PATCH ANTENNA, METHOD OF MANUFACTURING AND USING SUCH AN ANTENNA, AND ANTENNA SYSTEM
20170222321 · 2017-08-03
Inventors
- Diego Caratelli (Duizel, NL)
- Johan Leo Alfons Gielis (Antwerpen, NL)
- Vasiliki PARAFOROU (Delft, NL)
- Luciano MESCIA (Trigianno, IT)
- Pietro BIA (Matera, IT)
Cpc classification
H01Q9/0407
ELECTRICITY
H01Q19/108
ELECTRICITY
International classification
Abstract
The invention relates to a patch antenna. The invention also relates to an antenna system for transmitting and receiving electromagnetic signals comprising at least one antenna according to the invention. The invention further relates to a method of manufacturing an antenna according to the invention. The invention moreover relates to a method for use in wireless communications by using an antenna according to the invention. The invention additionally relates to a RF transceiver of a wireless communications device comprising at least one antenna according to the invention. The invention further relates to an electronic device comprising an RF transceiver according to the invention.
Claims
1. A patch antenna, comprising: at least one electrically conductive patch, at least one electrically conductive ground plane, at least one feed connector which is insulated from the ground plane and which is conductively connected to at least one patch, and at least one dielectric spacer structure for separating the at least one patch and the at least one ground plane, wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
2. A patch antenna, comprising: at least one electrically conductive patch, at least one electrically conductive ground plane, at least one feed connector which is insulated from the ground plane and which is conductively connected to at least one patch, and at least one dielectric spacer structure for separating the at least one patch and the at least one ground plane, wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
3. A patch antenna, comprising: at least one electrically conductive patch, at least one electrically conductive ground plane, at least one feed connector which is insulated from the ground plane and which is conductively connected to at least one patch, and at least one dielectric spacer structure for separating the at least one patch and the at least one ground plane, wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
4. A patch antenna, comprising: at least one electrically conductive patch, at least one electrically conductive ground plane, at least one feed connector which is insulated from the ground plane and which is conductively connected to at least one patch, and at least one dielectric spacer structure for separating the at least one patch and the at least one ground plane, wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
5. The patch antenna according to claim 1, wherein the feed connector is a microstrip line, which is provided in parallel orientation to the perpendicular symmetry plane of the patch, at a distance from said symmetry plane, said distance being larger than the width of the microstrip line.
6. A patch antenna, comprising: at least one electrically conductive patch, at least one electrically conductive ground plane, at least one feed connector which is insulated from the ground plane and which is conductively connected to at least one patch, and at least one dielectric spacer structure for separating the at least one patch and the at least one ground plane, wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
7. The patch antenna according to claim 1, wherein the patch antenna comprises multiple patches, each of which is preferably connected to a separate feed connector.
8. The patch antenna according to claim 7, wherein the patches are positioned at a distance from each other.
9. The patch antenna according to claim 7, wherein each patch has a base profile which is substantially supershaped.
10. The patch antenna according to claim 1, wherein the at least one patch connected to the feed connector acts as primary patch, and wherein the patch antenna further comprises at least one secondary patch positioned at a distance from said primary patch, such that primary patch and secondary patch are configured to interact electromagnetically with another.
11. The patch antenna according to claim 10, wherein the set of the at least one primary patch and the at least one secondary patch has a combined base profile which is substantially supershaped.
12. The patch antenna according to claim 10, wherein the at least one primary patch and the at least one secondary patch are mutually separated by at least one slot, wherein said at least one slot has a based profile which is substantially supershaped.
13.-25. (canceled)
26. The patch antenna according to claim 1, wherein the spacer structure and/or the ground plane has a substantial circular or elliptical shape.
27. The patch antenna according to claim 1, wherein the feed connector is connected to at least one patch at an eccentric position on the patch.
28.-35. (canceled)
36. The patch antenna according to claim 1, wherein the feed connector comprises a microstrip extending substantially parallel to the ground plane.
37. The patch antenna according to claim 1, wherein the feed connector is led through a hole provided in the ground plane.
38.-42. (canceled)
43. A method of manufacturing an antenna according to claim 1, comprising: A) designing at least one patch such that the patch is defined by at least a part of at least one base profile which is substantially supershaped, said supershape defined by the polar function:
44.-46. (canceled)
47. The method according to claim 43, wherein during step B) multiple patches are attached to the substrate, wherein each patch is connected to its own feed connector.
