HOUSING FOR AN ELECTRONIC COMPONENT, AND LASER MODULE

Abstract

A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

Claims

1. A housing for an electronic component, comprising: a heat sink for a thermoelectric cooler; a basic body having an upper end and a lower end and a mounting area for the electronic component located therebetween, wherein the basic body has a lateral wall with a first feedthrough provided therein, the first feedthrough being configured to receive a light guide, and wherein the basic body has a base wall having the heat sink and having a plurality of second feedthroughs, the plurality of second feedthroughs being configured to receive pins electrically connecting the electronic component.

2. The housing as claimed in claim 1, wherein the plurality of second feedthroughs provided in the form of a glazing.

3. The housing as claimed in claim 1, wherein the plurality of second feedthroughs are arranged adjacent to the heat sink.

4. The housing as claimed in claim 1, wherein the basic body is a deep drawn part.

5. The housing as claimed in claim 1, wherein the basic body is made of metal.

6. The housing as claimed in claim 1, wherein the base wall has an opening for the heat sink.

7. The housing as claimed in claim 1, wherein the heat sink has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the basic body.

8. The housing as claimed in claim 1, wherein the basic body has a form fitting feature, wherein the form fitting feature is configured to allow for only a single insertion orientation of an assembly tool.

9. The housing as claimed in claim 8, wherein the form fitting feature comprises an indentation in a lateral wall thereof.

10. A laser module comprising the housing as claimed in claim 1, and further comprising at least a thermoelectric cooler and a laser diode mounted in the housing.

11. The laser module as claimed in claim 10, wherein the laser module comprises a laser diode with a maximum output power of at least 200 mW.

12. The laser module as claimed in claim 11, wherein the laser diode emits electromagnetic radiation of a wavelength from 900 to 1000 nm.

13. The laser module as claimed in claim 11, further comprising a thermistor mounted in the housing, the thermistor being adapted to control a temperature of the laser diode using the thermoelectric cooler.

14. The housing as claimed in claim 1, wherein the basic body is made of steel or an iron-nickel alloy.

15. The housing as claimed in claim 1, wherein the basic body has a coefficient of thermal expansion between 5 and 20 ppm/K.

16. The housing as claimed in claim 1, wherein the base wall of the basic body has an increased thickness around the feedthroughs for the pins.

17. The housing as claimed in claim 1, wherein the heat sink is made of copper or of a copper alloy.

18. The housing as claimed in claim 1, wherein the heat sink comprises at least two materials having different coefficients of thermal expansion.

19. The housing as claimed in claim 1, wherein the basic body has a circumferential ridge.

20. The housing as claimed in claim 1, further comprising a cover that closes the basic body, the cover having a circumferential ridge.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0064] FIG. 1 is a top perspective view of a first exemplary embodiment of a housing for an electronic component.

[0065] FIG. 2 is a bottom perspective view of FIG. 1.

[0066] FIG. 3 is a sectional view of FIG. 1.

[0067] FIG. 4 is a detailed view of FIG. 3 taken at circle A.

[0068] FIG. 5a shows a sleeve for connection of the light guide.

[0069] FIG. 5b shows another sleeve for connection of the light guide.

[0070] FIG. 6 shows a first embodiment of a heat sink.

[0071] FIG. 7 shows another embodiment of a heat sink.

[0072] FIG. 8 shows a different embodiment of a heat sink.

[0073] FIG. 9 is a top perspective view of a second exemplary embodiment of a housing for an electronic component.

[0074] FIG. 10 is a sectional view of FIG. 9.

[0075] FIG. 11 is a top view of FIG. 9.

[0076] FIG. 12 is a perspective view of the basic body according to one embodiment of a housing.

[0077] FIG. 13 is a sectional view of FIG. 12.

[0078] FIG. 14 is a detailed view of FIG. 13 take at circle B.

[0079] FIG. 15 is a top perspective view of a further embodiment of a basic body.

[0080] FIG. 16 is a bottom perspective view of FIG. 15.

