ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE COMPRISING THE SAME (As Amended)

Abstract

The present application relates to an encapsulation film and an organic electronic device including the encapsulation film, and provides an encapsulation film and an organic electronic device which effectively prevents the penetration of moisture or oxygen from the outside into the organic electronic device and also achieves the light diffusion and extraction effects.

Claims

1. An encapsulation film comprising an encapsulating layer which comprises an encapsulation resin, a hygroscopic filler at 1 to 40 parts by weight, and a non-hygroscopic filler at 1 to 10 parts by weight, and has a water vapor transmission rate of 50 g/m.sup.2.Math.day or less in a thickness direction when the encapsulating layer is cured to have a thickness of 100 μm, wherein a light transmittance of the encapsulation film is 80% or more with respect to a visible light region, and a haze of the encapsulation film is 50% or more.

2. The encapsulation film of claim 1, wherein the encapsulating layer comprises a first layer having the hygroscopic filler and a second layer having the non-hygroscopic filler.

3. The encapsulation film of claim 1, wherein an average particle diameter of the hygroscopic filler is in a range of 10 nm to 5 μm.

4. The encapsulation film of claim 1, wherein the hygroscopic filler is one or more selected from the group consisting of a metal oxide, a metal salt, and phosphorus pentoxide.

5. The encapsulation film of claim 4, wherein the hygroscopic filler is one or more selected from the group consisting of CaO, MgO, CaCl.sub.2, CaCO.sub.3, CaZrO.sub.3, CaTiO.sub.3, SiO.sub.2, Ca.sub.2SiO.sub.4, MgCl.sub.2, P.sub.2O.sub.5, Li.sub.2O, Na.sub.2O, BaO, Li.sub.2SO.sub.4, Na.sub.2SO.sub.4, CaSO.sub.4, MgSO.sub.4, CoSO.sub.4, Ga.sub.2(SO.sub.4).sub.3, Ti(SO.sub.4).sub.2, NiSO.sub.4, SrCl.sub.2, YCl.sub.3, CuCl.sub.2, CsF, TaF.sub.5, NbF.sub.5, LiBr, CaBr.sub.2, CeBr.sub.3, SeBr.sub.4, VBr.sub.3, MgBr.sub.2, BaI.sub.2, MgI.sub.2, Ba(ClO.sub.4).sub.2 and Mg(ClO.sub.4).sub.2.

6. The encapsulation film of claim 1, wherein an average particle diameter of the non-hygroscopic filler is in a range of 500 nm to 10 μm.

7. The encapsulation film of claim 1, wherein a refractive index difference between the encapsulation resin and the non-hygroscopic filler is in a range of 0.1 to 1.0.

8. The encapsulation film of claim 1, wherein the non-hygroscopic filler comprises titanium dioxide (TiO.sub.2), alumina (Al.sub.2O.sub.3), silicon nitride (Si.sub.3N.sub.4), aluminum nitride (AlN), gallium nitride (GaN), zinc sulfide (ZnS), cadmium sulfide (CdS), silica, talc, zeolite, titania, zirconia, montmorillonite, or clay.

9. The encapsulation film of claim 1, wherein the encapsulation resin is an acrylic resin, an epoxy resin, a silicone resin, a fluorine resin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, a polyamide resin, or a mixture thereof.

10. The encapsulation film of claim 1, wherein the encapsulating layer further comprises a dispersant.

11. The encapsulation film of claim 10, wherein the dispersant is one or more selected from the group consisting of stearic acid, palmitic acid, oleic acid, linoleic acid, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, oleyl alcohol, octyl glucoside, decyl glucoside and lauryl glucoside.

12. The encapsulation film of claim 10, wherein the dispersant is included at 0.1 to 5 parts by weight with respect to 100 parts by weight of the hygroscopic filler and the non-hygroscopic filler.

13. An organic electronic device comprising: a substrate; an organic electronic element formed on one surface of the substrate; and the encapsulation film according to claim 1, formed on the other surface of the substrate.

14. The organic electronic device of claim 13, wherein the organic electronic element is an organic light emitting diode.

15. The organic electronic device of claim 13, further comprising a moisture barrier layer formed on the organic electronic element.

16. A method of manufacturing an organic electronic device, comprising: forming an organic electronic element on one surface of a substrate; and forming the encapsulation film according to claim 1 on the other surface of the substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0078] FIGS. 1 and 2 are cross-sectional views of an encapsulation film according to an embodiment of the present application; and

[0079] FIG. 3 is a cross-sectional view of an organic electronic device according to the embodiment of the present application.