48. (canceled)
49. A method for use in wireless communications by using a patch antenna, the method comprising the step of connecting a communication circuit to an antenna network, the network comprising a plurality of patch antennas according to claim 1, each antenna optimized for operation in at least one designated frequency band.
50.-57. (canceled)
58. An RF transceiver of a wireless communications device comprising at least one patch antenna according to claim 1.
59. (canceled)
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0104] Various illustrative embodiments of the invention will be elucidated on the basis of non-limitative exemplary embodiments shown in the following figures. Herein:
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[0116]
DETAILED DISCUSSION OF THE PREFERRED EMBODIMENTS
Example Patch Antenna for GPR Applications
[0117] Ground Penetrating Radar (GPR) uses electromagnetic wide frequency band radar pulses to probe the earth subsurface. The transmitted radar pulses are reflected from various dielectric discontinuities within the ground and the reflected waves are detected from the receiving antenna. Soil horizons, the groundwater surface, soil/rock interfaces, man-made objects, or any other interface possessing a contrast in dielectric properties can be detected, localized and characterized with a high resolution. One of the most critical hardware components for the performance of the GPR system is the antenna. For impulse GPR, it is required that the antenna have sufficiently large bandwidth in order to transmit and receive short duration time domain waveforms with suppressed late-time ringing to avoid masking of targets. Additionally, the antenna must exhibit a linear phase characteristic over the whole operating frequency band for avoiding widening of the pulse over time. The operating frequencies and bandwidth of a GPR antenna are crucial for the system performance. GPR antennas must meet the broadband specifications, whereas higher frequencies are required for better resolution in order to determine small-size objects and lower frequencies are needed for depth penetration. So, the duration of the time domain antenna pulse is the trade off between range resolution and depth penetration. Moreover, high efficiency, high gain, portability, ease to use, small volume occupation for higher spatial sampling, easy mounting, integration capability with electronic circuits, ease of fabrication, etc. are basic requirements that GPR antennas must comply with. Resistively loaded cylindrical monopoles, resistively loaded bow-tie antennas, wire bow-tie antennas, TEM horns and their modification and spiral antennas have been widely used in the past in GPR systems. Although large antennas offer broadband behaviour, high resolution, deeper penetration and capability of compensation for ground's spectral filtering-effect, they are not compact and portable. Furthermore, most of, if not all, the present known patch GPR antennas (dipole, bow-tie, etc.) have rarely enough bandwidth to fully utilize GPR potentials and on the top of that they have no co-designed ground plane and they produce significant distortions when shielding or cavity is added.
[0118] To overcome one or more of the above drawbacks, an improved patch antenna with a superb performance was designed, which is shown in
[0119] As shown in the top view of
[0120] The patches 5a, 5b have an identical shape and are symmetrically positioned supershaped wings, whose contour profile is determined by three continuous parameters of the supershape formula according to claim 1.
where R.sub.g(φ) is a curve located in the xy-plane and φ∈[0; 2π) is the angular coordinate. This equation is a polar function of the form r=ƒ(φ) and consists a generalization of the superellipse formula. The shape of the branches' profile can be controlled by tuning a set of six real and positive numerical parameters (α; b; m; n1; n2; n3)∈R.sup.6, with α; b≠0. On consideration of low cross-polarization and limited edge diffraction, the following conditions are set: a=b, m=1, and n2=n3. As a result, only three parameters (α, n.sub.1, n2) are needed to form the optimized tear-drop shape as shown in
TABLE-US-00001 Gielis parameters (a, b, m, n.sub.1, n.sub.2, n.sub.3) = (5.321, 5.321, 1, 0.458, 1.188, 1.188) Solid geometry parameters [mm] r.sub.x = 136.561 r.sub.y = 94.707 w = 2.225 t = 0.017 h = 42.48 h.sub.g = 4.6 r.sub.c = 1.895 d.sub.f = 1.596 r.sub.g = 10.805 Substrate material parameters ε.sub.r = 2.55 tan δ.sub.e = 0.0005 tan δ.sub.m = 0
[0121] The substrate 4 provides the antenna 1 structure rigidity, confinement of the field in the open-cavity, absorption of reflected waves and also allows reduction of the height of the structure. The substrate 4 is made of the dielectric material PREPERM with permittivity ∈.sub.r=2.55.
