SEMICONDUCTOR CERAMIC COMPOSITION AND PTC THERMISTOR

Abstract

A semiconductor ceramic composition represented by formula (1),

(Ba.sub.vBi.sub.xA.sub.yRE.sub.w).sub.m(Ti.sub.uTM.sub.z)O.sub.3  (1),

wherein, A represents at least one element selected from Na and K, RE represents at least one element selected from Y, La, Ce, Pr, Nd, Sm, Gd, Dy and Er;

0.750y≦x≦1.50y  (2),

0.007≦y≦0.125  (3),

0≦(w+z)≦0.010  (4),

v+x+y+w=1  (5),

u+z=1  (6),

0.950≦m≦1.050  (7),

0.001 to 0.055 mol of Ca is contained, and 0.0005 to 0.005 mol of at least one selected from Mg, Al, Fe, Co, Cu and Zn is contained.

Claims

1. A semiconductor ceramic composition represented by the following formula (1),
(Ba.sub.vBi.sub.xA.sub.yRE.sub.w).sub.m(Ti.sub.uTM.sub.z)O.sub.3  (1) wherein, in the formula (1), A represents at least one element selected from the group consisting of Na and K, RE represents at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Gd, Dy and Er, TM represents at least one element selected from the group consisting of V, Nb and Ta, u, v, w, x, y, z and m satisfy the following formulas (2) to (7),
0.750y≦x≦1.50y  (2)
0.007≦y≦0.125  (3)
0≦(w+z)≦0.010  (4)
v+x+y+w=1  (5)
u+z=1  (6)
0.950≦m≦1.050  (7) Ca is further contained in a ratio of 0.001 mol or more and 0.055 mol or less relative to 1 mol of Ti site in terms of element; and an additive M is contained in a ratio of 0.0005 mol or more and 0.005 mol or less in terms of element, wherein, the Ti site is the total molar number of Ti and TM, and M is at least one selected from Mg, Al, Fe, Co, Cu and Zn.

2. The semiconductor ceramic composition of claim 1, wherein, Si is further contained in the semiconductor ceramic composition in a ratio of 0.035 mol or less relative to 1 mol of Ti site in terms of element, wherein, the Ti site is the total molar number of Ti and TM.

3. The semiconductor ceramic composition of claim 1, wherein, Mn is further contained in the semiconductor ceramic composition in a ratio of 0.0015 mol or less relative to 1 mol of Ti site in terms of element, wherein, the Ti site is the total molar number of Ti and TM.

4. A PTC thermistor comprising a ceramic body and electrodes formed on two main faces of the ceramic body, wherein, the ceramic body is formed by using the semiconductor ceramic composition of claim 1.

5. The semiconductor ceramic composition of claim 2, wherein, Mn is further contained in the semiconductor ceramic composition in a ratio of 0.0015 mol or less relative to 1 mol of Ti site in terms of element, wherein, the Ti site is the total molar number of Ti and TM.

6. A PTC thermistor comprising a ceramic body and electrodes formed on two main faces of the ceramic body, wherein, the ceramic body is formed by using the semiconductor ceramic composition of claim 2.

7. A PTC thermistor comprising a ceramic body and electrodes formed on two main faces of the ceramic body, wherein, the ceramic body is formed by using the semiconductor ceramic composition of claim 3.

8. A PTC thermistor comprising a ceramic body and electrodes formed on two main faces of the ceramic body, wherein, the ceramic body is formed by using the semiconductor ceramic composition of claim 5.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1 is a perspective view showing a structure of the PTC thermistor comprising the semiconductor ceramic composition according to one embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS

[0022] As shown in FIG. 1, PTC thermistor 1 includes ceramic body 2 and electrodes 3a and 3b which are formed on two opposite main surfaces of ceramic body. The electrodes 3a and 3b can be formed with a single-layered structure or a multi-layered structure which is made of conducting material(s) such as Cu, Ni, Al, Cr, Zn, Ag, Ni—Cr alloy, Ni—Cu alloy, or the like.

[0023] The composition of the present invention can be represented by the following formula (1) according to the molar ratio.

(Ba.sub.vBi.sub.xA.sub.yRE.sub.w).sub.m(Ti.sub.uTM.sub.z)O.sub.3  (1)

In formula (1), A represents at least one element selected from the group consisting of Na or K, RE represents at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Gd, Dy and Er, and TM represents at least one element selected from the group consisting of V, Nb and Ta. Further, the composition further contains Ca and the additive M (at least one of Mg, Al, Fe, Co, Cu and Zn) as the sub-component.