DESCRIPTION OF REFERENCE NUMERALS

[0080] 1: encapsulation film [0081] 2: base film or release film [0082] 3: encapsulating layer [0083] 3a: first layer [0084] 3b: second layer [0085] 4: hygroscopic filler [0086] 5: non-hygroscopic filler [0087] 21: substrate [0088] 22: cover substrate [0089] 23: organic electronic element

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0090] Hereinafter, the present application will be described in detail with reference to examples according to the present application and comparative examples not according to the present application, but the scope of the present application is not intended to be limited to the following examples.

Example 1

[0091] Silica (refractive index: 1.46) having an average particle diameter of about 1 μm as a non-hygroscopic filler was introduced into methyl ethyl ketone (MEK) as a solvent, such that the concentration of the solid fraction of the silica is 20 wt %, and thereby a non-hygroscopic filler dispersion was prepared. Further, 100 g of CaO (manufactured by Sigma-Aldrich Co. LLC., average particle diameter: about 1 μm, refractive index: 1.83) as a hygroscopic filler was introduced into methyl ethyl ketone (MEK) as a solvent, such that the concentration of the solid fraction of the CaO is 50 wt %, thereby a hygroscopic filler dispersion was prepared.

[0092] 200 g of a silane-modified epoxy resin (KSR-177; manufactured by Kukdo Chemical Co., Ltd.) and 150 g of a phenoxy resin (YP-50; manufactured by Dongdo Hwasung) were introduced into a reactor at room temperature, and diluted with methyl ethyl ketone. After 4 g of imidazole (SHIKOKU CHEMICALS CORPORATION), which is a curing agent, was introduced into the homogenized solution, and stirred at high speed for 1 hour, an encapsulating layer solution was prepared. The hygroscopic filler solution and the non-hygroscopic filler solution which were prepared in advance were introduced and mixed into the solution such that the weight ratio of CaO to silica was 5:5 (CaO:silica), and thereby an encapsulating layer solution was prepared.

[0093] The encapsulating layer solution was applied on a release surface of a release PET, dried at 130° C. for 3 minutes, an encapsulating layer having a thickness of 40 μm was formed, and thereby an encapsulation film was prepared.

Example 2

[0094] Preparation of First Layer Solution

[0095] 100 g of CaO (manufactured by Sigma-Aldrich Co. LLC., average particle diameter: about 1 μm, refractive index: 1.83) as a hygroscopic filler was introduced into methyl ethyl ketone (MEK) as a solvent, such that the concentration of the solid fraction of the CaO is 50 wt %, and thereby a hygroscopic filler dispersion was prepared. Further, 200 g of a silane-modified epoxy resin (KSR-177; manufactured by Kukdo Chemical Co., Ltd.) and 150 g of a phenoxy resin (YP-50; manufactured by Dongdo Hwasung) were introduced into a reactor at room temperature, and diluted with methyl ethyl ketone. After 4 g of imidazole (SHIKOKU CHEMICALS CORPORATION), which is a curing agent, was introduced into the homogenized solution, and stirred at high speed for 1 hour, an encapsulating layer solution was prepared.

[0096] The hygroscopic filler solution which was prepared in advance was introduced and mixed into the encapsulating layer solution such that the weight ratio of the hygroscopic filler to a non-hygroscopic filler which will be described below was 5:5 (CaO:silica), and thereby a first layer solution was prepared.

[0097] Preparation of Second Layer Solution

[0098] Silica (refractive index:1.46) having an average particle diameter of about 1 μm as a non-hygroscopic filler was introduced into methyl ethyl ketone (MEK) as a solvent, such that the concentration of the solid fraction of the silica is 20 wt %, and thereby a non-hygroscopic filler dispersion was prepared. Further, 200 g of a silane-modified epoxy resin (KSR-177; manufactured by Kukdo Chemical Co., Ltd.) and 150 g of a phenoxy resin (YP-50; manufactured by Dongdo Hwasung) were introduced into a reactor at room temperature, and diluted with methyl ethyl ketone. After 4 g of imidazole (SHIKOKU CHEMICALS CORPORATION), which is a curing agent, was introduced into the homogenized solution, and stirred at high speed for 1 hour, an encapsulating layer solution was prepared.

[0099] The non-hygroscopic filler solution which was prepared in advance was introduced and mixed into the encapsulating layer solution such that the weight ratio of the above-described hygroscopic filler to the non-hygroscopic filler was 5:5 (CaO:silica), and thereby a second layer solution was prepared.