[0122] The feeding lines 6a, 6b are formed by two plated-through hole (PTH) pins with an input impedance of 100 Ohm through the circular slot in the ground plane 2. The practical PTH technique is introduced for reducing the reactance of the feed pins 6a, 6b and for bandwidth enhancement reasons as well.
[0123] The return loss parameter of the supershaped dipole antenna 1 is presented in
[0124] The time-domain antenna response consists of two parts, the main pulse and the ringing region. The main pulse results from the direct radiation of the excitation pulse at the feed point, while the ringing part is caused by reflections of the current pulse in the internal structure of the antenna 1 due to discontinuities and reflections from the ground plane. The primary goal for a transient antenna is the reduction of the pulse ringing region for avoiding masking of targets. The antenna shape plays an important role to the internal wave reflections since it determines the surface current distribution. The supershape formula provides the possibility of optimizing the antenna shape through the tuning of three parameters. In this way, the impedance discontinuities in the antenna structure that cause the unwanted reflections can be mitigated.
[0125] The excitation signal is a Gaussian pulse with duration about 0.6 ns. The waveform and the spectrum of the excitation pulse are presented in
[0126] A fundamental requirement for a GPR antenna is to radiate towards the ground in order not to interfere with the electronic equipment of the GPR system. Also, the external signals influence from the upper half-space to the GPR receive antenna must be minimized. Therefore, for dipole-like antennas, which typically radiate omnidirectionally, shielding is needed. Shielding design can be a tricky process because it causes distortion to the time-domain pulse. The antenna 1 according to the invention, due to the floating ground plane provides electromagnetic isolation from the upper half-space without employing a shielding mechanism. In this way the manufacturing cost can be reduced drastically. The three dimensional free-space radiation patterns in four different frequencies from 0.5 GHz to 4 GHz are presented in
[0127] Hence, in
OTHER EXAMPLES
[0128] Reference is made to
[0132] Various computer aided manufacturing (“CAM”) techniques and products made therefrom are known in the art and any appropriate CAM technique(s) and product(s) made can be selected. As just some examples of CAM techniques and products made therefrom, see the following U.S. patents (titles in parentheses), the entire disclosures of which are incorporated herein by reference: U.S. Pat. No. 5,796,986 (Method and apparatus for linking computer aided design databases with numerical control machine database); U.S. Pat. No. 4,864,520 (Shape generating/creating system for computer aided design, computer aided manufacturing, computer aided engineering and computer applied technology); U.S. Pat. No. 5,587,912 (Computer aided processing of three dimensional objects and apparatus therefor); U.S. Pat. No. 5,880,962 (Computer aided processing of 3-D objects and apparatus thereof); U.S. Pat. No. 5,159,512 (Construction of Minkowski sums and derivatives morphological combinations of arbitrary polyhedral in CAD/CAM systems).
[0133] Various stereo lithography techniques and products made therefrom are known in the art and any appropriate stereo lithographic technique(s) and product(s) made can be selected. As just some examples of stereo lithographic techniques and products made therefrom, see the following U.S. patents (titles in parentheses), the entire disclosures of which are incorporated herein by reference: U.S. Pat. No. 5,728,345 (Method for making an electrode for electrical discharge machining by use of a stereo lithography model); U.S. Pat. No. 5,711,911 (Method of and apparatus for making a three-dimensional object by stereo lithography); U.S. Pat. No. 5,639,413 (Methods and compositions related to stereo lithography); U.S. Pat. No. 5,616,293 (Rapid making of a prototype part or mold using stereo lithography model); U.S. Pat. No. 5,609,813 (Method of making a three-dimensional object by stereo lithography); U.S. Pat. No. 5,609,812 (Method of making a three-dimensional object by stereo lithography); U.S. Pat. No. 5,296,335 (Method for manufacturing fibre-reinforced parts utilizing stereo lithography tooling); U.S. Pat. No. 5,256,340 (Method of making a three-dimensional object by stereo lithography); U.S. Pat. No. 5,247,180 (Stereo lithographic apparatus and method of use); U.S. Pat. No. 5,236,637 (Method of and apparatus for production of three dimensional objects by stereo lithography); U.S. Pat. No. 5,217,653 (Method and apparatus for producing a stepless 3-dimensional object by stereo lithography); U.S. Pat. No. 5,184,307 (Method and apparatus for production of high resolution three-dimensional objects by stereo lithography); U.S. Pat. No. 5,182,715 (Rapid and accurate production of stereo lithographic parts); U.S. Pat. No. 5,182,056 (Stereo lithography method and apparatus employing various penetration depths); U.S. Pat. No. 5,182,055 (Method of making a three-dimensional object by stereo lithography); U.S. Pat. No. 5,167,882 (Stereo lithography method); U.S. Pat. No. 5,143,663 (Stereo lithography method and apparatus); U.S. Pat. No. 5,130,064 (Method of making a three dimensional object by stereo lithography); U.S. Pat. No. 5,059,021 (Apparatus and method for correcting for drift in production of objects by stereo lithography); U.S. Pat. No. 4,942,001 (Method of forming a three-dimensional object by stereo lithography and composition therefore); U.S. Pat. No. 4,844,144 (Investment casting utilizing patterns produced by stereo lithography).