[0024] In formula (1), v, x, y, w, u, z and m satisfy the following formulas (2) to (7), wherein v, x, y, w, u, z and m respectively represent the amounts of Bi, A and RE to replace part of Ba site, the amount of TM to replace part of Ti site, and the ratio of Ba site to Ti site.

0.750y≦x≦1.50y  (2)

0.007≦y≦0.125  (3)

0≦(w+z)≦0.010  (4)

v+x+y+w=1  (5)

u+z=1  (6)

0.950≦m≦1.050  (7)

[0025] Further, relative to the composition represented by formula (1), Ca is contained in a ratio of 0.001 mol or more and 0.055 mol or less in terms of element relative to 1 mol of Ti site (the total molar number of Ti and TM), and M (at least one of Mg, Al, Fe, Co, Cu and Zn) is contained in a ratio of 0.0005 mol or more and 0.005 mol or less in terms of element relative to 1 mol of Ti site.

[0026] Moreover, the semiconductor ceramic composition preferably further contains Si in a ratio of 0.035 mol or less in terms of element relative to 1 mol of Ti site (i.e., the total molar number of Ti and TM) in the formula (1). Further, the ratio is more preferable to be 0.005 mol or more and 0.020 mol or less. The Si precipitated at the grain boundary can respectively form compounds with the alkali metal Na and K which are also precipitated in a trace amount at the grain boundary, and thus can prevent the movement of the alkali metal Na and K ion when electrified. Thereby, the effect of decreasing the resistivity at 25° C. is further improved. However, if more than 0.035 mol of Si is contained, the excess element Si will segregate in a large quantity at the grain boundary so that the movement of conduction electrons will be inhibited and the resistivity at 25° C. tends to increase.

[0027] In addition, the semiconductor ceramic composition preferably further contains Mn in a ratio of 0.0015 mol or less in terms of element relative to 1 mol of Ti site (i.e., the total molar number of Ti and TM). Further, the ratio is more preferred to be 0.0002 mol or more and 0.0010 mol or less. If Mn is contained within the range mentioned above, a proper acceptor level will be formed at the grain boundary so that PTC jump will be improved. However, if more than 0.0015 mol of Mn is contained, the trap for the conduction electrons will be excess so that the resistivity at 25° C. tends to increase.

[0028] In formula (1), A represents at least one element selected from the group consisting of Na and K. The y representing the range of A is preferred to be 0.007≦y≦0.125. If y is less than 0.007, the Curie point will not shift to a higher temperature. In addition, it is not preferred to render y higher than 0.125 because the ceramic composition will not completely become semiconductive and the resistivity at 25° C. will be higher than 500 Ωcm. In addition, the Curie point of the present invention refers to the temperature at which the resistivity of the element is twice as high as that at 25° C.

[0029] In addition, in the formula mentioned above, x representing the range of element Bi is related to y representing the range of A, and it is preferred that 0.750y≦x≦1.50y. If x is less than 0.750, the Curie point will not shift to a higher temperature. Additionally, it is not preferred to render x higher than 1.50 because excess element Bi will precipitate in a large quantity at the grain boundary, the movement of the conduction electrons will be prevented, the ceramic composition will not completely become semiconductive, and the resistivity at 25° C. will be higher than 500 Ωcm.

[0030] In the cases that the alkali metallic element A is Na or K, the shifting amounts of the Curie temperature towards a higher temperature are different, while the resistivity at 25° C. or the resistance change rate are almost the same.

[0031] In addition, in the compositional formula mentioned above, there is an effect on decreasing the resistivity at 25° C. and increasing the withstand voltage when the total amount (w+z) of RE and TM which two are the donor components is 0.010 mol or less relative to 1 mol of Ti site (i.e., the total molar number of Ti and TM), but it will also work if neither RE nor TM is contained. Further, the mentioned total amount is more preferred to be 0.001 mol or more and 0.005 mol or less. In addition, if (w+z) is higher than 0.010, the excess RE or TM will segregate at the grain boundary to prevent the movement of the conduction electrons, which leads to a resistivity at 25° C. higher than 500 Ωcm. Thus, it is not preferable. Further, it is more preferred that RE is selected from the group consisting of Sm, Gd and Er, and Nb is selected as TM. More preferably, RE (Sm, Gd, Er) and TM (Nb) are added in equal amounts. With such types of donor and adding methods, the effect on decreasing the resistivity at 25° C. will be further improved.