[0081] FIG. 17 is a top perspective view of a further embodiment of a basic body.

[0082] FIG. 18 is a bottom perspective view of FIG. 17.

[0083] FIG. 19 is a perspective view of another embodiment of a housing.

[0084] FIG. 20 is a sectional view of FIG. 19.

[0085] FIG. 21 is a perspective view of another embodiment of a housing.

[0086] FIG. 22 is a sectional view of FIG. 21.

[0087] FIG. 23 is a perspective view of another embodiment of a housing.

[0088] FIG. 24 is a sectional view of FIG. 23.

[0089] FIG. 25 is a perspective view of another embodiment of a housing.

[0090] FIG. 26 is a sectional view of FIG. 25.

[0091] FIG. 27 is a perspective view of another embodiment of a housing.

[0092] FIG. 28 is a sectional view of FIG. 27.

[0093] FIG. 29 is a perspective view of a housing with only 6 pins.

[0094] FIG. 30 is a partially cut-away view of the housing of FIG. 29.

[0095] FIG. 31 is a sectional view of the housing of FIG. 29.

[0096] FIG. 32 is a sectional view of one exemplary embodiment of an equipped housing.

[0097] FIG. 33 is a sectional view of a cover that can be used for all illustrated embodiments.

DETAILED DESCRIPTION

[0098] The subject matter of the invention will now be explained by way of exemplary embodiments of the invention with reference to the drawings of FIGS. 1 to 33.

[0099] FIG. 1 shows a perspective view of the lower end 3 of a housing 1 for an electronic component, in particular for a laser diode.

[0100] Housing 1 comprises a trough-shaped basic body 9 with an essentially rectangular outer shape.

[0101] In this view, pins 2 can be seen on the lower end 3 of the basic body, the pins extending out of the base wall of the basic body 9.

[0102] Pins 2 are arranged in two rows.

[0103] Between pins 2, a heat sink 5 is disposed, which is made of copper or other metals that exhibit high thermal conductivity.

[0104] Heat sink 5 protrudes beyond the base wall of basic body 9 and has a bore 6 at one end and recesses 7 at the other end, which are used as form fitting features for securing the housing 1.

[0105] FIG. 2 is a perspective view of the upper end 4 of the basic body 9 of housing 1.

[0106] As can be seen, the trough-shaped basic body 9 defines, in its interior, a mounting area for an electronic component (not shown).

[0107] Pins 2 have contact portions 10 at their ends, which are arranged in the interior of the housing 1.

[0108] Contact portions 10 serve to electrically connect the electronic components located in the housing.

[0109] More particularly, the housing 1 may comprise a respective pair of contact portions for each of a laser diode, a thermoelectric cooler, and a thermistor.

[0110] Furthermore, a feedthrough 11 in the form of a bore can be seen, through which a light guide (not shown) is introduced to be coupled with the laser diode.

[0111] In this exemplary embodiment, the base wall 8 of basic body 9 has an opening through which the heat sink 5 is accessible from the interior. Electronic components can therefore be mounted directly on the heat sink 5 within the housing.

[0112] FIG. 3 is a sectional view of the housing shown in FIGS. 1 and 2, taken in parallel and close to a small end of the housing.

[0113] It can be seen that the basic body 9 has feedthroughs 14, through which the pins 2 extend into the interior of the housing.

[0114] Furthermore, it can be seen that the heat sink 5 consists of a plate 12 and a projection 13. The heat sink is connected to the basic body 9 through projection 13.

[0115] FIG. 4 is a detailed view of section A around feedthrough 14.

[0116] Pin 2 is secured in the base wall 8 of the basic body by a glazing 15.

[0117] In this exemplary embodiment, pin 2 has a contact portion 10 of enlarged diameter to which the wires for electrically connecting an electronic component can be applied.

[0118] Furthermore, in this exemplary embodiment, an insert 16 is introduced into the opening of base wall 8 in order to increase the depth of glazing 15. The insert may be secured by brazing or welding, for example. Thus, the feedthrough provides a greater length than would be given by the base wall alone.

