Device having heat sink

Abstract

An electric compressor includes a motor, a scroll compression mechanism, a housing, a circuit unit, a circuit housing housing the circuit unit and integrated with the housing. The electric compressor includes a heat sink provided on a circuit unit side of a partition wall so as to project to be brought into contact with a semiconductor element of a power substrate, facing the partition wall that erects along a vertical direction to separate the inside of the housing from the circuit housing. The heat sink has a lower surface and an upper surface formed into a cylindrical shape so that width of an upper end portion and a lower end portion of the heat sink gradually decreases to reach a tip portion.

Claims

1. An apparatus comprising: an apparatus body; a body housing that houses the apparatus body; a circuit unit including a circuit board that drives and controls the apparatus body; and a circuit housing that houses the circuit unit and that is integrated with the body housing, wherein a heat sink is provided on a circuit unit side of a partition wall so as to be brought into contact with an element of the circuit board, the partition wall erecting along a vertical direction or a substantially vertical direction to separate the inside of the body housing from the inside of the circuit housing, and wherein the heat sink has an upper end portion and a lower end portion at least one of whose width gradually decreases to reach a tip portion.

2. The apparatus according to claim 1, wherein the heat sink has a dimension in the vertical direction that is longer than a dimension in a direction intersecting the vertical direction.

3. The apparatus according to claim 1, wherein a plurality of the elements is arranged on the circuit board at least in a horizontal direction, and wherein the heat sink is provided for each of blocks into which an area where the elements are arranged is divided along the vertical direction.

4. The apparatus according to claim 1, wherein a projected portion is formed in the partition wall so as to project above the heat sink toward the circuit unit.

5. The apparatus according to claim 4, wherein the projected portion is formed so as to include a recessed portion that communicates with the inside of the body housing.

6. The apparatus according to claim 5, wherein in the recessed portion, a terminal connecting the circuit board and the apparatus body is housed.

7. The apparatus according to claim 1, wherein a fixed portion for fixing the circuit board to the partition wall is formed integrally with at least one of the heat sink and the projected portion.

8. The apparatus according to claim 1, wherein the apparatus body includes a motor, and a compression mechanism that is driven and controlled through the motor and that compresses a refrigerant to be sucked into the body housing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a longitudinal sectional view of an electric compressor in accordance with a first embodiment.

(2) FIG. 2 schematically shows a cooling structure in the first embodiment. FIG. 2A is a plan view, and FIG. 2B is a sectional view taken along the line IIb-IIb of FIG. 2A.

(3) Each of FIGS. 3A and 3B shows an example of a variation of the first embodiment.

(4) FIG. 4A is a plan view schematically showing a cooling structure in a second embodiment. FIG. 4B is a plan view schematically showing an example of a variation of the second embodiment.

(5) FIG. 5 schematically shows a cooling structure in a third embodiment. FIG. 5A is a plan view, and FIG. 5B is a sectional view taken along the line Vb-Vb of FIG. 5A.

(6) FIG. 6 is a sectional view schematically showing a cooling structure in an example of a variation of the third embodiment.

(7) FIG. 7 schematically shows a cooling structure in a fourth embodiment. FIG. 7A is a plan view, and FIG. 7B is a sectional view taken along the line VIIb-VIIb of FIG. 7A.

(8) FIG. 8 is a plan view schematically showing a cooling structure in an example of a variation of the fourth embodiment.

DESCRIPTION OF EMBODIMENTS

(9) Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(10) [First Embodiment]

(11) An electric compressor 1 shown in FIG. 1 constitutes an air conditioner to be mounted in a vehicle. The electric compressor 1 includes a motor 10, a scroll compression mechanism 11 that is rotated by output of the motor 10, a housing (body housing) 12 that accommodates the motor 10 and the scroll compression mechanism 11, a circuit housing 30 that houses a circuit unit 40 that drives and controls the motor 10 and that is integrated with the housing 12.

(12) The electric compressor 1 is provided in a vehicle so that a rotating shaft 15 thereof to be rotated by the motor 10 is arranged in a horizontal direction.