[0032] In the compositional formula mentioned above, m is preferred to be in the range of 0.950≦m≦1.050. If m is less than 0.950, the ceramic composition will not completely become semiconductive and the resistivity at 25° C. will be higher than 500 Ωcm, and thus it is not preferable. In addition, m is not preferred to be higher than 1.050 because the sintered density will decrease and the withstand voltage V.sub.0 will drop to be less than 400V/mm. Preferably, when m is in the range of 0.980≦m≦1.050, the effect on decreasing the resistivity at 25° C. will be further improved.

[0033] In addition, relative to the compositional formula mentioned above, the range of Ca which is added as a sub-component falls within the range of 0.001 mol or more and 0.055 mol or less relative to 1 mol of Ti site (the total molar number of Ti and TM). If the range of Ca is less than 0.001 mol, the ceramic composition will not turn semiconductive sufficiently and the resistivity at 25° C. will be higher than 500 Ωcm. In addition, when more than 0.055 mol of Ca is contained, the sintered density will decrease and the withstand voltage V.sub.0 will drop. More preferably, Ca is contained in a range of 0.010 mol or more and 0.040 mol or less. In this way, the resistivity at 25° C. can be further decreased.

[0034] Further, relative to the compositional formula mentioned above, the range of M (at least one of Mg, Al, Fe, Co, Cu and Zn) which is added as a sub-component is preferred to be 0.0005 mol or more and 0.005 mol or less relative to 1 mol of Ti site (the total molar number of Ti and TM). It is not preferable to contain less than 0.0005 mol of M because the resistance change rate Δρ/ρ.sub.0 will become over 20%. Besides, if the range of M is more than 0.005 mol, the ceramic composition will not completely become semiconductive and the resistivity at 25° C. will be higher than 500 Ωcm, and thus it is not preferable.

[0035] The semiconductor ceramic composition having the above mentioned properties can be prepared by the following method.

[0036] As raw materials, the powders of bismuth oxide (Bi.sub.2O.sub.3), sodium carbonate (Na.sub.2CO.sub.3), titanium oxide (TiO.sub.2), barium carbonate (BaCO.sub.3), potassium carbonate (K.sub.2CO.sub.3), calcium carbonate (CaCO.sub.3), rare earth materials such as lanthanum oxide (La.sub.2O.sub.3); niobium oxide (Nb.sub.2O.sub.5), tantalum oxide (Ta.sub.2O.sub.5), vanadium oxide (V.sub.2O.sub.5), manganese carbonate (MnCO.sub.3), silicon oxide (SiO.sub.2), oxide of the additive M (for example, ZnO), or the like are prepared as the raw materials if necessary, and the powders are weighted according to the target composition.

[0037] In addition, carbonates or oxalates which will turn to be oxides by firing can also be used to replace the oxides in the raw materials.

[0038] Next, the weighted raw materials are sufficiently mixed for 5 to 20 hours in an organic solvent or in pure water by means of a ball mill, and then the mixture is fully dried. The drying temperature is about 90° C. as an example. However, when the above raw materials are subjected to a dry mixing, the drying step can be omitted.

[0039] The dried raw materials are press molded to produce a molded body for calcinating. Alternatively, the powder is directly calcinated for about 1 hour to 20 hours at a temperature of 800 to 950° C. Both the beating rate and the cooling rate during the calcinating process can be set to be 50° C./hour to 300° C./hour as an example. The calcinating in the present embodiment is carried out in the air, but the value of the oxygen partial pressure is not limited.

[0040] The calcinated material is sufficiently pulverized for 5 to 20 hours in the organic solvent or in the water by the ball mill or the like, and then is fully dried. The drying temperature is about 90° C.

[0041] A solution of an organic binder (such as polyvinyl alcohol: PVA) is added into the dried calcinated materials to perform the granulation. After granulating, the granulated powder is molded into a cylinder, a prism, a disc or a square plate by uniaxial press molding.

[0042] Preferably, a Cold Isostatic Pressing (CIP) can be further applied after the above steps. At that time, it is more preferable that the isostatic pressing is carried out for 1 to 3 minutes with a maximum load pressure of 98 to 343 MPa.

[0043] The obtained compact by the above steps is subjected to a thermal treatment for 2 hours to 4 hours at 400 to 800° C. to vaporize the binder, and then it is sintered for 2 hours to 4 hours at 1100 to 1300° C. Both the heating rate and the cooling rate during the sintering process are set to be for example 50° C./hour to 300° C./hour. The sintering process in the present embodiment is carried out in the air, but the value of the oxygen partial pressure is not limited.