[0119] FIGS. 5a and 5b are schematic perspective views of a sleeve 17 which can be used in all the illustrated embodiments for connecting the light guide.

[0120] Sleeve 17 as shown in FIG. 5a is adapted for being mounted in the feedthrough of the basic body by being snap connected therein.

[0121] The embodiment of a sleeve 17 as illustrated in FIG. 5b has a flange serving to secure the sleeve by welding.

[0122] Thus, in a preferred embodiment of the invention, the sleeve 17 is a separate component which is welded or brazed to the basic body. Therefore, the basic body can be provided as a deep drawn part.

[0123] FIGS. 6 to 8 are perspective views of different exemplary embodiments of a heat sink.

[0124] The heat sink 5 shown in FIG. 6 has bores 6 serving as a form fitting feature for mounting the housing.

[0125] Along the major edges between the ends of heat sink 5, the latter has recesses 18 extending transversely to the main extension direction. In the area of these recesses 18, the pins can extend outwards adjacent to heat sink 5.

[0126] FIG. 7 shows a simple heat sink 5 in the form of a plate. Such a heat sink is in particular provided in conjunction with a housing of a THT device design, since such a housing is usually secured solely through the soldered pins.

[0127] FIG. 8 shows an embodiment of a heat sink consisting of a plate 12 and a projection 13 protruding from plate 12. The plate, again, has form fitting features for mounting purposes, in particular bores.

[0128] Projection 13 may either be fastened with its front face to the base wall of the basic body or may protrude into an opening of the basic body.

[0129] Furthermore, projection 13 may serve to increase the spacing between the basic body and the circuit board in the mounted state, so that the pins can extend laterally outwards through the resulting intermediate space.

[0130] Such a heat sink 5 with projection 13 is preferably provided as a one-piece part, in particular as a milled part. However, it is also conceivable for heat sink 5 to be provided as a two-part component, for example in the form of a projection 13 brazed to plate 12.

[0131] A heat sink may either be made of the same materials or as a hybrid component made of two different materials. The latter approach offers the possibility to make the base of a material with a lower thermal expansion coefficient adapted to that of the thermoelectric cooler, and the plate of a material with higher thermal conductivity, for example.

[0132] FIG. 9 is a perspective view of another embodiment of a housing 1.

[0133] This housing again comprises a trough-shaped basic body 9 with a heat sink 5 mounted to the lower end thereof. Pins 2 extend laterally outwards, so this is an SMD device.

[0134] In the assembled state, the basic body 9 may be closed by a cover 19. Cover 19 is preferably connected by welding.

[0135] FIG. 10 is a longitudinal sectional view of the housing of FIG. 9.

[0136] Again, the basic body 9 in the form of a deep drawn part can be seen here, with feedthrough 11 for the light guide.

[0137] Furthermore, it can be seen that the heat sink 5 has a projection which is mounted with its front face to the base wall 8 of basic body 9. The connection is made by brazing, and in this exemplary embodiment a sufficiently large circumferential braze connection area 24 is easily provided.

[0138] FIG. 11 is a plan view of the lower end of the housing 1. Pins 2 can be seen, emerging adjacent to heat sink 5 and extending laterally outwards.

[0139] Only pin 2a does not extend through a feedthrough, but is directly connected to the basic body, since it serves as a grounding pin.

[0140] FIG. 12 is a perspective view of one exemplary embodiment of a basic body 9.

[0141] This basic body 9 again has a trough-shaped design.

[0142] The basic body 9 has a feedthrough 11 for a light guide in a lateral wall thereof.

[0143] Furthermore, the base wall of the basic body 9 has a rectangular opening 21 in its lower surface, through which the heat sink of the assembled housing is exposed to the interior thereof.

[0144] Furthermore, nine feedthroughs 14 for the pins for connecting the electronic components mounted in the housing can be seen.

[0145] FIG. 13 is a sectional view of the basic body 9 illustrated in FIG. 12.

[0146] Feedthroughs 14 are visible.