(13) The motor 10 includes a rotor 13, and a stator 14. Rotation of the rotor 13 is outputted to the rotating shaft 15. In the present embodiment, although an AC induction motor is used as the motor 10, a motor is not limited to the above. For example, a DC brushless motor, a switched reluctance motor, and the like, are applicable.

(14) The scroll compression mechanism 11 includes a fixed scroll 16 that is to be fixed to the housing 12, and turning scroll 17 that is provided around an eccentric pin 18 fastened to the rotating shaft 15 through a bushing 19. The turning scroll 17 is revolved around the fixed scroll 16 with rotation of the rotating shaft 15.

(15) The housing 12 is formed into a substantially cylindrical shape so as to enclose the motor 10 and the scroll compression mechanism 11 by die casting using an aluminum alloy or the like. The housing 12 is provided with a plurality of fixed portions 24 that are to be fastened to a support member (not shown) provided in the vehicle.

(16) On one end side of the housing 12 where the motor 10 is positioned, there is provided a suction pipe 21 for sucking a refrigerant from a refrigerant circuit of the air conditioner into the housing 12. The inside of the housing 12 is sealed by a partition wall 32 that is provided on the one side of the housing 12 to separate the inside of the housing 12 from the inside of the circuit housing 30, and a cover member 22 provided on the other end side of the housing 12.

(17) The refrigerant sucked into the housing 12 through the suction pipe 21 circulates throughout the inside of the housing 12 through a periphery of the motor 10 and a ventiduct (not shown) provided in the stator 14 to be sucked into the scroll compression mechanism 11. The refrigerant that is compressed by the scroll compression mechanism 11, and that is discharged into a chamber formed between an end plate of the fixed scroll 16 and the cover member 22, is then discharged to the refrigerant circuit through a discharge pipe 23 provided in the cover member 22.

(18) The circuit housing 30 houses a circuit board and a circuit element that constitute the circuit unit 40, and includes the partition wall 32 positioned on one end side of the housing 12 in the horizontal direction, and a sidewall 33 rising from an outer peripheral edge of the partition wall 32. The circuit housing 30 is formed into a box shape, and is fastened to the housing 12 to be integrated with the housing 12. The circuit housing 30 is also formed by die casting using an aluminum alloy or the like.

(19) The partition wall 32 is provided so as to be perpendicular to the rotating shaft 15. When the electric compressor 1 is mounted in the vehicle, the partition wall 32 erects along the vertical direction. The partition wall 32 has an annular fitting portion 321 projecting from a surface (back surface 32B) facing the motor 10 that is fitted into an inner periphery of an end portion of the housing 12 through a seal ring 322.

(20) The partition wall 32 is formed into a substantially circular shape along an outer periphery of the fitting portion 321, and a part of the partition wall 32 projects to an outer periphery side from the fitting portion 321.

(21) In addition, a bearing 323 for supporting an end of the rotating shaft 15 is provided in a central portion of the partition wall 32 on the back surface 32B side.

(22) In the partition wall 32, a terminal housing opening 39 into which a motor terminal (glass terminal) 38 (refer to FIG. 2A) to be connected to a terminal of the motor 10 in the housing 12 is inserted is formed so as to penetrate through the partition wall 32 in its thickness direction. The motor terminal 38 is configured to bring three phase terminals of the motor 10 into conduction by using three lead pins 381 while sealing the inside of the housing 12. Each of the lead pins 381 is connected to a terminal part of a power substrate 41. A body part 382 enclosing the lead pins 381 projects from a surface 32A of the partition wall 32 by a predetermined height.

(23) In the surface 32A of the partition wall 32 (a surface on a side facing the circuit unit 40), there are provided a heat sink 36 with which a plurality of semiconductor elements provided in the circuit unit 40 is brought into contact to allow heat conduction, and a plurality of bosses 37 for fixing a circuit board of the circuit unit 40. A bolt penetrating the circuit board is fastened to each of the bosses 37. Any number of the bosses 37 and any position of each of the bosses 37 are applicable.