[0044] In addition, when the sintering process is performed in a nitrogen atmosphere, an additional thermal treatment at 800 to 1000° C. under an oxidative atmosphere is required. Thus, from the viewpoint of simple processes, the sintering process is preferred to be performed in air.

[0045] The obtained sintered compact is polished according to the requirements, and electrodes are formed on the two main faces. The electrodes can be formed by coating an electrode paste and then baking. Besides, the electrodes also can be formed by deposition or sputtering deposition.

[0046] FIG. 1 shows a structure of part of the PTC thermistor using the semiconductor ceramic composition according to the present embodiment. PTC thermistor 1 includes ceramic body 2 and electrodes 3a and 3b, wherein, ceramic body 2 comprises the BaTiO.sub.3 based semiconductor ceramic composition of the present invention, and electrodes 3a and 3b are formed on the opposite two main surfaces of the ceramic body 2. Electrodes 3a and 3b can be formed with a single-layered structure or a multi-layered structure which is made of conducting materials such as Cu, Ni, Al, Cr, Zn, Ag, Ni—Cr alloy, Ni—Cu alloy, or the like. In addition, the shape of PTC thermistor 1 shown in FIG. 1 is in a disk shape, and it also can be in a cuboid shape or the like. Further, the electrodes 3a and 3b can be formed by plating, sputtering, deposition, screen printing or the like. These electrodes 3a and 3b are electrically connected with an external power supplier (which is not shown in the figures) through a wire (which is not shown in the figures) or the like.

[0047] PTC thermistor 1 according to the present embodiment can be manufactured by the following method as an example. Firstly, after the above mentioned semiconductor ceramic composition is prepared, it is processed into a specified size according to the requirements to form ceramic compact 2. Next, PTC thermistor 1 as shown in FIG. 1 can be obtained by depositing electrodes 3a and 3b on the ceramic compact 2.

[0048] The semiconductor ceramic composition according to the present embodiment can be used in a heater element or an element for detecting overheats, but it also can be applied in the other elements.

[0049] In addition, the present invention is not limited to the above embodiment. For example, as long as the semiconductor ceramic composition satisfies the above formulas (2) to (7) and contains Ca and M (at least one selected from Mg, Al, Fe, Co, Cu and Zn) within the above range, the properties will not be influenced even if inevitable impurities are mixed. For example, zirconia ball is used as the grinding media during the wet mixing and pulverizing, and thus zirconia is likely to be mixed into the mixture with an amount of about 0.2 to 0.3 wt %, but it will not affect the properties of the composition. Similarly, Sr, Ni and the like contained in the body materials with a trace amount of about 10 wt ppm are likely to be mixed into the mixture, but they will not affect the properties of the composition.

[0050] Further, the semiconductor ceramic composition of the present embodiment may contain Pb as the impurity. However, the amount of Pb is preferably 1 wt % or less, and it is more preferable that no Pb is contained. This is because the volatilization of Pb during the firing process or the discharge of Pb into the environment after it is distributed in the market as a PTC thermistor and then abandoned can be inhibited to be a minimum, and the above amount of Pb is preferred from the viewpoint of low pollution, environmental friendliness and ecology.

Examples 1 to 88 and Comparative Examples 1 to 39

[0051] BaCO.sub.3, TiO.sub.2, Bi.sub.2O.sub.3, Na.sub.2CO.sub.3, K.sub.2CO.sub.3, CaCO.sub.3, SiO.sub.2, MnCO.sub.3, oxides of RE (such as Y.sub.2O.sub.3), oxides of TM (such as Nb.sub.2O.sub.5) and oxides of M (such as MgO) were prepared as the raw materials, and then were respectively weighted to have a composition after the sintering process as shown in Tables 1 to 8. The resultant mixture was subjected to a wet mixing process in ethanol by using a ball mill followed by a drying process and a calcinating process at 800° C. for 2 hours.

[0052] After the calcinated materials were subjected to a wet pulverizing process in pure water by using a ball mill, the mixture was dehydrated to dry and then granulated with binders such as PVA to provide a granulated powder. The granulated powder was molded into a cylindrical shape (diameter of 17 mm×thickness of 1.0 mm) with a uniaxial press machine and then sintered at 1200° C. in air for 2 hours to obtain a sintered compact.