[0147] FIG. 14 is an enlarged view of section B in FIG. 13.

[0148] As can be seen, the base wall of the basic body has a collar 20 around feedthrough 14, so that the base wall has an increased wall thickness in the region around feedthrough 14 as compared to the adjacent area. In this manner, the glazing to be introduced into the feedthrough 14 will have a sufficient length even in the case of a deep drawn part of thin wall thickness.

[0149] Such a thickening of the collar around feedthrough 14 is preferably obtained by embossing, for example simultaneously with the deep drawing.

[0150] FIGS. 15 and 16 are perspective views of another embodiment of a basic body 9.

[0151] As can be seen in FIG. 15, this basic body 9 also has a lateral wall with a feedthrough for a light guide.

[0152] It can also be seen that on one side an inwardly projecting indentation 22 is formed in the lateral wall 23 of the small end.

[0153] As can be seen particularly clearly in FIG. 16, the indentation 22 provides a simple form fitting feature which ensures that during assembly the basic body 9 can be inserted into a mounting tool (not shown) in only one orientation.

[0154] FIGS. 17 and 18 are perspective views of a further embodiment of a basic body 9.

[0155] As can be seen in FIG. 17, in this exemplary embodiment the base wall 8 is not thickened around the feedthroughs 14 for the pins.

[0156] However, the base wall also has an opening 21 for the heat sink.

[0157] In FIG. 18 it can be seen that like in the other previously illustrated exemplary embodiments the basic body 9 has a collar at its upper end 4, on which a cover can be attached.

[0158] FIG. 19 shows a further exemplary embodiment of a housing 1 in a perspective view.

[0159] In the case of this housing, a simple plate-shaped heat sink 5 is placed on the basic body 9.

[0160] The pins 2 are not angled but extend straight from the base wall. Thus, this device is intended for THT mounting.

[0161] FIG. 20 is a sectional view of FIG. 19.

[0162] A pin 2 for contacting an electronic component can be seen, which extends through a feedthrough, and furthermore a pin 2a which serves as a grounding terminal.

[0163] Base wall 8 has an opening, and the plate-shaped heat sink is soldered with its front face to the base wall 8 without protruding into the interior of the housing. This provides additional installation space, for example if rather thick components are assembled.

[0164] FIG. 21 shows a further exemplary embodiment of a housing, which is designed for SMD mounting.

[0165] For this purpose, the pins 2 which are arranged adjacent to the bone-shaped heat sink 5 are angled so as to project laterally outwards.

[0166] FIG. 22 is a sectional view of FIG. 21.

[0167] It can be seen that in this exemplary embodiment the base wall 8 of the basic body 9 does not have any opening for the heat sink 5.

[0168] Rather, in this exemplary embodiment of the invention, cooling is achieved by heat conduction across the base wall 8 of the basic body to heat sink 5. Since the basic body preferably is a deep drawn part with a small wall thickness, it will not be necessary in many cases to introduce an opening into the base wall.

[0169] FIGS. 23 and 24 show a further embodiment of a housing.

[0170] In this embodiment, the heat sink 5 comprises a plate 12 and a projection 13, as is particularly apparent from FIG. 23.

[0171] As can be seen from the sectional view of FIG. 24, the projection 13 is inserted in an opening of base wall 8.

[0172] Therefore, the solder connection 24 is made laterally.

[0173] In this exemplary embodiment of the invention, the heat sink 5 terminates flush with the base wall 8 at the inner side of housing 1.

[0174] FIG. 25 shows a perspective view of a further exemplary embodiment of a housing with a heat sink 5.

[0175] As can be seen in the sectional view of FIG. 26, the pins 2, 2a extend laterally away from heat sink 5.

[0176] The laterally projecting pins extend approximately at the same level as heat sink 5, whereas in the exemplary embodiment shown in FIGS. 23 and 24 the heat sink has such a height that the lower end of the heat sink is spaced from the pins.