[0134] Moreover, the present invention can be used in known micro-stereo lithographic procedures. For example, the present invention can, thus, be used in the creation of computer chips and other items. Some illustrative articles, the disclosures of which are incorporated herein by reference, are as follows: A. Bertsch, H Lorenz, P. Renaud “3D microfabrication by combining microstereolithography and thick resist UV lithography,” Sensors and Actuators: A, 73, pp. 14-23, (1999). L. Beluze, A. Bertsch, P. Renaud “Microstereolithography: a new process to build complex 3D objects,” Symposium on Design, Test and microfabrication of MEMs/MOEMs, Proceedings of SPIE, 3680(2), pp. 808-817, (1999). A. Bertsch, H. Lorenz, P. Renaud “Combining Microstereolithography and thick resist UV lithography for 3D microfabrication,” Proceedings of the IEEE MEMS 98 Workshop, Heidelberg, Germany, pp. 18-23, (1998). A. Bertsch, J. Y. Jézéquel, J. C. André“Study of the spatial resolution of a new 3D microfabrication process: the microstereophotolithography using a dynamic mask-generator technique,” Journal of Photochem. and Photobiol. A: Chemistry, 107, pp. 275-281, (1997). A. Bertsch, S. Zissi, J. Y. Jézéquel, S. Corbel, J. C. André “Microstereophotolithography using a liquid crystal display as dynamic mask-generator,” Micro. Tech., 3(2), pp. 42-47, (1997). A. Bertsch, S. Zissi, M. Calin, S. Ballandras, A. Bourjault, D. Hauden, J. C. André“Conception and realization of miniaturized actuators fabricated by Microstereophotolithography and actuated by Shape Memory Alloys,” Proceedings of the 3rd France-Japan Congress and 1st Europe-Asia Congress on Mechatronics, Besançon, 2, pp. 631-634, (1996).
[0135] Similarly, various rapid prototyping techniques and products made therefrom (e.g., moulds, etc.) are known in the art and any appropriate technique(s) and product(s) made can be selected. For example, three exemplary 3-Dimensional model rapid prototyping methods currently available, include, as described in U.S. Pat. No. 5,578,227, the disclosure of which is incorporated herein by reference: a) photocurable liquid solidification or stereo lithography (e.g., see above); b) selective laser sintering (SLS) or powder layer sintering; c) fused deposition modelling (FDM) or extruded molten plastic deposition method. As just some examples of rapid prototyping techniques and products made therefrom, see the following U.S. patents (titles in parentheses), the entire disclosures of which are incorporated herein by reference: U.S. Pat. No. 5,846,370 (Rapid prototyping process and apparatus therefor); U.S. Pat. No. 5,818,718 (Higher order construction algorithm method for rapid prototyping); U.S. Pat. No. 5,796,620 (Computerized system for lost foam casting process using rapid tooling set-up); U.S. Pat. No. 5,663,883 (Rapid prototyping method); U.S. Pat. No. 5,622,577 (Rapid prototyping process and cooling chamber therefor); U.S. Pat. No. 5,587,913 (Method employing sequential two-dimensional geometry for producing shells for fabrication by a rapid prototyping system); U.S. Pat. No. 5,578,227 (Rapid prototyping system); U.S. Pat. No. 5,547,305 (Rapid, tool-less adjusting system for hot stick tooling); U.S. Pat. No. 5,491,643 (Method for optimizing parameters characteristic of an object developed in a rapid prototyping system); U.S. Pat. No. 5,458,825 (Utilization of blow molding tooling manufactured by stereo lithography for rapid container prototyping); U.S. Pat. No. 5,398,193 (Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor).