[0053] A paste of Ag—Zn was coated on both faces of the sintered compact by screen printing and baked at 500 to 800° C. in air to form the electrodes. After that, the temperature characteristic of the resistivity is measured from 25° C. to 280° C. In addition, a voltage was slowly applied between the electrodes at an ambient temperature of 25° C. to measure the withstand voltage (breakdown voltage). The withstand voltage V.sub.0 (V/mm) was obtained by dividing the measured value by the thickness of the semiconductor ceramic composition (its unit was mm).

[0054] Further, a 20V of DC voltage was applied for 1000 hours as the electrical current test, and then the resistivity before test ρ.sub.0 and the resistivity after test ρ.sub.1 were measured at an ambient temperature of 25° C. to obtain the difference Δρ (=ρ.sub.1−ρ.sub.0), and thereby the resistance change rate Δρ/ρ.sub.0 was calculated. The results were shown in Table 1 to 8.

Example 74

[0055] The semiconductor ceramic composition was prepared as in Example 1 and the same assessments were done as in Examples 1 to 88 except that the sintering process was performed in a nitrogen atmosphere and a thermal treatment was further performed at 800° C. in air. The obtained results were shown in Table 9.

[0056] It could be known from Table 1 that y representing the range of A was related to the Curie temperature. Further, A represented at least one element selected from the group consisting of Na and K. Based on Examples 1 to 9, it could be seen that when the range of A was 0.007≦y≦0.125, the Curie point shifted to a temperature higher than the Curie temperature of BaTiO.sub.3 of 120° C. In addition, the bigger the y was, the more the Curie point would shift to a higher temperature and the resistivity at 25° C. tended to increase slightly. In Comparative Example 1 where the range of A was less than 0.007, the resistivity at 25° C. was small and the Curie point did not shift to a temperature higher than 120° C. In addition, in Comparative Example 8 where the range of A was higher than 0.125, the resistivity at 25° C. was found to exceed 500 Ωcm to a great extent. Further, based on Examples 10 to 14, when A was Na or K, the shifting amounts of the Curie point towards a higher temperature were different while resistivity at 25° C. or the resistance change rate was almost the same.

[0057] In addition, it could be known that x representing the range of element Bi was related to y representing the range of A. It could be known from Examples 1 to 9 that when the range of x was 0.750y≦x≦1.50y, the Curie point shifted to a temperature higher than the Curie temperature of BaTiO.sub.3 of 120° C., the resistivity at 25° C. was 500 Ωcm or less, the withstand voltage was 400V/mm or more, and the resistance change rate Δρ/ρ.sub.0 was kept to be 20% or less. Further, in the cases where y was constant, it could be seen that the more the x was, the more the resistivity at 25° C. tended to increase slightly. In Comparative Examples 2, 4 and 6 where the range of x was less than 0.75y, the resistivity at 25° C. was small and the withstand voltage was lower than 400V/mm. Moreover, in the Comparative Examples 3, 5 and 7 where the range of x was over 1.5y, the resistivity at 25° C. increased and the value was over 500 Ωcm.

TABLE-US-00001 TABLE 1 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Note Comparative 0.005 0.0075 0.999 0.055 0.001 0 0 0 310 120 Na 17 408 Curie point.sup.x Example 1 Comparative 0.007 0.0049 315 122 17 300 V.sub.0.sup.x Example 2 Example 1 0.0053 333 125 12 403 Example 2 0.0070 350 125 12 410 Example 3 0.0105 347 125 11 464 Comparative 0.0112 3.2E+04 — — — Resistivity Example 3 at 25° C..sup.x Comparative 0.050 0.0350 378 125 19 302 V.sub.0.sup.x Example 4 Example 4 0.0375 395 130 18 402 Example 5 0.0500 440 140 11 418 Example 6 0.0750 443 155 13 652 Comparative 0.0800 6.5E+04 — — — Resistivity Example 5 at 25° C..sup.x Comparative 0.125 0.0875 423 155 19 296 V.sub.0.sup.x Example 6 Example 7 0.0938 483 180 13 415 Example 8 0.1250 486 200 16 425 Example 9 0.1875 481 220 16 625 Comparative 0.2000 8.3E+04 — — — Resistivity Example 7 at 25° C..sup.x Comparative 0.127 0.0953 1.5E+06 — — — Resistivity Example 8 at 25° C..sup.x Example 10 0.007 0.0105 334 125 K 16 518 Example 11 0.030 0.0450 457 150 13 435 Example 12 0.050 0.0750 450 185 14 648 Example 13 0.100 0.1500 488 220 13 452 Example 14 0.125 0.1875 480 245 14 613