[0177] FIGS. 27 and 28 show a further embodiment of a housing 1. As can be seen from FIG. 27, the housing 1 comprises a trough-shaped basic body 9 and a heat sink 5 corresponding to that of the embodiment shown in FIG. 21 when looking at the lower end.

[0178] As can be seen in FIG. 28, the heat sink 5 comprises a projection 13 which is soldered to the lower surface of the basic body. The base wall 8 of basic body 9 has an opening 21, so that an electronic component can be placed directly onto the projection 13 of the heat sink 5.

[0179] However, the solder connection 24 is made on the lower surface of base wall 8 and is therefore not produced laterally, in contrast to the embodiment illustrated in FIG. 26.

[0180] In this exemplary embodiment, again, pins 2 and 2a extend laterally outwards, therefore this is an SMD device.

[0181] FIG. 29 shows a further exemplary embodiment of a housing 1 which has only 6 pins.

[0182] The housing comprises a heat sink 5.

[0183] Pins 2 are angled laterally outwards, therefore this is an SMD device.

[0184] FIG. 30 shows a partially cut-away view of FIG. 29.

[0185] As can be seen in this exemplary embodiment, a substantially round projection 13 of the heat sink protrudes into the interior of the housing.

[0186] The height of the components mounted within the housing can thus be adapted to the level of the contact portion of the pin extending through feedthrough 14.

[0187] In the sectional view of FIG. 31 it can be seen that the projection 13 of the heat sink protrudes into the interior 25 of the housing.

[0188] In this exemplary embodiment, the solder connection 24 is made laterally.

[0189] FIG. 32 shows a sectional view of an equipped housing, that means of a laser module 30.

[0190] The laser module 30 according to this exemplary embodiment comprises angled pins 2 and therefore is designed as an SMD device.

[0191] The heat sink 5 is inserted in an opening in the base wall of the basic body 9 of the housing.

[0192] In this manner it is possible for a thermoelectric cooler 26 in the form of a Peltier element to be directly applied to the heat sink 5.

[0193] Thermoelectric cooler 26 is connected to pins 2 via wires 28.

[0194] A high-power laser diode 27 is mounted on the thermoelectric cooler 26.

[0195] It will be understood that this laser diode 27, too, will be electrically connected via wires that extend to pins, which wires however are not visible in this view.

[0196] Furthermore, the laser module 30 preferably comprises a thermistor by which the thermoelectric cooler 26 is controlled so as to keep the temperature of laser diode 27 constant during operation.

[0197] FIG. 33 shows a detailed view of a cover 19 which can be used to close the housing shown in FIG. 32, but also the housings shown in the other exemplary embodiments.

[0198] Cover 19 has a circumferential ridge 29 which is adapted for securing the cover 19 to the basic body by resistance welding.

[0199] When the cover 19 is placed on the collar of the basic body, current density during resistance welding will be at a maximum in the area of ridge 29, so that heating of this area will be caused whereby the components are welding together.

[0200] It is equally conceivable to provide the ridge 29 on the collar of the basic body (not shown).

[0201] Alternatively, a cover without ridge may also be used and may be applied by roll seam welding, for example.

[0202] The invention permits to provide a housing with high temperature resistance for high-power components such as laser diodes, which can be manufactured in a simple manner.

LIST OF REFERENCE NUMERALS

[0203] 1 Housing 21 Opening [0204] 2 Pin 22 Indentation [0205] 2a Grounding pin 23 Lateral wall [0206] 3 Lower end 24 Solder connection [0207] 4 Upper end 25 Interior [0208] 5 Heat sink 26 Thermoelectric cooler [0209] 6 Bore 27 Laser diode [0210] 7 Recess 28 Wire [0211] 8 Base wall 29 Ridge [0212] 9 Basic body 30 Laser module [0213] 10 Contact portion [0214] 11 Feedthrough [0215] 12 Plate [0216] 13 Projection [0217] 14 Feedthrough [0218] 15 Glazing [0219] 16 Insert [0220] 17 Sleeve [0221] 18 Recess [0222] 19 Cover [0223] 20 Collar