[0136] The above-noted three steps, or phases, are also schematically illustrated in the schematic diagram shown in
[0137] A. 2-D Graphical Software
[0138] The present invention has great utility in 2-D graphic software applications.
[0139] The present invention can be applied, for example, in conventional commercial programs such as Corel-Draw™ and Corel-Paint™, Open Office applications, Supergraphx™ for Adobe Illustrator and Photoshop™, Adobe Photoshop™, in various drawing programs in Visual Basic™ or Windows™, or in other environments like, for example, Lotus WordPro™ and Lotus Freelance Graphics™, Java™, Visual C™ Visual C++™ and all other C-environments. The present invention has substantial advantages in image synthesis because, among other things, the present approach enables a substantial savings in computer memory space because only the super-formula with classical functions (such as powers, trigonometric functions, etc.) needs to be utilized. In addition, the number of image shapes available with the super-formula is substantially increased beyond that previously available. Graphics programs (such as Paint in Windows™, drawing tools in Microsoft Word™, Corel-Draw™, CAD, that used in architectural design, etc.) use “primitives” which are shapes programmed into the computer. These are very restrictive, e.g., often limited to mainly circles, ellipses, squares and rectangles (in 3-D, volumetric primitives are also very restricted). The introduction of the super-formula greatly enlarges by several orders of magnitude the overall possibilities in 2-D graphics (and also in 3-D graphics as discussed below). Used as a linear operator it can operate in many different ways and formulations, whether polar coordinates, etc., and also in 3-D using spherical coordinates, cylindrical coordinates, parametric formulations of homogenized cylinders, etc.
[0140] Some exemplary embodiments within 2-D graphics software applications are as follows.
[0141] a.1. The computer can be adapted to make plain use of the operator, in for example polar coordinates or in XY coordinates. In this sense, the parameters can be chosen (e.g., by an operator input or by the computer itself) and used as input in the super-formula (e.g., via programming). The individual shapes or objects can be used in any manner, such as to print or display an object, etc.
[0142] a.2. The computer can also be adapted to perform operations such as integration to calculate area, perimeter, moment of inertia, etc. In this regard, the computer can be adapted to perform such an operation either by a) selection of such operation via an operator input (e.g., via keyboard 20) or b) adapting of the computer (e.g., via pre-programming) to perform such operations.
[0143] a.3. The computer can be adapted (e.g., via software) to: a) display or otherwise present shapes; b) to allow a user to modify such shapes after the display thereof; and c) to display the shape as modified by the user. In this regard, the user can modify the shape by, for example, changing parameters. In an exemplary embodiment, the computer can be adapted to enable shapes that are displayed or otherwise presented (i.e., presented in step three noted above) by physically acting on the physical representation created in step three. In a preferred embodiment, the computer can be adapted to enable shapes that are displayed on a monitor to be modified by pulling out sides and/or corners of the pattern, e.g. image. In that regard, preferably, an image 31 is displayed on a computer screen or monitor 30 and a user can use his hand manipulated “mouse” 40 (or other user-manipulated screen or display pointer device) to place a displayed pointer 32 on the shape to “click” and “drag” the same to a new position 33-thereby moderating the super-shape to assume a new “super-shape” configuration 34. This will also include a recalculation of the formula and parameters.
[0144] a.4. The computer can also be adapted to perform Boolean operations whereby more than one of the individual shapes generated in a1 or a3 are taken together, either through the process of super-position. In some cases, individual supershapes that are combined by, e.g., super-position and/or reiteration or the like may be, e.g., sectors or sections that are combinable to create shapes having differing sections or regions (as just one illustrative example, a sector of a circle between, e.g., 0 and π/2 can be combined with a sector of a square between, e.g., π/2 and π to create a multi-component shape). The computer can also be adapted to perform additional operations upon the created super-shapes—e.g., to flatten, skew, elongated, enlarge, rotate, move or translate, or otherwise modify such shapes.
