic light emitting diode (OLED) display. In addition, the output unit 120 may receive information on the remaining lifetime of the structure which is determined by the processor 100 and may display the information.
[0076] The storage unit 130 may further include a nonvolatile storage for a permanent storage of data and/or instructions, and may store the peak temperature, T.sub.P, where the maximum heat is released, an activation energy for entropy decrease, Q.sub.ΔS, a difference between the peak temperature and the operating temperature, T.sub.P−T, an amount of exothermic or endothermic heat at the end of life, H.sub.L, a magnitude of compressive stress at the end of life, σ.sub.L, and an amount of changes in physical properties at the end of life, ΔΠ.sub.L, which are needed to determine the remaining lifetime of the structures to be measured. If necessary, the storage unit 130 may provide the stored parameters to the processor 100.
[0077]
[0078] Referring to
[0079] In the present invention, it may be seen that the cracking of the structure is caused by compressive stresses spontaneously generated inside the structure due to an entropy decrease of the structure. Specifically, the entropy decrease of the structure occurs during its operation, which generates compressive stresses in it and thereby triggers the cracking or failures of the structure. Accordingly, in the embodiments of the present invention, the lifetime of all organic, inorganic, or composite structures thereof may be determined with the amount of entropy decrease.
[0080] In an embodiment, as the amount of entropy decrease of the structure increases, the compressive stress induced inside the structure increases, leading to the earlier cracking of the structure and thereby shortening the lifetime of the structure. In addition, since the entropy decrease occurs in all kinds of materials regardless of inorganic and organic materials, a method of diagnosing the lifetime of a structure based on the amount of entropy decrease may be universally applied to all the structures consisting of metals, ceramics, plastics, and concretes.
Experiment 1: Example of the Cracking of a Metal Due to Entropy Decrease
[0081] After a homogenization treatment at about 1,025° C. for 2 hours, furnace cooling and water cooling were applied to prepare water-quenched (WQ-) and furnace-cooled (FC-) Alloy 600 steam generator tubes, and these two types of specimens were exposed to 332° C. water (e.g., high temperature water simulating the operating conditions of pressurized water reactors) for about 24,000 hours. Then, their SCC resistance was compared.
[0082] The following [Table 1] is a table showing the SCC failure rates of the WQ- and FC-Alloy 600 steam generator tube specimens.
TABLE-US-00001 TABLE 1 Solution treatment SCC failure conditions Cooling rate rate (%) 1025° C., 2 hours water-quenched specimen 100 furnace-cooled specimen 0
[0083] Referring to Table 1 shown above, all the WQ-Alloy 600 specimen failed by SCC cracking, while the FC-Alloy 600 specimens showed no cracking at all. In order to explain the observations in view of entropy decrease, DSC tests were performed on an Alloy 600 specimen water quenched (WQ-) and furnace-cooled (FC-) after a solution treatment at 1,095° C. for 30 minutes.
[0084]
[0085] Referring to
[0086]
[0087] Referring to
[0088] Summarizing the results of Table 1 and
Experiment 2: Example of Performance Quality of a Printing Ink (Plastic) with Entropy Decrease
[0089]
[0090] Referring to
Experiment 3: Example of Changes in Physical Properties of the Structures Due to Entropy Decrease
[0091] The amount of entropy decrease described above may be determined primarily by an amount of exothermic or endothermic heat measured by a DSC, but may also be measured by changes in the above-described physical properties. Since the entropy decrease may harden the structure like the baguette bread, the amount of entropy decrease may be determined by measuring a change in its hardness instead of the amount of exothermic or endothermic heat. Since the entropy decrease affects not only the hardness but also various physical properties of the structural material, it is possible to measure the amount of entropy decrease by tracking the changes in physical properties. Representative examples of the changes in physical properties due to an entropy decrease are the changes in hardness and thermal conductivity. When a 316L stainless steel and an Alloy 690 steam generator tube are aged for a long time at 400° C. and 475° C., respectively, as shown in
[0092]
[0093] Referring to
[0094]
[0095] Referring to
[0096]
[0097] Referring to
[0098] In one embodiment, since the electrical resistance of a material also changes according to the entropy decrease, the change in the electrical resistance may be measured to determine the entropy decrease.