[0058] It could be known from Table 2 that the ratio m of Ba site (the total molar number of Ba, Bi, A, and RE) relative to Ti site (the total molar number of Ti and TM) in formula (1) was related to the resistivity at 25° C. In Examples 8, 15 and 16 where the range of m was 0.950≦m≦1.050, the resistivity at 25° C. was small, the withstand voltage was 400 V/mm or more and the resistance change rate Δρ/ρ.sub.0 was changed with an extent of 20% or less. In Comparative Example 11 where m was less than 0.950, it could be found that the resistivity at 25° C. was higher than 500 Ωcm. In Comparative Example 12 where m was more than 1.050, it could be found that the withstand voltage was lower than 400V/mm.

TABLE-US-00002 TABLE 2 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Note Comparative 0.125 0.125 0.940 0.055 0.001 0 0 0 5.0E+04 — Na — — Resistivity Example 9 at 25° C..sup.x Example 15 0.950 477 200 12 436 Example 8 0.999 486 200 16 425 Example 16 1.050 465 200 15 429 Comparative 1.060 475 200 13 354 V.sub.0.sup.x Example 10

[0059] It could be known from Table 3 that the range of the sub-component Ca was related to the resistivity at 25° C. In Examples 8, 17 and 18 where the range of Ca was 0.001 mol or more and 0.055 mol or less, the resistivity at 25° C. was small, the withstand voltage was 400 V/mm or more and the resistance change rate Δρ/ρ.sub.0 was changed with an extent of 20% or less. In Comparative Example 11 where the range of Ca was less than 0.001 mol, the resistivity at 25° C. increased. In Comparative Example 12 where the range of Ca was higher than 0.055 mol, the withstand voltage was lower than 400V/mm.

TABLE-US-00003 TABLE 3 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Note Comparative 0.125 0.125 0.999 0.0008 0.001 0 0 0 5.5E+04 — Na — — Resistivity Example 11 at 25° C..sup.x Example 17 0.001 454 200 12 435 Example 18 0.030 483 200 13 415 Example 8 0.055 486 200 16 425 Comparative 0.058 478 200 13 275 V.sub.0.sup.x Example 12

[0060] According to Table 4, it could be known that the range of sub-component M (at least one selected from Mg, Al, Fe, Co, Cu and Zn) was related to the resistivity at 25° C. and the resistance change rate Δρ/ρ.sub.0. In Examples 8, 19 to 35 where the amount of M was 0.0005 mol or more and 0.0005 mol or less, the resistivity at 25° C. was small, the withstand voltage was 400 V/mm or more and the resistance change rate Δρ/ρ.sub.0 was changed with an extent of 20% or less even if any of Mg, Al, Fe, Co, Cu and Zn was added. In Comparative Examples 13, 15, 17, 19, 21 and 23 where the amount of M was less than 0.0005 mol, both the resistivity at 25° C. and the increase extent of the resistance change rate were insufficient. In addition, in Comparative Examples 14, 16, 18, 20, 22 and 24 where the amount of M was higher than 0.005 mol, the resistivity at 25° C. increased and it was higher than 500 Ωcm. Besides, when the additive amount of M was within the specified range, the same effect could be obtained even several raw materials such as Mg and Zn were used.

TABLE-US-00004 TABLE 4 Resistivity A Resistance y x Ca M w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] M [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Note Comparative 0.125 0.125 0.999 0.055 Mg 0.0001 0 0 0 967 200 Na 33 448 Resistance change Example 13 rate.sup.x Example 19 0.0005 487 17 468 Example 8 0.001 486 16 425 Example 20 0.005 457 16 441 Comparative 0.006 4.0E+03 — — Resistivity Example 14 at 25° C..sup.x Comparative 0.125 0.125 0.999 0.055 Al 0.0001 0 0 0 858 200 Na 32 450 Resistance change Example 15 rate.sup.x Example 21 0.0005 466 15 417 Example 22 0.001 460 13 408 Example 23 0.005 431 13 436 Comparative 0.006 5.0E+03 — — Resistivity Example 16 at 25° C..sup.x Comparative 0.125 0.125 0.999 0.055 Fe 0.0001 0 0 0 1000  200 Na 33 454 Resistance change Example 17 rate.sup.x Example 24 0.0005 477 15 429 Example 25 0.001 464 10 433 Example 26 0.005 442 10 404 Comparative 0.006 5.0E+03 — — Resistivity Example 18 at 25° C..sup.x Comparative 0.125 0.125 0.999 0.055 Co 0.0001 0 0 0 739 200 Na 31 425 Resistance change Example 19 rate.sup.x Example 27 0.0005 417 15 436 Example 28 0.001 406 17 470 Example 29 0.005 403 15 459 Comparative 0.006 4.0E+03 — — Resistivity Example 20 at 25° C..sup.x Comparative 0.125 0.125 0.999 0.055 Cu 0.0001 0 0 0 608 200 Na 30 411 Resistance change Example 21 rate.sup.x Example 30 0.0005 398 15 411 Example 31 0.001 377 10 454 Example 32 0.005 343  6 410 Comparative 0.006 2.0E+03 — — Resistivity Example 22 at 25° C..sup.x Comparative 0.125 0.125 0.999 0.055 Zn 0.0001 0 0 0 772 200 Na 32 412 Resistance change Example 23 rate.sup.x Example 33 0.0005 498 15 441 Example 34 0.001 482  9 412 Example 35 0.005 428  6 414 Comparative 0.006 3.0E+03 — — Resistivity Example 24 at 25° C..sup.x