[0145] B. 3-D Graphical Software
[0146] As with 2-D applications, the present invention has great utility in 3-D graphic software applications (as well as in representations in various other dimensions).
[0147] The present invention can be applied, for example, in Computer Aided Design (“CAD”) software, software for Finite Element Analysis (“FEM”), Supergraphx 3D Shape Explorer, antenna design and analysis software, such as CST, Ansoft HFSS, Remcom XFdtd, EMSS Feko, Empire XCcel, architectural design software, etc. The present invention allows, for example, one to use single continuous functions, rather than spline functions, for various applications. Industrial applications of CAD include, e.g., use in Rapid Prototyping or in Computer Aided Manufacturing (“CAM”) including 3D printing.
[0148] Reference is made to
defined by the polar function:
wherein ρ.sub.d (φ) is a curve located in the xy-plane and φ∈[0, 2π) is the angular coordinate. In this example the following values are used to arrive at the shape of the (cross-section of the) patch 302 as shown in
[0149] The antenna 300 as shown in
[0150] An alternative patch antenna 350 according to the invention is shown in
TABLE-US-00002 α b m n.sub.1 n.sub.2 n.sub.3 C.sub.1i 2.618 2.618 2 0.5 1 1 C.sub.1o 3.418 3.418 2 0.5 1 1 C.sub.2i 4.05 4.05 2 0.5 1 1
[0151] According to experimental testing, the above values has led to optimum design of the patches 352a, 352b and of a gap 355 situated in between said patches 352a, 352b in order to gain the best performance of the antenna 350 as Wi-Fi dual-band antenna in the 2.4 GHz (2.35-2.52 GHz) and the 5 GHz (5.12-5.94 GHz) frequency band. The dielectric substrate 351 and the ground plane 353 have an identical elliptical design and dimensioning. The length R.sub.x of the substrate 351 and ground plane 353 equals to 39.7 mm in this example, while the width R.sub.y equals to 33.7 mm. The outer dimensioning of the secondary patch 352b in this example is that the length r.sub.x equals to 19.8 mm, while the width r.sub.y equals to 11.8 mm. The thickness h of the substrate 351 equals to 9.525 mm in this example. The patch thickness t equals to 0.07 mm. The thickness d.sub.f of the feed connector 354 equals to 1.28 mm. The inner diameter D.sub.f of the tubular portion 353a of the ground plane 353 equals to 4.28 mm. This leads to a distance of 1.5 mm between the feed connector 354 and the ground plane 353.
[0152] As shown in
[0153]
wherein ρd (φ) is a curve located in the xy-plane and φ∈[0, 2π) is the angular coordinate. In this example the following values are used to arrive at the shape of the patch 406 as shown: m.sub.1=4, m.sub.2=4, a=1, =b=1, n.sub.1=2, n.sub.2=6 and n.sub.3=6.
[0154] The patch antenna 400 shown in
COMPARATIVE EXAMPLE
[0155]
[0156] The substrate 456 is made out of dielectric material and acts as a spacer structure between the ground plane and the patch 452. The feed connector 454 has the form of a microstrip that is led over the surface of the substrate 456. The base profile of the circular patch 452 does not comply with a base profile according to the invention, as this requires for the polar function that defines the base profile, that m.sub.1=0 and m.sub.2=0. The patch antenna 450 shown in
[0157] This comparative example demonstrates that both the total efficiency and the maximum directivity of a known patch antenna can be raised significantly, by re-designing the base profile of the patch in such a way that it is substantially defined by the superformula as referred to in claim 1.
[0158]
wherein: [0159] ρd(φ) is a curve located in the XY-plane, [0160] φ∈[0, 2π) is the angular coordinate, [0161] preferably m1≠0 and m2≠0, and [0162] preferably n1=n2=n3≠2.
[0163] As elucidated above, application of at least one supershaped patch leads to a significant improvement of the antenna performance.
Examples of Ultra Wide Band Antennas
[0164] The supershaped patch antenna according to the present invention can also be used for designing an ultra-wide band antenna (UWB) for which it is required that the antenna is operable over a frequency range from 2 to 20 GHz, while achieving a scattering parameter S11 with magnitude around or below −10 dB over substantially the whole frequency range.