(24) The sidewall 33 is formed at a height that allows a plurality of circuit boards constituting the circuit unit 40 to be housed. In the sidewall 33, a circuit cover 34 with which the circuit unit 40 is covered is fixed with a bolt.

(25) The circuit unit 40 includes a power substrate 41 in which a circuit of an electric power system is mounted, a control substrate 42 that controls operation of the power substrate 41, and a bus bar (not shown) serving as wiring. Other than those above, the circuit unit 40 also includes: a capacitor, an inductor, and the like, which are not shown and are arranged aside of the power substrate 41 and the control substrate 42; a power source terminal (not shown) to be connected to a battery; and the like.

(26) The circuit unit 40 may include not only one circuit board, but also three or more circuit boards. Any configuration of the circuit board is applicable to the circuit unit 40.

(27) The power substrate 41 includes six semiconductor switching elements for electric power (hereinafter referred to as a semiconductor element) 43 (refer to FIGS. 2A and 2B) that constitute an inverter circuit. The power substrate 41 is formed in a substantially circular plate-like shape in agreement with the housing 12 in a substantially cylindrical shape, as with the partition wall 32. The same applies to the control substrate 42. The power substrate 41 and the control substrate 42 do not necessarily require a shape corresponding to the shape of the housing 12, and may be formed in a rectangular shape.

(28) A circuit of the power substrate 41 constitutes a circuit that outputs a waveform of a driving current to be supplied to the motor 10. The circuit switches on/off the semiconductor element 43 on the basis of a command from the control substrate 42 to generate a three-phase current from a direct current supplied through the power source terminal. The three-phase current generated is supplied to coils of the motor 10.

(29) The semiconductor element 43 is an Insulated Gate Bipolar Transistor (IGBT), or the like, and includes a rectangular element body 43A, and a radiating member 43B made of copper that is embedded in the power substrate 41, and that is arranged immediately below the element body 43A (refer to FIG. 2B). The radiating member 43B is a so-called copper inlay that is embedded in a substrate, and slightly projects to a back surface side of the power substrate 41 (refer to FIG. 2B).

(30) The inverter circuit requires a pair of the semiconductor elements 43 for each of U-phase, V-phase, and W-phase, or a total of six semiconductor elements 43, and the semiconductor elements 43 are arranged by two columns in three rows corresponding to respective three phases. An area 410 of the power substrate 41, where the semiconductor elements 43 are arranged, is formed in a rectangular shape in which a dimension in a direction of the row (vertical direction) is longer than a dimension in a direction of the column (horizontal direction on the power substrate 41).

(31) In the control substrate 42, control integrated circuit (IC) that is not shown is provided. The control IC transmits a command to the power substrate 41 on the basis of a pressure and a temperature of the refrigerant in the housing 12, an indoor temperature of the vehicle, an outdoor temperature, and the like, which are detected. Accordingly, an appropriate driving waveform of the motor 10 is generated.

(32) Hereinafter, the heat sink 36 constituting a cooling structure of the semiconductor elements 43 will be described with reference to FIGS. 2A and 2B. In FIG. 2A, the power substrate 41 is schematically shown in a rectangular shape.

(33) As described above, the heat sink 36 is formed so as to project from the surface 32A of the partition wall 32 erecting along the vertical direction in the horizontal direction.

(34) When four corners of the power substrate 41(shown by a two-dot chain line) are fixed to the respective bosses 37 of the partition wall 32, the power substrate 41 also erects along the vertical direction. At this time, the heat sink 36 overlaps throughout the area 410 where the six semiconductor elements 43 are arranged. Since the heat sink 36 projects from the partition wall 32 by a height same as that of each of the bosses 37 to which the power substrate 41 is fixed, the radiating member 43B of each of the semiconductor elements 43 is brought into contact with a surface of the heat sink 36 to allow heat conduction.

(35) The control substrate 42 also erects along the vertical direction when being fixed to the bosses 37. Accordingly, the control substrate 42 faces the power substrate 41.