[0061] According to Examples 36 to 77 in Table 5, it could be known that when the total amount of RE and TM. i.e., (w+z), was 0.010 or less, a decreasing effect of the resistivity at 25° C. would be provided. In addition, in Comparative Examples 25 to 37 where (w+z) was higher than 0.010, the resistivity at 25° C. was larger than 500 Ωcm. Besides, it could be known from Examples 72 to 77 that even if (w+z) was the same value, the case in which RE and TM were added with the same amount provided a smaller resistivity at 25° C.

TABLE-US-00005 TABLE 5 Resis- Resis- tance tivity A change at Na rate V.sub.0 Sample y x Ca M(Mg) Si Mn w z 25° C. Tc or Δρ/ρ.sub.0 [V/ No. [mol] [mol] m [mol] [mol] [mol] [mol] RE TM [mol] [mol] [Ωcm] [° C.] K [%] mm] Note Example 36 0.125 0.125 0.999 0.055 0.001 0 0 Y 0.001 0 386 200 Na 17 528 Example 37 0.005 0 376 200 12 555 Example 38 0.010 0 345 200  9 527 Comparative 0.012 0 4.8E+04 — — — Resistivity Example 25 at 25° C..sup.x Example 39 0.125 0.125 0.999 0.055 0.001 0 0 La 0.001 0 421 200 Na 13 521 Example 40 0.005 0 363 200  9 570 Example 41 0.010 0 336 200 12 535 Comparative 0.012 0 8.0E+04 — — — Resistivity Example 26 at 25° C..sup.x Example 42 0.125 0.125 0.999 0.055 0.001 0 0 Ce 0.001 0 448 200 Na 17 499 Example 43 0.005 0 419 200 13 538 Example 44 0.010 0 398 200  9 577 Comparative 0.012 0 7.0E+04 — — — Resistivity Example 27 at 25° C..sup.x Example 45 0.125 0.125 0.999 0.055 0.001 0 0 Pr 0.001 0 489 200 Na 15 514 Example 46 0.005 0 472 200 17 500 Example 47 0.010 0 453 200 16 531 Comparative 0.012 0 4.0E+04 — — — Resistivity Example 28 at 25° C..sup.x Example 48 0.125 0.125 0.999 0.055 0.001 0 0 Nd 0.001 0 398 200 Na 12 535 Example 49 0.005 0 369 200 11 498 Example 50 0.010 0 333 200 10 509 Comparative 0.012 0 7.0E+04 — — — Resistivity Example 29 at 25° C..sup.x Example 51 0.125 0.125 0.999 0.055 0.001 0 0 Sm 0.001 0 412 200 Na 10 554 Example 52 0.005 0 421 200  8 529 Example 53 0.010 0 378 200  7 578 Comparative 0.012 0 5.0E+04 — — — Resistivity Example 30 at 25° C..sup.x Example 54 0.125 0.125 0.999 0.055 0.001 0 0 Gd 0.001 0 422 200 Na 17 587 Example 55 0.005 0 452 200 11 547 Example 56 0.010 0 409 200 13 547 Comparative 0.012 0 3.0E+04 — — — Resistivity Example 31 at 25° C..sup.x Example 57 0.125 0.125 0.999 0.055 0.001 0 0 Dy 0.001 0 452 200 Na 16 519 Example 58 0.005 0 413 200 12 583 Example 59 0.010 0 386 200 10 540 Comparative 0.012 0 4.0E+04 — — — Resistivity Example 32 at 25° C..sup.x Example 60 0.125 0.125 0.999 0.055 0.001 0 0 Er 0.001 0 407 200 Na 14 568 Example 61 0.005 0 353 200 12 561 Example 62 0.010 0 333 200 10 583 Comparative 0.012 0 5.5E+04 — — — Resistivity Example 33 at 25° C..sup.x Example 63 0.125 0.125 0.999 0.055 0.001 0 0 V 0 0.001 448 200 Na 18 583 Example 64 0 0.005 382 200 13 558 Example 65 0 0.010 325 200 17 507 Comparative 0 0.012 1.1E+05 — — — Resistivity Example 34 at 25° C..sup.x Example 66 0.125 0.125 0.999 0.055 0.001 0 0 Nb 0 0.001 353 200 Na 13 507 Example 67 0 0.005 332 200  9 533 Example 68 0 0.010 299 200 11 582 Comparative 0 0.012 4.0E+04 — — — Resistivity Example 35 at 25° C..sup.x Example 69 0.125 0.125 0.999 0.055 0.001 0 0 Ta 0 0.001 443 200 Na 17 527 Example 70 0 0.005 417 200 13 512 Example 71 0 0.010 391 200 15 581 Comparative 0 0.012 7.0E+04 — — — Resistivity Example 36 at 25° C..sup.x Example 72 0.125 0.125 0.999 0.055 0.001 0 0 Gd Nb 0.0025 0.0025 198 200 Na 13 559 Example 73 0.001 0.004 213 200 11 567 Example 74 0.004 0.001 272 200  9 554 Example 75 0.005 0.005 192 200  9 499 Example 76 0.002 0.008 203 200 12 575 Example 77 0.008 0.002 203 200 15 511 Comparative 0.006 0.006 5.0E+04 — — — Resistivity Example 37 at 25° C..sup.x