[0165] The FCC and the International Telecommunication Union Radio communication Sector currently define UWB in terms of a transmission from an antenna for which the emitted signal bandwidth exceeds the lesser of 500 MHz or 20% of the center frequency.
Circular-Like Supershapes
[0166] The patch antenna has the following basic built-up: [0167] an electrically conductive patch, [0168] an electrically conductive ground plane which is rectangular, [0169] at least one feed connector in the form of microstrip feeding of 50 Ohm impedance which is insulated from the ground plane and which is conductively connected to at least one patch, and [0170] at least one dielectric substrate for separating the at least one patch and the at least one ground plane,
wherein at least one patch is defined by at least a part of at least one base profile which is substantially supershaped, wherein said supershaped base profile is defined by the polar function:
wherein: [0171] ρd(φ) is a curve located in the XY-plane, [0172] φ∈[0, 2π) is the angular coordinate.
[0173] A commercially available ‘Rogers RO4003C’ substrate having a relative dielectric constant ∈.sub.r=3.55, losses δ=0.027 and thickness h=0.46 mm is preferably used.
[0174] In addition, the supershaped patch fulfills the following conditions: [0175] m1 equals m2 and ranges from 1 to 3.5; [0176] a=b=1; [0177] n3 equals n2 and ranges from 0.7 to 3; and [0178] n1 ranges from 0.5 to 3, [0179] and more specifically: [0180] m1 equals m2 and ranges from 1 to 3.5; [0181] a=b=1;
combined with either:
n1=3 while n3 equals n2 and is chosen from 3, 1, and 0.7;
n1=1 while n3 equals n2 and is chosen from 3, 2.5, and 1;
n1=0.7 while n3 equals n2 and is 3; or
n1=0.5 while n3 equals n2 and is 2.5.
[0182]
[0183] In the insets of the figures, the two supershapes are depicted which fulfill the conditions:
for a): m.sub.1=m.sub.2=2.25, n.sub.3=n.sub.2=2.7, a=b=1, n1=1.43, c=13.28,
for b): m.sub.1=m.sub.2=1.65, n.sub.3=n.sub.2=3.6, a=b=1, n1=0.65, c=12.14.
wherein c is a scaling factor which is a factor by which the value of ρd(φ) is multiplied.
[0184] The graphs show that both supershaped patch antennas achieve a magnitude of S11 around or below −10 dB over a broad frequency range from 2 to 20 GHz.
[0185] One additional advantage of this circular patch antenna in comparison to a conventional circular monopole consists in the enhanced impedance matching properties at lower frequencies. This is a remarkable improvement which results, also, in the increase of the antenna bandwidth.
Elongated Elliptical Supershape
[0186] A special elongated variation of the circular-like supershape above, is obtained based on the same basic built-up as indicated above, which differs in having the following combination of parameters: [0187] m1=m2=1; [0188] a=b=1; [0189] n3 equals n2 and ranges from 1 to 10; [0190] n1 ranges from 1 to 1.5.
[0191] A bandwidth can thereby be obtained which varies between 20 GHz and 26 GHz
Square Supershape
[0192] A square supershape is obtained based on the same basic built-up as indicated above, which differs in having the following combination of parameters: [0193] m1 equals m2 and ranges from 3.6 to 4.5; [0194] a=b=1; [0195] n3=n2=3; and [0196] n1=3.
[0197]
[0198] The graph shows the square supershaped patch antenna achieves a magnitude for S11 below −10 dB over a broad frequency range from 3 to 30 GHz. In contrast, the common square patch antenna achieves such values only around 2, 17, and 25 GHz, but not over the full frequency range.
[0199] Furthermore, the square supershaped patch antenna achieves lower or similar input reflection coefficient values over the whole frequency range from 2 to 30 GHz, in comparison to the common square patch antenna.
Slotted Supershapes (1)
[0200] A slotted supershape is obtained based on the same basic built-up as indicated above, which differs in that: [0201] the patch is provided with a slot being an excised area within the patch, wherein the patch is defined by the polar function:
wherein the above polar function ρd(φ) is multiplied by a scaling factor c=11.16, and wherein [0202] m1=m2=2.25; [0203] a=b=1; [0204] n3=n2=3; and [0205] n1=1.48;
wherein the slot within the patch is defined by the polar function:
wherein the above polar function ρd(φ) is multiplied by a scaling factor c=4.4, and wherein [0206] m1=m2=2.36; [0207] a=b=1; [0208] n3=n2=2.83; and [0209] n1=1.43.