(36) The heat sink 36 of the present embodiment is formed so that a length in the vertical direction is more than a width thereof. The width of the heat sink 36 (shown in FIG. 2A indicated as D) is set to be equal to or more than a width of the area 410 where the semiconductor elements 43 are arranged (dimension in the direction of the column), and the length of the heat sink 36 is set to be equal to or more than a length of the area 410.

(37) The heat sink 36 is formed in an oval block shape in a plan view, and includes a pair of a side surface 361 and a side surface 362 that are positioned aside of the heat sink 36, a lower surface 36L that connects the side surface 361 and the side surface 362 in a lower end of the heat sink 36, and an upper surface 36H that connects the side surface 361 and the side surface 362 in an upper end of the heat sink 36.

(38) The lower surface 36L projects downward in an arc-like shape to form a cylindrical surface. The upper surface 36H projects upward in an arc-like shape to form a cylindrical surface. Each of the lower surface 36L and the upper surface 36H is formed so that a width D of the heat sink 36 gradually decreases toward a tip portion T positioned at the center of the width of the heat sink 36.

(39) When the driving current generated by the circuit unit 40 is supplied to the motor 10, the electric compressor 1 is started up, so that a refrigerant to be sucked into the housing 12 through the suction pipe 21 is compressed by the scroll compression mechanism 11. During operation of the electric compressor 1, switching control is applied to the semiconductor elements 43 so that the semiconductor elements 43 continuously generate heat.

(40) Heat generated from the element body 43A is conducted to the heat sink 36 through the radiating member 43B, thereby dissipating the heat.

(41) Heat of the heat sink 36 is dissipated by heat exchange for air in the periphery of the heat sink 36 that is set at a low temperature due to heat conduction from the partition wall 32 with which a sucked refrigerant is brought into contact, or radiation from the partition wall 32.

(42) Here, natural convection is used to maintain air in the periphery of the heat sink 36 at a low temperature to promote heat dissipation of the heat sink 36.

(43) In the present embodiment, the power substrate 41 erects along the vertical direction, so that the natural convection occurs along the power substrate 41. In accordance with the natural convection, in a space between the power substrate 41 and the partition wall 32, there are formed an air current F1rising along the one side surface 361 of the heat sink 36, and an air current F2 rising along the other side surface 362 of the heat sink 36. Also in a space between the power substrate 41 and the control substrate 42, a rising air current F3 is formed.

(44) In addition, in a periphery of the power substrate 41, a descending air current is formed.

(45) The air currents F1 to F3, and the descending air current allows air in the circuit housing 30 to circulate to dissipate heat of the heat sink 36 and the semiconductor element 43.

(46) Here, natural convection caused by a density difference between heated air and cooled air adjacent to a lower side of the heated air does not occur in a state where the heated air and the cooled air exist along a horizontal surface. If the heat sink 36 is formed in a rectangular shape with lower and upper sides orthogonal to the side surfaces 361 and 362, natural convection smoothly occurs around the side surfaces 361 and 362 along the vertical direction, however, around the lower side and the upper side, residence of air occurs because a height gradient is zero. Around there, a heat transfer rate between the heat sink 36 and the air decreases.

(47) Thus, the arc-like lower surface 36L and upper surface 36H in the heat sink 36 are formed so that both of the upper and lower ends of the heat sink 36 have a height gradient. As a result, natural convection occurs even around the lower surface 36L and the upper surface 36H of the heat sink 36.

(48) Accordingly, it is possible to prevent a heat transfer rate in the upper end portion and the lower end portion of the heat sink 36 from decreasing. As a result, a cooling effect due to the natural convection is exerted throughout the heat sink around which the air currents F1 and F2 flow to enable air in the periphery of the heat sink to be maintained at a low temperature. Thus, while heat of the heat sink 36 is transferred to low-temperature air in the periphery of the heat sink 36, the heat of the semiconductor elements 43 can be efficiently dissipated into the heat sink 36.

(49) As above, since the semiconductor elements 43 are efficiently cooled, it is also possible to arrange the semiconductor elements 43 and other circuit elements at higher-density. Downsizing of the circuit housing 30 due to the matter above can lead the electric compressor 1 to be downsized.