[0062] According to Examples 8 and 78 to 82 in Table 6, it could be known that an effect of decreasing the resistivity at 25° C. would be provided by adding Si in a ratio of 0.035 mol or less in terms of element relative to 1 mol of Ti site (the total molar number of Ti and TM). Further, in the case that Si was contained in a ratio of 0.005 mol or more and 0.02 mol or less, the effect of decreasing the resistivity at 25° C. was improved, and thus it was preferable.

TABLE-US-00006 TABLE 6 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Example 8 0.125 0.125 0.999 0.055 0.001 0 0 0 486 200 Na 16 425 Example 78 0.005 326 200 12 435 Example 79 0.010 317 200 9 444 Example 80 0.020 312 200 11 462 Example 81 0.030 365 200 13 483 Example 82 0.035 466 200 9 453

[0063] According to Examples 8 and 83 to 86 in Table 7, it could be known that an effect of improving PTC jump would be provided by adding Mn in a ratio of 0.0015 mol or less in terms of element relative to 1 mol of Ti site (the total molar number of Ti and TM). Further, in the cases that Mn was contained in a ratio of 0.0002 mol or more and 0.0010 mol or less, the effect of improving PTC jump was increased, and thus it was preferable.

TABLE-US-00007 TABLE 7 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 PTC jump Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] [digit] Example 8 0.125 0.125 0.999 0.055 0.001 0 0 0 486 200 Na 16 425 2.51 Example 83 0.0002 386 200 12 455 3.31 Example 84 0.0005 374 200 9 441 3.89 Example 85 0.0010 342 200 11 467 4.03 Example 86 0.0015 365 200 13 483 3.98

[0064] It could be seen from Examples 8 and 87 in Table 8 that a composition obtained in the case when the atmosphere during the sintering process was set as a nitrogen atmosphere (PO.sub.2=10.sup.−7 atm) had almost the same property as that sintered in air.

TABLE-US-00008 TABLE 8 Resistivity A Resistance y x Ca M(Mg) w + z Si Mn at 25° C. Tc Na or change rate V.sub.0 Sample No. [mol] [mol] m [mol] [mol] [mol] [mol] [mol] [Ωcm] [° C.] K Δρ/ρ.sub.0 [%] [V/mm] Note Example 8 0.125 0.125 0.999 0.055 0.001 0 0 0 486 200 Na 16 425 In air Example 87 304 200 12 434 In nitrogen atmosphere

DESCRIPTION OF REFERENCE NUMERALS

[0065] 1 PTC thermistor [0066] 2 ceramic body [0067] 3a, 3b electrodes