[0210]
[0211] The graph shows a sufficient sensitivity over the frequency range from 2 to 20 GHz.
Slotted Supershapes (2)
[0212] Other slotted supershape patch antenna designs may be contemplated for use in UWB applications.
[0213] For instance, a design wherein a secondary patch is present within the excised area of the slot within the primary patch can be effective.
[0214] Such a slotted supershape is obtained based on the same basic built-up as indicated above, wherein the patch is provided with a slot being an excised area within the patch, which differs in that: [0215] the slot being provided with a secondary patch, [0216] the main patch, also referred to as a primary patch, said slot and said secondary patch all being defined by the polar function:
wherein: [0217] m1=m2=4; [0218] a=b=1; [0219] n3=n2=n1=3;
wherein the polar function ρd(φ) for the primary patch is multiplied by a scaling factor c1=11.2,
wherein the polar function ρd(φ) for the slot is multiplied by a scaling factor c2=8,
wherein the polar function ρd(φ) for the secondary patch is multiplied by a scaling factor c3=5.8.
[0220] In more general terms, the invention includes a slotted supershape as above wherein the values of c1, c2 and c3 may vary from the above values, as long as they the condition: c1>c2>c3.
[0221]
[0222] From the graph it follows that over the range from 4 to 15 GHz, the magnitude of S11 is around or below −10 dB, as required.
[0223] It has been found that an UWB patch antenna according to the above designs may further improve on the bandwidth achieved, when the feeding structure is a microstrip line, which is provided in parallel orientation to the perpendicular symmetry plane of the patch, at a distance from said symmetry plane, said distance being larger than the width of the microstrip line.
[0224] For instance, when using a microstrip line of 0.5 to 2.0 mm width, a distance from the symmetry plane between 2.0 and 5.0 mm, can result in an increase of the bandwidth that can be 10 GHz or more, dependent on the specific base profile of the patch that is used.
Final Remarks
[0225] It will be apparent that the invention is not limited to the exemplary embodiments shown and described here, but that within the scope of the appended claims numerous variants are possible which will be self-evident to the skilled person in this field. In addition, it should be appreciated based on this disclosure that this invention has numerous embodiments including numerous inventive devices, components, aspects, methods, etc. In this document, references to the “the invention” are not intended to apply to all embodiments of the invention.
[0226] This summary is meant to provide an introduction to the concepts that are disclosed within the specification without being an exhaustive list of the many teachings and variations upon those teachings that are provided in the extended discussion within this disclosure. Thus, the contents of this summary should not be used to limit the scope of the claims that follow.
[0227] Inventive concepts are illustrated in a series of examples, some examples showing more than one inventive concept. Individual inventive concepts can be implemented without implementing all details provided in a particular example. It is not necessary to provide examples of every possible combination of the inventive concepts provide below as one of skill in the art will recognize that inventive concepts illustrated in various examples can be combined together in order to address a specific application.
[0228] Other systems, methods, features and advantages of the disclosed teachings will be or will become apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features and advantages be included within the scope of and be protected by the accompanying claims.
[0229] The limitations in the claims (e.g., including that to be later added) are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. For example, in the present disclosure, the term “preferably” is nonexclusive and means “preferably, but not limited to.” In this disclosure and during the prosecution of this application, means-plus-function or step-plus-function limitations will only be employed where for a specific claim limitation all of the following conditions are present in that limitation: a) “means for” or “step for” is expressly recited; b) a corresponding function is expressly recited; and c) structure, material or acts that support that structure are not recited. In this disclosure and during the prosecution of this application, the terminology “present invention” or “invention” can be used as a reference to one or more aspect within the present disclosure. The language present invention or invention should not be improperly interpreted as an identification of criticality, should not be improperly interpreted as applying across all aspects or embodiments (i.e., it should be understood that the present invention has a number of aspects and embodiments), and should not be improperly interpreted as limiting the scope of the application or claims. In this disclosure and during the prosecution of this application, the terminology “embodiment” can be used to describe any aspect, feature, process or step, any combination thereof, and/or any portion thereof, etc. In some examples, various embodiments can include overlapping features. In this disclosure, the following abbreviated terminology can be employed: “e.g.” which means “for example.”