(50) In addition, since a long section in the vertical direction where the heat transfer rate is high due to the natural convection is secured in the heat sink 36, the area 410 where the semiconductor elements 43 are arranged so that a dimension in the vertical direction is lengthened. Accordingly, a dimension of the heat sink 36 in the vertical direction is set to be longer than the width D. As a result, it is possible to further enhance the cooling effect due to the natural convection.

(51) Any shape is applicable to the lower end portion and the upper end portion of the heat sink 36, as long as the width D gradually decreases to reach the tip portion T.

(52) For example, as shown in FIG. 3A, a lower end portion 363 and an upper end portion 364 of the heat sink 36 may be formed in a wedge shape. Each of the lower end portion 363 and the upper end portion 364 is formed with a plane intersecting the side surface 361 and a plane intersecting the side surface 362 so as to project to the tip portion T in a chevron shape.

(53) Alternatively, as shown in FIG. 3B, the lower end portion 363 and the upper end portion 364 also may be formed so that the width of the heat sink 36 gradually decreases to the tip portion T positioned at any one of ends in a width direction of the heat sink 36.

(54) Although the tip portion T shown above constitutes a corner formed with two planes intersecting each other, the corner may be chamfered in a plane shape or a curved shape.

(55) Although it is preferable that both of the lower end portion and the upper end portion of the heat sink 36 gradually decrease in width to tip portion T, the present invention allows a configuration in which only one of the lower end portion and the upper end portion gradually decreases in width to the tip portion T, and the other of them is formed so as to extend linearly along a direction intersecting the side surfaces 361 and 362.

(56) The number of the semiconductor elements 43 and arrangement thereof can be arbitrarily configured depending on a type of the motor 10.

(57) The heat sink 36 may be formed in any shape that can be overlapped with an area where the semiconductor elements 43 are arranged. The dimension of the heat sink 36 in the vertical direction is not necessarily required to be longer than a width of the heat sink 36, and the present invention allows also a heat sink in which a dimension in the vertical direction is shorter than a width of the heat sink.

(58) In addition, in the present embodiment, although the element body 43A of each of the semiconductor elements 43 is in contact with the heat sink 36 through the radiating member 43B, the semiconductor element 43 without the radiating member 43B is directly brought into contact with the heat sink 36.

(59) Further, in the present embodiment, although the scroll compression mechanism 11 is shown by example, another type of a compression mechanism such as a rotary type is applicable.

(60) [Second Embodiment]

(61) Next, a compressor of a second embodiment of the present invention will be described.

(62) In the description below, a configuration different from the first embodiment will be mainly described, and a configuration identical with that described before is designated by the same reference numeral used before without duplicated description on the configuration.

(63) As shown in FIG. 4A, in the second embodiment, two heat sinks 51 and 52 are used. The heat sinks 51 and 52 are formed by dividing the heat sink 36 of the first embodiment into two almost equal parts along the vertical direction. Accordingly, each of the heat sinks 51 and 52 provides heat dissipation of the semiconductor elements 43 by one column. That is, the heat sink 51 corresponds to a block in which the semiconductor elements 43 forming one of columns are arranged, and the heat sink 52 corresponds to a block in which the semiconductor elements 43 forming the other of the columns are arranged.

(64) In each of the heat sinks 51 and 52, the lower surface 36L and the upper surface 36H are formed, as with the heat sink 36 described above. In addition, there is an interval between the heat sinks 51 and 52, where an air current F4 along the vertical direction occurs as with the air currents Fl and F2. Since the lower surface 36L and the upper surface 36H are formed, a width of each of the heat sinks 51 and 52 gradually decreases to increase a flow channel between the heat sinks 51 and 52.

(65) As a result, air smoothly comes in and out of a lower end side and an upper end side of the flow channel.

(66) Because of action of the lower surface 36L and the upper surface 36H described above, natural convection occurs throughout the flow channel between the heat sinks 51 and 52.

(67) Dividing into the plurality of heat sinks 51 and 52 like the present embodiment increases heating area of the heat sinks, with which peripheral air is brought into contact, so that the heat dissipation is improved.