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[0100]
[0101] Referring to
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[0103] Referring to
[0104]
[0105] Referring to
[0106] As described above, according to the present invention, the lifetime of a structure may not be determined by external factors, but by an internal factor such as the magnitude of compressive stress caused by an entropy decrease. Judging from this fact, it may be predicted that if the compressive stress caused by the entropy decrease exceeds a certain limit value, the cracking initiates in the structure, leading to its failure. Therefore, the lifetime of the structure may be defined as the time of crack initiation or as the time to its failure. In one embodiment, the time of crack initiation may be considered as the lifetime of the structure.
[0107] In the above <Equation 5> and <Equation 6>, a typical example in which an amount of exothermic or endothermic heat increases with increasing operating time, leading to an increase in the magnitude of compressive stress accumulated in the structure may be illustrated in
[0108]
[0109] Referring to
[0110] Therefore, the lifetime of a structure may be determined by determining the constant k from an amount of heat of the structure measured at an arbitrary time and before an operation; and by directly measuring an amount of heat stored in the structure at the end of life, and by determining the peak temperature where the maximum amount of heat is released, the operating temperature, T, and an activation energy of entropy decrease, Q.sub.ΔS. Therefore, the lifetime of a structure may be determined regardless of types of structures and materials including ceramics, metals, plastics, or concretes, as long as the measured values of the parameters mentioned above are available.
Experiment 4
[0111] In order to verify the method of diagnosing the lifetime of a structure according to the present invention, the expected lifetime of Alloy 600 based on <Equation 5> or <Equation 6> was compared with the measured lifetime of Alloy 600 components in nuclear power plants and in laboratory conditions. The operating conditions of nuclear power plants refer to the conditions exposed to the primary water cooling system of nuclear power plants (high temperature water in the range of 300° C. to 340° C. with 15 MPa pressure and pH of 7, but added with boron and lithium), and the laboratory conditions refers to the conditions exposed to high temperature water simulating the operating conditions of nuclear power plants.
[0112] Here, it is assumed that a ratio of the amount of exothermic or endothermic heat at the end of life over the initial amount of exothermic or endothermic heat before an operation, H.sub.L/H.sub.i is the same for all the Alloy 600 materials used. As the activation energy for entropy decrease of the Alloy 600 was found to change from 190 kJ/mol to 204 kJ/mol with carbon concentration, as shown in
[0113] [Table 2] below is a table comparing the predicted lifetime of Alloy 600 according to an embodiment of the present invention and the crack initiation time determined during SCC tests in the laboratory conditions or the SCC initiation time determined in the reactor operating conditions of nuclear power plants.
TABLE-US-00002 TABLE 2 Alloy 600 Temperature Operating Expected Measured (° C.) Conditions Lifetime Lifetime REMARK 320 Reactor Operating 5.6-11.4 y 6-11.4 y SCC initiation time Conditions 332 Laboratory 20,031-38,750 h 23,932 h Time to failure (the Conditions (100% time time to crack initiation to failure) is 9487-11520 h 343 Laboratory 9,045-16,648 h 13926 h SCC initiation time Conditions 365 Laboratory 1,930-12,181 h 1050-12000 h SCC initiation time Conditions 380 Laboratory 691-1,090 h 1416-2578 h SCC initiation time Conditions
[0114] While the present disclosure has been described with reference to the embodiments illustrated in the figures, the embodiments are merely examples, and it will be understood by those skilled in the art that various changes in form and other embodiments equivalent thereto can be performed. Therefore, the technical scope of the disclosure is defined by the technical idea of the appended claims. The drawings and the forgoing description gave examples of the present invention. The scope of the present invention, however, is by no means limited by these specific examples. Numerous variations, whether explicitly given in the specification or not, such as differences in structure, dimension, and use of material, are possible. The scope of the invention is at least as broad as given by the following claims.