[0100] Preparation of Encapsulation Film

[0101] The prepared first layer solution was applied on a release surface of a release PET using a comma coater, dried at 130° C. for 3 minutes, and thereby a first layer having a thickness of 20 μm was formed.

[0102] The prepared second layer solution was applied on a release surface of a release PET using a comma coater, dried at 130° C. for 3 minutes, and thereby a second layer having a thickness of 20 μm was formed.

[0103] The first layer and the second layer were laminated, and thereby an encapsulation film was prepared.

Example 3

[0104] An encapsulation film was prepared in the same manner as in Example 1 except that, in preparing an encapsulating layer solution, 90 g of a butyl rubber (BUTYL 301; manufactured by Lanxess) as an encapsulation resin, 10 g of a hydrogenated DCPD-based tackifier resin (SU-90; manufactured by Kolon Industries, Inc.) as a tackifier, 15 g of tricyclodecane dimethanol diacrylate (M262; manufactured by Miwon Commercial Co., Ltd.) as an active energy ray-polymerizable compound, and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure 651; manufactured by Ciba Specialty Chemicals) as a radical initiator were introduced, and diluted with toluene such that the concentration of a solid fraction is 15 wt %, and thereby an encapsulating layer solution was prepared.

Comparative Example 1

[0105] An encapsulation film was prepared in the same manner as in Example 1 except that, in preparing an encapsulating layer solution, an acrylic pressure-sensitive adhesive which included n-butyl acrylate at 99 parts by weight and 2-hydroxyethyl methacrylate at 1 part by weight, and had a molecular weight (Mw) of about 1,800,000, trimethylolpropane triglycidylether which is a multi-functional epoxy compound, triarylsulfonium hexafluoroantimonate which is a photo-cationic initiator and gamma-glycidoxypropyl trimethoxysilane were mixed, diluted at a suitable concentration, and thereby an encapsulating layer solution was prepared.

Comparative Example 2

[0106] An encapsulation film was prepared in the same manner as in Example 1 except that a hygroscopic filler solution and a non-hygroscopic filler solution were introduced and mixed such that the weight ratio of CaO to silica was 5:15 (CaO:silica), and thereby an encapsulating layer solution was prepared.

[0107] 1. Relative Luminance

[0108] Encapsulation films prepared according to the examples and comparative examples were applied to one surface of glass on which an organic electronic element was formed, and thereby an organic electronic device was prepared. The encapsulation films were laminated such that the encapsulation films were positioned in a direction of light from an organic electronic device. After the laminating, the films passed through an autoclaving process to prepare panels, and relative luminance was measured using a display color analyzer. As the relative luminance, the relative value of organic electronic devices with encapsulation films according to each example and comparative example was measured based on a reference sample with a luminance of 100.

[0109] 2. Moisture Barrier Properties

[0110] An element to be tested was deposited on a glass substrate. The encapsulating layer according to each example and comparative example was laminated with heat on an encapsulating glass substrate, pressed with a pressure of 5 kg/cm.sup.2 while the encapsulating layer was heated at 80° C. on a substrate, and vacuum-compressed for 3 minutes. The vacuum-compressed sample was examined to determine whether dark spots were generated or not under conditions of 85° C., 85% RH, a constant temperature and constant humidity. The sample was observed for 300 hours, and checked as to whether no dark spot was generated (good) or dark spots were generated (failure).

[0111] 3. Light Transmittance and Haze

[0112] With respect to the prepared encapsulation film, light transmittance at a wavelength of 550 nm was measured using a UV-Vis spectrometer, and haze was measured using a haze meter according to a JIS K 7105 standard test method.

TABLE-US-00001 TABLE 1 Relative Moisture Light luminance barrier properties transmittance Haze Reference sample 100 Failure 97 1 Example 1 104 Good 84 75 Example 2 105 Good 83 78 Example 3 103 Good 85 77 Comparative 105 Failure 85 72 Example 1 Comparative 99 Good 79 89 Example 2

[0113] In Table 1, the data of a reference sample is the data of an encapsulation film prepared in the same manner as in Example 1 except that none of a hygroscopic filler and a non-hygroscopic filler was introduced. In the case of Comparative Example 1, optical properties were obtained at a level desired in the embodiment of the present application, but the moisture barrier properties were significantly reduced, and in the case of Comparative Example 2, moisture barrier properties were obtained at a level desired in the embodiment of the present application, but relative luminance decreased.