(68) In addition, since a direction of division is the vertical direction, convection smoothly occurs between the heat sinks 51 and 52 adjacent to each other. As a result, it is possible to further improve the heat dissipation of the heat sinks.

(69) Each of the heat sinks 51 and 52 divided along the vertical direction decreases in the width D as compared with the integrated heat sink 36, so that an aspect ratio increases. Accordingly, with respect of a length of a section in a longitudinal direction (vertical direction), a length of a section with a heat transfer rate lower than that of the section in the longitudinal direction can be further reduced, as compared with the integrated heat sink 36. As a result, this point also can contribute to improvement in the heat dissipation of the heat sinks.

(70) If the width D of the respective heat sinks 51 and 52 decreases so as to be equivalent to a width of the semiconductor elements 43 corresponding to the respective heat sinks 51 and 52, it is possible to reduce a section with a lower heat transfer rate to a minimum.

(71) The heat sink may be divided into an appropriate form in accordance with an arrangement configuration of the semiconductor elements 43. It is also possible to form six heat sinks divided along both of the vertical direction and the horizontal direction in the partition wall 32 so that the six heat sinks individually overlap with six semiconductor elements 43. The lower surface 36L or the upper surface 36H is not required to be formed in all of the heat sinks, so that the lower surface 36L or the upper surface 36H is formed in one or more of the heat sinks. For example, among heat sinks arranged in three rows of top, middle, and bottom rows, the lower surface 36L is formed in the heat sinks arranged in the bottom row, and the upper surface 36H is formed in the heat sinks arranged in the top row.

(72) The wedge shape shown in FIG. 3A, and the one-side inclination shape shown in FIG. 3B, are applicable also to the lower end portion and the upper end portion of each of the heat sinks 51 and 52 of the present embodiment.

(73) FIG. 4B shows an example of the heat sinks 51 and 52 that are formed in a rectangular shape in a plan view.

(74) Each of the heat sinks 51 and 52 includes a lower surface 365 and an upper surface 366, which are orthogonal to the side surfaces 361 and 362. The lower surface 365 and the upper surface 366 are formed so as to extend linearly along the horizontal direction in the partition wall 32. According to the configuration, the partition wall 32 and the power substrate 41 erect along the vertical direction to allow natural convection to occur along the side surfaces 361 and 362 to circulate air in the circuit housing 30, as well as heat dissipation is improved due to division of the heat sink. As a result, it is possible to efficiently cool the semiconductor elements 43.

(75) [Third Embodiment]

(76) Next, a third embodiment of the present invention will be described.

(77) As shown in FIGS. 5A and 5B, in the third embodiment, a projected portion 61 projecting from the partition wall 32 is provided above the heat sinks 51 and 52.

(78) The projected portion 61 extends in the horizontal direction on the surface 32A of the partition wall 32, as shown in FIG. 5A. A dimension of the projected portion 61 in the horizontal direction is set approximately from the tip portion T of the heat sink 51 to the tip portion T of the heat sink 52.

(79) In the present embodiment, a height of the projected portion 61 is set to be equivalent to a height of the bosses 37 to which the power substrate 41 is fixed.

(80) The projected portion 61 includes a recessed portion 610 that has a form of being drilled from the back surface 32B of the partition wall 32, as shown in FIG. 5B. The projected portion 61 is maintained at a low temperature equivalent to that of the partition wall 32 by a sucked refrigerant flowing into the recessed portion 610 that communicates with the inside of housing 12.

(81) According to the present embodiment, since the projected portion 61 faces an ascending current, the ascending current is cooled by the projected portion 61 to turn to descend. In this way, if an air current (Fd) descending is promoted, circulation of air in the circuit housing 30 is promoted.

(82) In addition, since the projected portion 61 is cooled by a sucked refrigerant taken into the recessed portion 610 that is an internal space of the projected portion 61, more descending currents occur to enable the circulation of air to be further promoted.

(83) As above, it is possible to further improve heat dissipation of the heat sinks 51 and 52, and the semiconductor elements 43.

(84) As with the projected portion 61, the heat sinks 51 and 52 may have a form of being drilled from the back surface 32B of the partition wall 32. Accordingly, since the heat sinks 51 and 52 are cooled by the sucked refrigerant in the housing 12, it is possible to efficiently cool the semiconductor elements 43.

(85) Instead of the hollow projected portion 61, a solid projected portion 62 shown in FIG. 6 may be formed in the partition wall 32. Here, two projected portions 62 each of which is formed in a thin plate shape are juxtaposed in the vertical direction. If an ascending current is brought into contact with the projected portions 62, the ascending current is cooled to descend. The projected portion 62 is maintained at a low temperature due to heat conduction from the partition wall 32 and heat dissipation of itself.

(86) The projected portion 61 and the projected portions 62, described above, may be set at any height, and may project up to a position exceeding the power substrate 41. In addition, a dimension of the projected portion 61 and the projected portions 62 in the horizontal direction, and a dimension thereof in the vertical direction, also may be arbitrarily determined.

(87) [Fourth Embodiment]

(88) Next, a fourth embodiment of the present invention will be described.

(89) In the fourth embodiment, members to be provided inside the circuit housing 30 are arranged by making efforts.

(90) In a configuration shown in FIGS. 7A and 7B, the motor terminal 38 is housed in the recessed portion 610 of the projected portion 61, described above. Lead pins 381 of the motor terminal 38 are taken out through respective holes penetrating an upper surface of the projected portion 61.

(91) Since the recessed portion 610 also serves as the terminal housing opening 39, the number of members occupying the inside of the circuit housing 30 decreases to allow an air current to smoothly circulate in the circuit housing 30. As a result, it is possible to enhance the cooling effect.

(92) In addition, in a configuration shown in FIG. 8, the bosses 37 (fixed portions) for fixing the power substrate 41 are arranged by making efforts. There are two ideas for that, and first boss portions 37′ (female screw parts) are formed integrally with the upper end portion and the lower end portion of each of the heat sinks 51 and 52. Next, the bosses 37 are arranged so as to be adjacent to the projected portion 61, and are formed integrally with the projected portion 61.

(93) Only one of the bosses 37 and the boss portions 37′ may be provided.

(94) As described above, since the bosses 37 and the boss portions 37′ are integrated with the heat sinks 51 and 52 or the projected portion 61, it is possible to reduce the number of members occupying the inside of the circuit housing 30. In addition, since the bosses 37 and the boss portions 37′ are thermally connected to the heat sinks 51 and 52, and the projected portion 61 to increase a heat capacity, heat dissipation of the heat sinks 51 and 52, and the projected portion 61 is improved. Further, since heat transfer from the power substrate 41 through the bosses 37 and the boss portions 37′ can be expected, it is possible to contribute to improvement in the heat dissipation of the semiconductor elements 43.

(95) In each of the embodiments described above, although there is shown the electric compressor that compresses a refrigerant, other than that, the present invention is widely applicable to a variety of apparatuses, such as an electric compressor that compresses air, and an electric pump.

(96) It is possible to select from the configurations shown above, and to appropriately modify them for another configuration, within a range without departing from the essence of the present invention.

REFERENCE SIGNS LIST

(97) 1 electric compressor 10 motor 11 scroll compression mechanism 12 housing 13 rotor 14 stator 15 rotating shaft 16 fixed scroll 17 turning scroll 18 eccentric pin 19 bushing 21 suction pipe 22 cover member 23 discharge pipe 30 circuit housing 32 partition wall 32A surface 32B back surface 33 sidewall 34 circuit cover 36 heat sink 36H upper surface 36L lower surface 37 boss 38 motor terminal 39 terminal housing opening 40 circuit unit 41 power substrate 42 control substrate 43 semiconductor element 43A element body 43B radiating member 51, 52 heat sink 61, 62 projected portion 361, 362 side surface 363 lower end portion 364 upper end portion 410 area 610 recessed portion Fl to F4 air current D width T tip portion